1.0 to 1.6 1.6 to 2.5 2.5 to 4.0 4.0 to 6.3 6.3 to 10 10 to 16
40 to 63 63 to 100 100 to 160 160 to 250 250 to 400 400 to 630 630 to 1000 1000 to 1600
0.55
SML-A12V8T
SML-A12U8T
SML-A12UT
※
Orange (D)
Package
size(mm)
Side View 16115
Chip LEDs
Luminous
Intensity
(mcd)
Height(mm)
G
H
J
K
L
M
N
P
Q
R
S
T
U
V
（Ta=25˚C,
I
F
＝20mA）
W
X
1.0 to 1.6 1.6 to 2.5 2.5 to 4.0 4.0 to 6.3 6.3 to 10 10 to 16 16 to 25 25 to 40 40 to 63 63 to 100 100 to 160 160 to 250 250 to 400 400 to 630 630 to 1000 1000 to 1600
SML-A12D8T
SML-A12DT
※
0.55
Yellow (Y)
（Ta=25˚C,
I
F
＝20mA）
Luminous
G
H
J
K
L
M
N
P
Q
R
S
T
U
V
W
X
Intensity
Package
size(mm)
Height(mm) (mcd)
1.0 to 1.6 1.6 to 2.5 2.5 to 4.0 4.0 to 6.3 6.3 to 10 10 to 16 16 to 25 25 to 40 40 to 63 63 to 100 100 to 160 160 to 250 250 to 400 400 to 630 630 to 1000 1000 to 1600
0.55
SML-A12Y8T
SML-A12WT
※
Side View
Chip LEDs 16115
Green (M, P)
Package
size(mm)
Side View
Chip LEDs 16115
Luminous
Intensity
(mcd)
Height(mm)
G
H
J
K
L
M
N
P
Q
R
S
T
U
V
（Ta=25˚C,
I
F
＝20mA）
W
X
1.0 to 1.6 1.6 to 2.5 2.5 to 4.0 4.0 to 6.3 6.3 to 10 10 to 16 16 to 25 25 to 40 40 to 63 63 to 100 100 to 160 160 to 250 250 to 400 400 to 630 630 to 1000 1000 to 1600
SML-A12MT
※
SML-A12M8T
SML-A12P8T
0.55
Blue (B)
Luminous
G
H
J
K
L
Intensity
Package
size(mm)
Height(mm) (mcd)
0.9 to 1.4 1.4 to 2.2 2.2 to 3.6 3.6 to 5.6 5.6 to 9.0
M
9 to 14
N
14 to 22
P
22 to 36
Q
36 to 56
（Ta=25˚C,
I
F
＝20mA）
R
S
T
U
V
W
56 to 90 90 to 140 140 to 220 220 to 360 360 to 560 560 to 900
SMLA13BDT
Side View
Chip LEDs 16115
0.55
SMLA12BC7T
※2
White (WB)
（Ta=25˚C,
I
F
＝20mA）
Luminous
P
Q
R
S
T
U
V
W
X1
X2
Y1
Y2
Z1
Intensity
Package
size(mm)
Height(mm) (mcd)
25 to 36 36 to 56 56 to 90 90 to 140 140 to 220 220 to 360 360 to 560 560 to 900 900 to 1100 1100 to 1400 1400 to 1800 1800 to 2200 2200 to 2800
0.55
SMLA12WBC7W
※2
SMLA13WBDW
※1
※Brightness
on specification sheet include tolerance of within
±
10%.
※1:I
F
＝10mA ※2:I
F
＝5mA
Side View
Chip LEDs 16115
Part No. Construction
∗
“−” will be taken out for emitting color
W/B/E series.
Dice classification code
(Special classification code) Chromaticity rank(for white LED)
S M L
Series name
A 1 2
Package type
Chip Type
U 8 T
Emitting Color
Resin Color
T 8 6
Taping Specifications
J
P
Rank sign (Brightness Rank)
∗
2
3
High Brightness Type
Ultra High Brightness Type
V
Red:630nm
T
W
Transparent Colorless
MilkyWhite
T86
Cathode at sprocket hole side
T87
Reverse of T86
1
For white LED, cathode at sprocket hole side
U
Red:620(624)nm
D
Orange:605(606)nm
Y
Yellow:587(590)nm
W
Yellow:590nm
M
Yellowish-Green:572nm
B
P
Green:560nm
Blue:470nm
WB
White
∗
Concerning the Brightness rank
• Please refer to the rank chart above for luminous intensity classification.
• Part name is individual for each rank.
• When shipped as sample, the part name will be a representative part name.
General products are free of ranks. Please contact sales if rank appointment is needed.
Packing Specification
ROHM LED products are being shipped with desiccant (silica gel) concluded in moisture-proof bags.
Pasting the moisture sensitive label on the outer surface of the moisture-proof bags or enclosing the humidity indication card inside the bag is available upon request.
Please contact the nearest sales office or distributer if necessary.
在全球半导体产业因景气不佳而纷传并购、整合之际，两大IT巨头三星、IBM日前却双双宣布，将强化半导体产业投资。 三星电子本周一宣布，已向韩国证券交易所提交一份申请文件，打算2008年投下10.5亿美元，用于升级内存芯片生产线、改进技术工艺，从而提高产能并降低成本。无独有偶。本周二IBM公司宣布，未来3年将投资10亿美元，用于扩充位于纽约州 East Fishkill 的半导体工厂，以消...[详细]
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