19-5902; Rev 0; 6/11
EVALUATION KIT AVAILABLE
MAX2042A
SiGe High-Linearity, 1600MHz to 3900MHz
Upconversion/Downconversion Mixer with LO Buffer
General Description
The MAX2042A single, high-linearity upconversion/
downconversion mixer provides up to +33dBm input
IP3, 7.25dB noise figure, and 7.2dB conversion loss for
1600MHz to 3900MHz GSM/EDGE, CDMA, TD-SCDMA,
WCDMA, LTE, TD-LTE, WiMAXK, and MMDS wireless
infrastructure applications. With an ultra-wide 1300MHz
to 4000MHz LO frequency range, the IC can be used in
either low-side or high-side LO injection architectures for
virtually all 1.7GHz to 3.5GHz applications (for a 2.5GHz
variant tuned specifically for low-side LO injection, refer
to the MAX2042).
In addition to offering excellent linearity and noise
performance, the IC also yields a high level of component
integration. This device includes a double-balanced
passive mixer core, an LO buffer, and on-chip baluns
that allow for single-ended RF and LO inputs. The
IC requires a nominal LO drive of 0dBm, and supply
current is typically 140mA at V
CC
= 5.0V or 122mA at
V
CC
= 3.3V.
The MAX2042A is pin compatible with the MAX2042
2000MHz to 3000MHz mixer. The MAX2042A is also pin
similar with the MAX2029/MAX2031/MAX2033 650MHz
to 1550MHz mixers, the MAX2039/MAX2041 1700MHz
to 3000MHz mixers, and the MAX2044 2300MHz to
4000MHz mixer, making the entire family of upconverters/
downconverters ideal for applications where a common
PCB layout is used for multiple frequency bands.
The MAX2042A is available in a compact, 20-pin TQFN
package (5mm x 5mm) with an exposed pad. Electrical
performance is guaranteed over the extended T
C
= -40NC
to +85NC temperature range.
Benefits and Features
S
Wide-Band Coverage
1600MHz to 3900MHz RF Frequency Range
1300MHz to 4000MHz LO Frequency Range
50MHz to 500MHz IF Frequency Range
S
7.2dB Conversion Loss
S
7.25dB Noise Figure
S
High Linearity
+33dBm Input IP3
+21.7dBm Input 1dB Compression Point
72dBc Typical 2LO - 2RF Spurious Rejection at
P
RF
= -10dBm
S
Simple PCB Layout
Integrated LO Buffer
Integrated LO and RF Baluns for Single-Ended
Inputs
S
Low -6dBm to +3dBm LO Drive
S
Pin Compatible with the MAX2042 2000MHz to
3000MHz Mixer
S
Pin-Similar with the MAX2029/MAX2031/MAX2033
650MHz to 1550MHz Mixers, MAX2039/MAX2041
1700MHz to 3000MHz Mixers, and MAX2044
2300MHz to 4000MHz Mixer
S
Single +5.0V or +3.3V Supply
S
External Current-Setting Resistor Provides Option
for Operating Device in Reduced-Power/Reduced-
Performance Mode
Applications
1.8GHz/1.9GHz GSM/EDGE/CDMA Base Stations
2.1GHz WCDMA/LTE Base Stations
2.3GHz TD-SCDMA/TD-LTE Base Stations
2.5GHz WiMAX and LTE Base Stations
2.7GHz MMDS Base Stations
3.5GHz WiMAX and LTE Base Stations
Fixed Broadband Wireless Access
Wireless Local Loop
Private Mobile Radios
Military Systems
Ordering Information
appears at end of data sheet.
For related parts and recommended products to use with this part,
refer to
www.maxim-ic.com/MAX2042A.related.
WiMAX is a trademark of WiMAX Forum.
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Maxim Integrated Products
1
For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642,
or visit Maxim’s website at www.maxim-ic.com.
