Single-Rail ARINC 717 Protocol IC with SPI Interface
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | Holt Integrated Circuits |
零件包装代码 | QFN |
包装说明 | HVQCCN, |
针数 | 44 |
Reach Compliance Code | unknow |
ECCN代码 | 7A994 |
地址总线宽度 | |
边界扫描 | NO |
最大时钟频率 | 24.024 MHz |
通信协议 | SYNC, BYTE |
最大数据传输速率 | 0.01171875 MBps |
外部数据总线宽度 | |
JESD-30 代码 | S-PQCC-N44 |
JESD-609代码 | e0 |
长度 | 7 mm |
低功率模式 | NO |
湿度敏感等级 | 3 |
串行 I/O 数 | 1 |
端子数量 | 44 |
最高工作温度 | 125 °C |
最低工作温度 | -55 °C |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | HVQCCN |
封装形状 | SQUARE |
封装形式 | CHIP CARRIER |
峰值回流温度(摄氏度) | 240 |
认证状态 | Not Qualified |
座面最大高度 | 1 mm |
最大供电电压 | 3.45 V |
最小供电电压 | 3.15 V |
标称供电电压 | 3.3 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | MILITARY |
端子面层 | TIN LEAD |
端子形式 | NO LEAD |
端子节距 | 0.5 mm |
端子位置 | QUAD |
处于峰值回流温度下的最长时间 | 30 |
宽度 | 7 mm |
uPs/uCs/外围集成电路类型 | SERIAL IO/COMMUNICATION CONTROLLER, MULTI PROTOCOL |
这份文档是关于HI-3717芯片的数据手册,由Holt Integrated Circuits公司生产。HI-3717是一款专为航空电子领域设计的集成电路,用于将ARINC 717兼容总线与支持串行外设接口(SPI)的微控制器进行接口。以下是一些值得关注的技术信息:
功能特点:
封装选项:
电源要求:
SPI接口:
同步检测:
FIFO状态指示:
温度范围:
应用领域:
电气特性:
订购信息:
绝对最大额定值:
修订历史:
HI-3717PCM | HI-3717PCI | HI-3717PCIF | HI-3717PQI | HI-3717PQIF | HI-3717PQM | HI-3717PQMF | HI-3717PQT | |
---|---|---|---|---|---|---|---|---|
描述 | Single-Rail ARINC 717 Protocol IC with SPI Interface | Single-Rail ARINC 717 Protocol IC with SPI Interface | Single-Rail ARINC 717 Protocol IC with SPI Interface | Single-Rail ARINC 717 Protocol IC with SPI Interface | Single-Rail ARINC 717 Protocol IC with SPI Interface | Single-Rail ARINC 717 Protocol IC with SPI Interface | Single-Rail ARINC 717 Protocol IC with SPI Interface | Single-Rail ARINC 717 Protocol IC with SPI Interface |
是否Rohs认证 | 不符合 | - | - | 不符合 | 符合 | 不符合 | 符合 | 不符合 |
厂商名称 | Holt Integrated Circuits | - | - | Holt Integrated Circuits | Holt Integrated Circuits | Holt Integrated Circuits | Holt Integrated Circuits | Holt Integrated Circuits |
零件包装代码 | QFN | - | - | QFP | QFP | QFP | QFP | QFP |
包装说明 | HVQCCN, | - | - | LQFP, | LQFP, | LQFP, | LQFP, | LQFP, |
针数 | 44 | - | - | 44 | 44 | 44 | 44 | 44 |
Reach Compliance Code | unknow | - | - | unknown | compli | unknown | compli | unknow |
ECCN代码 | 7A994 | - | - | 7A994 | 7A994 | 7A994 | 7A994 | 7A994 |
边界扫描 | NO | - | - | NO | NO | NO | NO | NO |
最大时钟频率 | 24.024 MHz | - | - | 24.024 MHz | 24.024 MHz | 24.024 MHz | 24.024 MHz | 24.024 MHz |
通信协议 | SYNC, BYTE | - | - | SYNC, BYTE | SYNC, BYTE | SYNC, BYTE | SYNC, BYTE | SYNC, BYTE |
最大数据传输速率 | 0.01171875 MBps | - | - | 0.01171875 MBps | 0.01171875 MBps | 0.01171875 MBps | 0.01171875 MBps | 0.01171875 MBps |
JESD-30 代码 | S-PQCC-N44 | - | - | S-PQFP-G44 | S-PQFP-G44 | S-PQFP-G44 | S-PQFP-G44 | S-PQFP-G44 |
JESD-609代码 | e0 | - | - | e0 | e3 | e0 | e3 | e0 |
长度 | 7 mm | - | - | 10 mm | 10 mm | 10 mm | 10 mm | 10 mm |
低功率模式 | NO | - | - | NO | NO | NO | NO | NO |
湿度敏感等级 | 3 | - | - | 3 | 3 | 3 | 3 | 3 |
串行 I/O 数 | 1 | - | - | 1 | 1 | 1 | 1 | 1 |
端子数量 | 44 | - | - | 44 | 44 | 44 | 44 | 44 |
最高工作温度 | 125 °C | - | - | 85 °C | 85 °C | 125 °C | 125 °C | 125 °C |
最低工作温度 | -55 °C | - | - | -40 °C | -40 °C | -55 °C | -55 °C | -55 °C |
封装主体材料 | PLASTIC/EPOXY | - | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | HVQCCN | - | - | LQFP | LQFP | LQFP | LQFP | LQFP |
封装形状 | SQUARE | - | - | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
封装形式 | CHIP CARRIER | - | - | FLATPACK | FLATPACK | FLATPACK | FLATPACK | FLATPACK |
峰值回流温度(摄氏度) | 240 | - | - | 240 | 260 | 240 | 260 | 240 |
认证状态 | Not Qualified | - | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 1 mm | - | - | 1.6 mm | 1.6 mm | 1.6 mm | 1.6 mm | 1.6 mm |
最大供电电压 | 3.45 V | - | - | 3.45 V | 3.45 V | 3.45 V | 3.45 V | 3.45 V |
最小供电电压 | 3.15 V | - | - | 3.15 V | 3.15 V | 3.15 V | 3.15 V | 3.15 V |
标称供电电压 | 3.3 V | - | - | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
表面贴装 | YES | - | - | YES | YES | YES | YES | YES |
技术 | CMOS | - | - | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | MILITARY | - | - | INDUSTRIAL | INDUSTRIAL | MILITARY | MILITARY | MILITARY |
端子面层 | TIN LEAD | - | - | TIN LEAD | MATTE TIN | TIN LEAD | MATTE TIN | TIN LEAD |
端子形式 | NO LEAD | - | - | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
端子节距 | 0.5 mm | - | - | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm |
端子位置 | QUAD | - | - | QUAD | QUAD | QUAD | QUAD | QUAD |
处于峰值回流温度下的最长时间 | 30 | - | - | 30 | 40 | 30 | 40 | 30 |
宽度 | 7 mm | - | - | 10 mm | 10 mm | 10 mm | 10 mm | 10 mm |
uPs/uCs/外围集成电路类型 | SERIAL IO/COMMUNICATION CONTROLLER, MULTI PROTOCOL | - | - | SERIAL IO/COMMUNICATION CONTROLLER, MULTI PROTOCOL | SERIAL IO/COMMUNICATION CONTROLLER, MULTI PROTOCOL | SERIAL IO/COMMUNICATION CONTROLLER, MULTI PROTOCOL | SERIAL IO/COMMUNICATION CONTROLLER, MULTI PROTOCOL | SERIAL IO/COMMUNICATION CONTROLLER, MULTI PROTOCOL |
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