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TSM4N60CIC0G

产品描述600V N-Channel Power MOSFET
产品类别分立半导体    晶体管   
文件大小343KB,共11页
制造商Taiwan Semiconductor
官网地址http://www.taiwansemi.com/
下载文档 详细参数 选型对比 全文预览

TSM4N60CIC0G概述

600V N-Channel Power MOSFET

TSM4N60CIC0G规格参数

参数名称属性值
厂商名称Taiwan Semiconductor
包装说明FLANGE MOUNT, R-PSFM-T3
Reach Compliance Codecompli
雪崩能效等级(Eas)120 mJ
外壳连接ISOLATED
配置SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压600 V
最大漏极电流 (ID)4 A
最大漏源导通电阻2.5 Ω
FET 技术METAL-OXIDE SEMICONDUCTOR
JEDEC-95代码TO-220AB
JESD-30 代码R-PSFM-T3
元件数量1
端子数量3
工作模式ENHANCEMENT MODE
封装主体材料PLASTIC/EPOXY
封装形状RECTANGULAR
封装形式FLANGE MOUNT
极性/信道类型N-CHANNEL
最大脉冲漏极电流 (IDM)16 A
表面贴装NO
端子形式THROUGH-HOLE
端子位置SINGLE
晶体管应用SWITCHING
晶体管元件材料SILICON

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TSM4N60
600V N-Channel Power MOSFET
TO-220
ITO-220
TO-251
(IPAK)
TO-252
(DPAK)
Pin Definition:
1. Gate
2. Drain
3. Source
PRODUCT SUMMARY
V
DS
(V)
600
R
DS(on)
( )
2.5 @ V
GS
=10V
I
D
(A)
2
General Description
The TSM4N60 is produced using advanced planar stripe, DMOS technology. This latest technology has been
especially designed to minimize on-state resistance, have a high rugged avalanche characteristics. There
devices are well suited for high efficiency switch mode power supplies, active power factor correction, electronic
lamp ballasts base on half bridge topology.
Features
Robust high voltage termination
Avalanche energy specified
Diode is characterized for use in bridge circuits
Source to Drain diode recovery time comparable to a
discrete fast recovery diode.
Block Diagram
Ordering Information
Part No.
Package
Packing
50pcs / Tube
50pcs / Tube
50pcs / Tube
50pcs / Tube
75pcs / Tube
75pcs / Tube
2.5Kpcs / 13” Reel
2.5Kpcs / 13” Reel
TSM4N60CZ C0
TO-220
TSM4N60CZ C0G
TO-220
TSM4N60CI C0
ITO-220
TSM4N60CI C0G
ITO-220
TSM4N60CH C5
TO-251
TSM4N60CH C5G
TO-251
TSM4N60CP RO
TO-252
TSM4N60CP ROG
TO-252
Note: “G” denotes for Halogen Free
N-Channel MOSFET
Absolute Maximum Rating
(Ta = 25
o
C unless otherwise noted)
Parameter
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current
Pulsed Drain Current
Single Pulse Drain to Source Avalanche Energy (note c)
Avalanche Current, Repetitive or Not-Repetitive (note d)
Peak Diode Recovery dv/dt (note e)
Total Power Dissipation
@T
C
= 25 C
Operating Junction Temperature
Operating Junction and Storage Temperature Range
o
Symbol
V
DS
V
GS
I
D
I
DM
EAS
IAR
dv/dt
TO-220 / TO-251 / TO-252
ITO-220
P
TOT
T
J
T
J
, T
STG
Limit
600
±30
4
16
120
10
4.5
70
25
+150
-55 to +150
Unit
V
V
A
A
mJ
mJ
V/ns
W
o
o
C
C
1/11
Version: D10

TSM4N60CIC0G相似产品对比

TSM4N60CIC0G TSM4N60CHC5G TSM4N60CPROG TSM4N60CZC0G TSM4N60_10
描述 600V N-Channel Power MOSFET 600V N-Channel Power MOSFET 600V N-Channel Power MOSFET 600V N-Channel Power MOSFET 600V N-Channel Power MOSFET
厂商名称 Taiwan Semiconductor Taiwan Semiconductor Taiwan Semiconductor Taiwan Semiconductor -
包装说明 FLANGE MOUNT, R-PSFM-T3 IN-LINE, R-PSIP-T3 SMALL OUTLINE, R-PSSO-G2 FLANGE MOUNT, R-PSFM-T3 -
Reach Compliance Code compli compli compli compli -
雪崩能效等级(Eas) 120 mJ 120 mJ 120 mJ 120 mJ -
配置 SINGLE WITH BUILT-IN DIODE SINGLE WITH BUILT-IN DIODE SINGLE WITH BUILT-IN DIODE SINGLE WITH BUILT-IN DIODE -
最小漏源击穿电压 600 V 600 V 600 V 600 V -
最大漏极电流 (ID) 4 A 4 A 4 A 4 A -
最大漏源导通电阻 2.5 Ω 2.5 Ω 2.5 Ω 2.5 Ω -
FET 技术 METAL-OXIDE SEMICONDUCTOR METAL-OXIDE SEMICONDUCTOR METAL-OXIDE SEMICONDUCTOR METAL-OXIDE SEMICONDUCTOR -
JEDEC-95代码 TO-220AB TO-251 TO-252 TO-220AB -
JESD-30 代码 R-PSFM-T3 R-PSIP-T3 R-PSSO-G2 R-PSFM-T3 -
元件数量 1 1 1 1 -
端子数量 3 3 2 3 -
工作模式 ENHANCEMENT MODE ENHANCEMENT MODE ENHANCEMENT MODE ENHANCEMENT MODE -
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY -
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR -
封装形式 FLANGE MOUNT IN-LINE SMALL OUTLINE FLANGE MOUNT -
极性/信道类型 N-CHANNEL N-CHANNEL N-CHANNEL N-CHANNEL -
最大脉冲漏极电流 (IDM) 16 A 16 A 16 A 16 A -
表面贴装 NO NO YES NO -
端子形式 THROUGH-HOLE THROUGH-HOLE GULL WING THROUGH-HOLE -
端子位置 SINGLE SINGLE SINGLE SINGLE -
晶体管应用 SWITCHING SWITCHING SWITCHING SWITCHING -
晶体管元件材料 SILICON SILICON SILICON SILICON -

 
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