MAX2042A
SiGe High-Linearity, 1600MHz to 3900MHz
Upconversion/Downconversion Mixer with LO Buffer
TABLE OF CONTENTS
Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Package Thermal Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
5.0V Supply DC Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
3.3V Supply DC Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Recommended AC operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
5.0V Supply, RF = 2000MHz to 2900MHz, HIGH-SIDE LO INJECTION AC ELECTRICAL CHARACTERISTICS
(DOWNCONVERTER OPERATION) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
3.3V Supply, RF = 2000MHz to 2900MHz, HIGH-SIDE LO INJECTION AC ELECTRICAL CHARACTERISTICS
(DOWNCONVERTER OPERATION) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
5.0V Supply, RF = 3100MHz to 3900MHz, LOW-SIDE LO INJECTION AC ELECTRICAL CHARACTERISTICS
(DOWNCONVERTER OPERATION) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
5.0V Supply, RF = 3100MHz to 3900MHz, HIGH-SIDE LO INJECTION AC ELECTRICAL CHARACTERISTICS
(DOWNCONVERTER OPERATION) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
5.0V Supply, RF = 1650MHz to 2250MHz, HIGH-SIDE LO INJECTION AC ELECTRICAL CHARACTERISTICS
(DOWNCONVERTER OPERATION) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
5.0V Supply, RF = 1650MHz to 2250MHz, LOW-SIDE LO INJECTION AC ELECTRICAL CHARACTERISTICS
(DOWNCONVERTER OPERATION) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
5.0V Supply, RF = 2000MHz to 2900MHz, HIGH-SIDE LO INJECTION AC ELECTRICAL CHARACTERISTICS
(UPCONVERTER OPERATION) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
3.3V Supply, RF = 2000MHz to 2900MHz, HIGH-SIDE LO INJECTION AC ELECTRICAL CHARACTERISTICS
(UPCONVERTER OPERATION) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Typical Operating Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
Functional Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
Detailed Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
RF Input and Balun . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
LO Inputs, Buffer, and Balun. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
High-Linearity Mixer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
Differential IF Ports . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
Applications Information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
Input and Output Matching . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
Reduced-Power Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
Layout Considerations. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
Power-Supply Bypassing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
Exposed Pad RF/Thermal Considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
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Maxim Integrated Products
2
MAX2042A
SiGe High-Linearity, 1600MHz to 3900MHz
Upconversion/Downconversion Mixer with LO Buffer
TABLE OF CONTENTS (continued)
Typical Application Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
Chip Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
Package Information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
LIST OF TABLES
Table 1. Downconverter Mode Component Values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
Table 2. Upconverter Mode Component Values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
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Maxim Integrated Products
3
MAX2042A
SiGe High-Linearity, 1600MHz to 3900MHz
Upconversion/Downconversion Mixer with LO Buffer
ABSOLUTE MAXIMUM RATINGS
V
CC
to GND..........................................................-0.3V to +5.5V
IF+, IF-, LOBIAS to GND ......................... -0.3V to (V
CC
+ 0.3V)
RF, LO Input Power ....................................................... +20dBm
IF Input Power (50ω source) ......................................... +18dBm
RF, LO Current (RF and LO are DC shorted to
GND through a balun) ....................................................50mA
Operating Case Temperature Range (Note 1) ....... -40NC to +85NC
Continuous Power Dissipation (Note 2) ..............................5.0W
Junction Temperature .....................................................+150NC
Storage Temperature Range............................ -65NC to +150NC
Lead Temperature (soldering 10s) .................................+300NC
Soldering Temperature (reflow) ......................................+260NC
Note 1:
T
C
is the temperature on the exposed pad of the package. T
A
is the ambient temperature of the device and PCB.
Note 2:
Based on junction temperature T
J
= T
C
+ (B
JC
x V
CC
x I
CC
). This formula can be used when the temperature of the
exposed pad is known while the device is soldered down to a PCB. See the
Applications Information
section for details.
The junction temperature must not exceed +150NC.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera-
tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
PACKAGE THERMAL CHARACTERISTICS
TQFN
Junction-to-Ambient
Thermal Resistance
B
JA
(Notes 3, 4) ....................... +38°C/W
Junction-to-Case
Thermal Resistance
B
JC
(Notes 2, 4) ....................... +13°C/W
Note 3:
Junction temperature T
J
= T
A
+ (B
JA
x V
CC
x I
CC
). This formula can be used when the ambient temperature of the PCB is
known. The junction temperature must not exceed +150NC.
Note 4:
Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to
www.maxim-ic.com/thermal-tutorial.
5.0V SUPPLY DC ELECTRICAL CHARACTERISTICS
(Typical
Application Circuit,
V
CC
= 4.75V to 5.25V, no input AC signals. T
C
= -40NC to +85NC, unless otherwise noted. Typical values
are at V
CC
= 5.0V, T
C
= +25NC.)
