Fast Page DRAM, 256KX4, 80ns, CMOS, PZIP20
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | FUJITSU(富士通) |
零件包装代码 | ZIP |
包装说明 | ZIP, ZIP20,.1 |
针数 | 20 |
Reach Compliance Code | unknown |
最长访问时间 | 80 ns |
I/O 类型 | COMMON |
JESD-30 代码 | R-PZIP-T20 |
JESD-609代码 | e0 |
内存密度 | 1048576 bit |
内存集成电路类型 | FAST PAGE DRAM |
内存宽度 | 4 |
端子数量 | 20 |
字数 | 262144 words |
字数代码 | 256000 |
最高工作温度 | 70 °C |
最低工作温度 | |
组织 | 256KX4 |
输出特性 | 3-STATE |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | ZIP |
封装等效代码 | ZIP20,.1 |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE |
电源 | 5 V |
认证状态 | Not Qualified |
刷新周期 | 512 |
最大待机电流 | 0.00025 A |
最大压摆率 | 0.065 mA |
标称供电电压 (Vsup) | 5 V |
表面贴装 | NO |
技术 | CMOS |
温度等级 | COMMERCIAL |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE |
端子节距 | 1.27 mm |
端子位置 | ZIG-ZAG |
MB81C4256-80LPSZ | MB81C4256-12LPJ | MB81C4256-80P | MB81C4256-80PJ | MB81C4256-70LP | MB81C4256-70LPSZ | MB81C4256-10PSZ | |
---|---|---|---|---|---|---|---|
描述 | Fast Page DRAM, 256KX4, 80ns, CMOS, PZIP20 | Fast Page DRAM, 256KX4, 120ns, CMOS, PDSO20 | Fast Page DRAM, 256KX4, 80ns, CMOS, PDIP20 | Fast Page DRAM, 256KX4, 80ns, CMOS, PDSO20 | Fast Page DRAM, 256KX4, 70ns, CMOS, PDIP20 | Fast Page DRAM, 256KX4, 70ns, CMOS, PZIP20, PLASTIC, ZIP-20 | Fast Page DRAM, 256KX4, 100ns, CMOS, PZIP20 |
包装说明 | ZIP, ZIP20,.1 | SOJ, SOJ20/26,.34 | DIP, DIP20,.3 | SOJ, SOJ20/26,.34 | DIP, DIP20,.3 | ZIP, | ZIP, ZIP20,.1 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
最长访问时间 | 80 ns | 120 ns | 80 ns | 80 ns | 70 ns | 70 ns | 100 ns |
JESD-30 代码 | R-PZIP-T20 | R-PDSO-J20 | R-PDIP-T20 | R-PDSO-J20 | R-PDIP-T20 | R-PZIP-T20 | R-PZIP-T20 |
内存密度 | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit |
内存集成电路类型 | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM |
内存宽度 | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
端子数量 | 20 | 20 | 20 | 20 | 20 | 20 | 20 |
字数 | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words |
字数代码 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 |
最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
组织 | 256KX4 | 256KX4 | 256KX4 | 256KX4 | 256KX4 | 256KX4 | 256KX4 |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | ZIP | SOJ | DIP | SOJ | DIP | ZIP | ZIP |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | IN-LINE | SMALL OUTLINE | IN-LINE | SMALL OUTLINE | IN-LINE | IN-LINE | IN-LINE |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
刷新周期 | 512 | 512 | 512 | 512 | 512 | 512 | 512 |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | NO | YES | NO | YES | NO | NO | NO |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子形式 | THROUGH-HOLE | J BEND | THROUGH-HOLE | J BEND | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
端子节距 | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm |
端子位置 | ZIG-ZAG | DUAL | DUAL | DUAL | DUAL | ZIG-ZAG | ZIG-ZAG |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | - | 不符合 |
零件包装代码 | ZIP | LCC | DIP | LCC | DIP | - | ZIP |
针数 | 20 | 26/20 | 20 | 26/20 | 20 | - | 20 |
I/O 类型 | COMMON | COMMON | COMMON | COMMON | COMMON | - | COMMON |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | - | e0 |
输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | - | 3-STATE |
封装等效代码 | ZIP20,.1 | SOJ20/26,.34 | DIP20,.3 | SOJ20/26,.34 | DIP20,.3 | - | ZIP20,.1 |
电源 | 5 V | 5 V | 5 V | 5 V | 5 V | - | 5 V |
最大待机电流 | 0.00025 A | 0.00025 A | 0.001 A | 0.001 A | 0.00025 A | - | 0.001 A |
最大压摆率 | 0.065 mA | 0.047 mA | 0.07 mA | 0.07 mA | 0.072 mA | - | 0.06 mA |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) |
Base Number Matches | - | 1 | 1 | 1 | 1 | - | - |
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