EEPROM, 64X16, Serial, CMOS, PDSO8, GREEN, EIAJ, SOIC-8
参数名称 | 属性值 |
是否Rohs认证 | 符合 |
厂商名称 | Catalyst |
零件包装代码 | SOIC |
包装说明 | SOP, SOP8,.25 |
针数 | 8 |
Reach Compliance Code | unknown |
ECCN代码 | EAR99 |
备用内存宽度 | 8 |
最大时钟频率 (fCLK) | 0.25 MHz |
数据保留时间-最小值 | 100 |
耐久性 | 1000000 Write/Erase Cycles |
JESD-30 代码 | R-PDSO-G8 |
JESD-609代码 | e4 |
内存密度 | 1024 bit |
内存集成电路类型 | EEPROM |
内存宽度 | 16 |
功能数量 | 1 |
端子数量 | 8 |
字数 | 64 words |
字数代码 | 64 |
工作模式 | SYNCHRONOUS |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
组织 | 64X16 |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | SOP |
封装等效代码 | SOP8,.25 |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE |
并行/串行 | SERIAL |
峰值回流温度(摄氏度) | 260 |
电源 | 2/5 V |
认证状态 | Not Qualified |
串行总线类型 | MICROWIRE |
最大待机电流 | 0.00001 A |
最大压摆率 | 0.003 mA |
最大供电电压 (Vsup) | 5.5 V |
最小供电电压 (Vsup) | 1.8 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子面层 | NICKEL PALLADIUM GOLD |
端子形式 | GULL WING |
端子节距 | 1.27 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | 40 |
写保护 | SOFTWARE |
CAT93C46RXI-1.8GT3 | CAT93C46RYI-1.8GT3 | CAT93C46RWI-1.8GT3 | CAT93C46RZD4I-1.8GT3 | CAT93C46RZD4I-GT3 | CAT93C46RVI-1.8GT3 | CAT93C46RLI-1.8G | CAT93C46RXI-GT3 | |
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描述 | EEPROM, 64X16, Serial, CMOS, PDSO8, GREEN, EIAJ, SOIC-8 | EEPROM, 64X16, Serial, CMOS, PDSO8, GREEN, TSSOP-8 | EEPROM, 64X16, Serial, CMOS, PDSO8, 0.150 INCH, GREEN, MS-012, SOIC-8 | EEPROM, 64X16, Serial, CMOS, 3 X 3 MM, GREEN, MO-229, TDFN-8 | EEPROM, 64X16, Serial, CMOS, 3 X 3 MM, GREEN, MO-229, TDFN-8 | EEPROM, 64X16, Serial, CMOS, PDSO8, 0.150 INCH, GREEN, MS-012, SOIC-8 | EEPROM, 64X16, Serial, CMOS, PDIP8, 0.300 INCH, GREEN, PLASTIC, MS-001, DIP-8 | EEPROM, 64X16, Serial, CMOS, PDSO8, GREEN, EIAJ, SOIC-8 |
是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
零件包装代码 | SOIC | SOIC | SOIC | SON | SON | SOIC | DIP | SOIC |
包装说明 | SOP, SOP8,.25 | TSSOP, TSSOP8,.25 | SOP, SOP8,.25 | HVSSON, SOLCC8,.12,25 | HVSSON, SOLCC8,.12,25 | SOP, SOP8,.25 | DIP, | SOP, SOP8,.25 |
针数 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
备用内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
最大时钟频率 (fCLK) | 0.25 MHz | 0.25 MHz | 0.25 MHz | 0.25 MHz | 0.5 MHz | 0.25 MHz | 0.25 MHz | 0.5 MHz |
JESD-30 代码 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | S-XDSO-N8 | S-XDSO-N8 | R-PDSO-G8 | R-PDIP-T8 | R-PDSO-G8 |
JESD-609代码 | e4 | e4 | e4 | e4 | e4 | e4 | e4 | e4 |
内存密度 | 1024 bit | 1024 bit | 1024 bit | 1024 bit | 1024 bit | 1024 bit | 1024 bit | 1024 bit |
内存集成电路类型 | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM |
内存宽度 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
字数 | 64 words | 64 words | 64 words | 64 words | 64 words | 64 words | 64 words | 64 words |
字数代码 | 64 | 64 | 64 | 64 | 64 | 64 | 64 | 64 |
工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
组织 | 64X16 | 64X16 | 64X16 | 64X16 | 64X16 | 64X16 | 64X16 | 64X16 |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | UNSPECIFIED | UNSPECIFIED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | SOP | TSSOP | SOP | HVSSON | HVSSON | SOP | DIP | SOP |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE, SHRINK PITCH | SMALL OUTLINE | IN-LINE | SMALL OUTLINE |
并行/串行 | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL |
峰值回流温度(摄氏度) | 260 | 260 | 260 | 260 | 260 | 260 | 260 | 260 |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
串行总线类型 | MICROWIRE | MICROWIRE | MICROWIRE | MICROWIRE | MICROWIRE | MICROWIRE | MICROWIRE | MICROWIRE |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 2.5 V | 1.8 V | 1.8 V | 2.5 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | YES | YES | YES | YES | YES | NO | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子面层 | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD |
端子形式 | GULL WING | GULL WING | GULL WING | NO LEAD | NO LEAD | GULL WING | THROUGH-HOLE | GULL WING |
端子节距 | 1.27 mm | 0.65 mm | 1.27 mm | 0.65 mm | 0.65 mm | 1.27 mm | 2.54 mm | 1.27 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
处于峰值回流温度下的最长时间 | 40 | 40 | 40 | 40 | 40 | 40 | 40 | 40 |
厂商名称 | Catalyst | Catalyst | Catalyst | Catalyst | - | - | - | Catalyst |
数据保留时间-最小值 | 100 | 100 | 100 | 100 | 100 | 100 | - | 100 |
耐久性 | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | - | 1000000 Write/Erase Cycles |
封装等效代码 | SOP8,.25 | TSSOP8,.25 | SOP8,.25 | SOLCC8,.12,25 | SOLCC8,.12,25 | SOP8,.25 | - | SOP8,.25 |
电源 | 2/5 V | 2/5 V | 2/5 V | 2/5 V | 3/5 V | 2/5 V | - | 2/5 V |
最大待机电流 | 0.00001 A | 0.00001 A | 0.00001 A | 0.00001 A | 0.00001 A | 0.00001 A | - | 0.00001 A |
最大压摆率 | 0.003 mA | 0.003 mA | 0.003 mA | 0.003 mA | 0.003 mA | 0.003 mA | - | 0.003 mA |
写保护 | SOFTWARE | SOFTWARE | SOFTWARE | SOFTWARE | SOFTWARE | SOFTWARE | - | SOFTWARE |
长度 | - | 4.4 mm | 4.9 mm | 3 mm | 3 mm | 4.9 mm | 9.271 mm | - |
宽度 | - | 3 mm | 3.9 mm | 3 mm | 3 mm | 3.9 mm | 7.62 mm | - |
Base Number Matches | - | 1 | 1 | 1 | 1 | 1 | 1 | - |
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