Digital Signal Processors & Controllers - DSP, DSC C5515 Value Line
参数名称 | 属性值 |
厂商名称 | Texas Instruments(德州仪器) |
零件包装代码 | BGA |
包装说明 | 12 X 12 MM, PLASTIC, BGA-144 |
针数 | 144 |
Reach Compliance Code | unknow |
其他特性 | IT ALSO OPERATES AT 1.05 V AT 50 MHZ |
地址总线宽度 | |
桶式移位器 | NO |
位大小 | 16 |
边界扫描 | YES |
最大时钟频率 | 12 MHz |
外部数据总线宽度 | |
格式 | FIXED POINT |
内部总线架构 | MULTIPLE |
JESD-30 代码 | S-PBGA-B144 |
长度 | 12 mm |
低功率模式 | YES |
端子数量 | 144 |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | BGA |
封装等效代码 | BGA144,14X14,32 |
封装形状 | SQUARE |
封装形式 | GRID ARRAY |
电源 | 1.05/1.3,1.8/3.3 V |
认证状态 | Not Qualified |
RAM(字数) | 163840 |
座面最大高度 | 1.4 mm |
最大供电电压 | 1.43 V |
最小供电电压 | 1.24 V |
标称供电电压 | 1.3 V |
表面贴装 | YES |
技术 | CMOS |
端子形式 | BALL |
端子节距 | 0.8 mm |
端子位置 | BOTTOM |
宽度 | 12 mm |
uPs/uCs/外围集成电路类型 | DIGITAL SIGNAL PROCESSOR, OTHER |
TMX320C5535AZHH10 | TMS320C5532AZHH10 | TMS320C5532AZHHA05 | TMS320C5535AZHH10 | |
---|---|---|---|---|
描述 | Digital Signal Processors & Controllers - DSP, DSC C5515 Value Line | Fixed-Point Digital Signal Processor 144-BGA MICROSTAR -10 to 70 | Fixed-Point Digital Signal Processor 144-BGA MICROSTAR -40 to 85 | Fixed-Point Digital Signal Processor 144-BGA MICROSTAR -10 to 70 |
厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
零件包装代码 | BGA | BGA | BGA | BGA |
包装说明 | 12 X 12 MM, PLASTIC, BGA-144 | BGA-144 | BGA-144 | BGA-144 |
针数 | 144 | 144 | 144 | 144 |
Reach Compliance Code | unknow | compli | compliant | compliant |
桶式移位器 | NO | NO | NO | NO |
位大小 | 16 | 16 | 16 | 16 |
边界扫描 | YES | YES | YES | YES |
最大时钟频率 | 12 MHz | 12 MHz | 12 MHz | 12 MHz |
格式 | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT |
内部总线架构 | MULTIPLE | MULTIPLE | MULTIPLE | MULTIPLE |
JESD-30 代码 | S-PBGA-B144 | S-PBGA-B144 | S-PBGA-B144 | S-PBGA-B144 |
长度 | 12 mm | 12 mm | 12 mm | 12 mm |
低功率模式 | YES | YES | YES | YES |
端子数量 | 144 | 144 | 144 | 144 |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | BGA | BGA | BGA | BGA |
封装等效代码 | BGA144,14X14,32 | BGA144,14X14,32 | BGA144,14X14,32 | BGA144,14X14,32 |
封装形状 | SQUARE | SQUARE | SQUARE | SQUARE |
封装形式 | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY |
电源 | 1.05/1.3,1.8/3.3 V | 1.05/1.3,1.8/3.3 V | 1.05,1.8/3.3 V | 1.05/1.3,1.8/3.3 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
RAM(字数) | 163840 | 32768 | 32768 | 163840 |
座面最大高度 | 1.4 mm | 1.4 mm | 1.4 mm | 1.4 mm |
最大供电电压 | 1.43 V | 1.43 V | 1.15 V | 1.43 V |
最小供电电压 | 1.24 V | 1.24 V | 0.998 V | 1.24 V |
标称供电电压 | 1.3 V | 1.3 V | 1.05 V | 1.3 V |
表面贴装 | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS |
端子形式 | BALL | BALL | BALL | BALL |
端子节距 | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm |
端子位置 | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
宽度 | 12 mm | 12 mm | 12 mm | 12 mm |
uPs/uCs/外围集成电路类型 | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER |
其他特性 | IT ALSO OPERATES AT 1.05 V AT 50 MHZ | IT ALSO OPERATES AT 1.05 V AT 50 MHZ | - | IT ALSO OPERATES AT 1.05 V AT 50 MHZ |
Brand Name | - | Texas Instruments | Texas Instruments | Texas Instruments |
是否无铅 | - | 不含铅 | 不含铅 | 不含铅 |
是否Rohs认证 | - | 符合 | 符合 | 符合 |
ECCN代码 | - | 3A991.A.2 | 3A991.A.2 | 3A991.A.2 |
Factory Lead Time | - | 1 week | 6 weeks | 12 weeks |
集成缓存 | - | NO | NO | NO |
JESD-609代码 | - | e1 | e1 | e1 |
湿度敏感等级 | - | 3 | 3 | 3 |
DMA 通道数量 | - | 16 | 16 | 16 |
外部中断装置数量 | - | 2 | 2 | 2 |
计时器数量 | - | 4 | 4 | 4 |
片上数据RAM宽度 | - | 8 | 8 | 8 |
片上程序ROM宽度 | - | 8 | 8 | 8 |
最高工作温度 | - | 70 °C | 85 °C | 70 °C |
最低工作温度 | - | -10 °C | -40 °C | -10 °C |
峰值回流温度(摄氏度) | - | 260 | 260 | 260 |
ROM可编程性 | - | MROM | MROM | MROM |
温度等级 | - | COMMERCIAL | INDUSTRIAL | COMMERCIAL |
端子面层 | - | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) |
处于峰值回流温度下的最长时间 | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
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