PARAMETER
Supply Voltage
Supply Current
SYMBOL
V
CC
I
CC
CONDITIONS
MIN
4.75
TYP
5
140
MAX
5.25
162
UNITS
V
mA
3.3V SUPPLY DC ELECTRICAL CHARACTERISTICS
(Typical
Application Circuit,
V
CC
= 3.0V to 3.6V, no input AC applied. T
C
= -40NC to +85NC, unless otherwise noted. Typical values
are at V
CC
= 3.3V, T
C
= +25NC.)
PARAMETER
Supply Voltage
Supply Current
SYMBOL
V
CC
I
CC
CONDITIONS
MIN
3.0
TYP
3.3
122
MAX
3.6
UNITS
V
mA
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Maxim Integrated Products
4
MAX2042A
SiGe High-Linearity, 1600MHz to 3900MHz
Upconversion/Downconversion Mixer with LO Buffer
RECOMMENDED AC OPERATING CONDITIONS
PARAMETER
RF Frequency Range Without
Tuning
RF Frequency Range With
Low-Band Tuning
RF Frequency Range With
High-Band Tuning
LO Frequency
SYMBOL
f
RF1
f
RF2
f
RF3
f
LO
CONDITIONS
Typical Application Circuit
with C1 = 8.2pF
(Table 1) (Notes 5, 6)
Typical Application Circuit
with C1 = 1.8pF,
L1 = 12nH (Table 1) (Notes 5, 6)
Typical Application Circuit
with C1 = 1.5pF
(Table 1) (Notes 5, 6)
(Note 5, 6)
Using M/A-Com MABACT0069 1:1
transformer as defined in the
Typical
Application Circuit,
IF matching components
affect the IF frequency range (Notes 5, 6)
MIN
2000
1600
3000
1300
TYP
MAX
2900
2000
3900
4000
UNITS
MHz
MHz
MHz
MHz
IF Frequency
f
IF
50
500
MHz
LO Drive
P
LO
-6
0
+3
dBm
5.0V Supply, RF = 2000MHz to 2900MHz, HIGH-SIDE LO INJECTION AC ELECTRICAL
CHARACTERISTICS (DOWNCONVERTER OPERATION)
(Typical
Application Circuit
with tuning elements outlined in
Table 1,
V
CC
= 4.75V to 5.25V, RF and LO ports are driven from
50I sources, P
LO
= -6dBm to +3dBm, P
RF
= 0dBm, f
RF
= 2000MHz to 2900MHz, f
LO
= 2300MHz to 3200MHz, f
IF
= 300MHz,
f
RF
< f
LO
, T
C
= -40NC to +85NC. Typical values are for T
C
= +25NC, V
CC
= 5.0V, P
LO
= 0dBm, f
RF
= 2600MHz, f
LO
= 2900MHz,
f
IF
= 300MHz.) (Note 7)
PARAMETER
Small-Signal Conversion Loss
SYMBOL
L
C
CONDITIONS
f
RF
= 2600MHz, f
LO
= 2900MHz
f
RF
= 2900MHz, f
LO
= 3200MHz (Note 8)
f
RF
= 2010MHz to 2025MHz
f
RF
= 2305MHz to 2360MHz
Loss Variation vs. Frequency
DL
C
f
RF
= 2500MHz to 2570MHz
f
RF
= 2570MHz to 2620MHz
f
RF
= 2500MHz to 2690MHz
f
RF
= 2700MHz to 2900MHz
Conversion Loss Temperature
Coefficient
Single Sideband Noise Figure
Noise Figure Temperature
Coefficient
Noise Figure Under Blocking
TC
CL
NF
SSB
TC
NF
NF
Blocking
T
C
= -40NC to +85NC
No blockers present
f
RF
= 2600MHz, single sideband,
no blockers present, T
C
= -40NC to +85NC
+8dBm blocker tone applied to RF port,
f
RF
= 2600MHz, f
LO
= 2900MHz,
f
BLOCKER
= 2400MHz (Note 9)
MIN
TYP
7.2
7.8
Q0.05
Q0.05
Q0.05
Q0.05
Q0.13
Q0.02
0.007
7.25
0.022
dB
dB
dB
dB
dB
dB
dB/NC
dB
dB/NC
MAX
UNITS
18
dB
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Maxim Integrated Products
5
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