Comparator, 2 Func, 7000uV Offset-Max, BIPolar, CDIP16, CERAMIC, DIP-16
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Dynex |
| 零件包装代码 | DIP |
| 包装说明 | DIP, DIP16,.3 |
| 针数 | 16 |
| Reach Compliance Code | unknown |
| ECCN代码 | EAR99 |
| 放大器类型 | COMPARATOR |
| 最大平均偏置电流 (IIB) | 30 µA |
| 最大输入失调电压 | 7000 µV |
| JESD-30 代码 | R-GDIP-T16 |
| JESD-609代码 | e0 |
| 负供电电压上限 | -6 V |
| 标称负供电电压 (Vsup) | -5.2 V |
| 功能数量 | 2 |
| 端子数量 | 16 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 输出类型 | OPEN-EMITTER |
| 封装主体材料 | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP |
| 封装等效代码 | DIP16,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 电源 | 5,-5.2 V |
| 认证状态 | Not Qualified |
| 筛选级别 | 38535Q/M;38534H;883B |
| 供电电压上限 | 6 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | BIPOLAR |
| 温度等级 | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| SP9687ACDG | SP9687BBDG | SP9687DG | SP9687MP | |
|---|---|---|---|---|
| 描述 | Comparator, 2 Func, 7000uV Offset-Max, BIPolar, CDIP16, CERAMIC, DIP-16 | Comparator, 2 Func, 7000uV Offset-Max, BIPolar, CDIP16, CERAMIC, DIP-16 | Comparator, 2 Func, 7000uV Offset-Max, BIPolar, CDIP16, CERAMIC, DIP-16 | Comparator, 2 Func, 7000uV Offset-Max, BIPolar, PDSO16, PLASTIC, 16 PIN |
| 厂商名称 | Dynex | Dynex | Dynex | Dynex |
| 零件包装代码 | DIP | DIP | DIP | SOIC |
| 包装说明 | DIP, DIP16,.3 | , | DIP, DIP16,.3 | SOP, SOP16,.25 |
| 针数 | 16 | 16 | 16 | 16 |
| Reach Compliance Code | unknown | unknown | unknown | unknown |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 |
| 放大器类型 | COMPARATOR | COMPARATOR | COMPARATOR | COMPARATOR |
| 最大平均偏置电流 (IIB) | 30 µA | 30 µA | 30 µA | 30 µA |
| 最大输入失调电压 | 7000 µV | 7000 µV | 7000 µV | 7000 µV |
| JESD-30 代码 | R-GDIP-T16 | R-GDIP-T16 | R-GDIP-T16 | R-PDSO-G16 |
| 负供电电压上限 | -6 V | -6 V | -6 V | -6 V |
| 标称负供电电压 (Vsup) | -5.2 V | -5.2 V | -5.2 V | -5.2 V |
| 功能数量 | 2 | 2 | 2 | 2 |
| 端子数量 | 16 | 16 | 16 | 16 |
| 最高工作温度 | 125 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -55 °C | -30 °C | -30 °C | -30 °C |
| 输出类型 | OPEN-EMITTER | OPEN-EMITTER | OPEN-EMITTER | OPEN-EMITTER |
| 封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | IN-LINE | IN-LINE | SMALL OUTLINE |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 供电电压上限 | 6 V | 6 V | 6 V | 6 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | NO | NO | YES |
| 技术 | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR |
| 温度等级 | MILITARY | OTHER | OTHER | OTHER |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | GULL WING |
| 端子位置 | DUAL | DUAL | DUAL | DUAL |
| 是否Rohs认证 | 不符合 | - | 不符合 | 不符合 |
| JESD-609代码 | e0 | - | e0 | e0 |
| 封装代码 | DIP | - | DIP | SOP |
| 封装等效代码 | DIP16,.3 | - | DIP16,.3 | SOP16,.25 |
| 电源 | 5,-5.2 V | - | 5,-5.2 V | 5,-5.2 V |
| 端子面层 | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子节距 | 2.54 mm | - | 2.54 mm | 1.27 mm |
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