32M X 1 FLASH 3V PROM, 70 ns, PDSO48
32M × 1 FLASH 3V 可编程只读存储器, 70 ns, PDSO48
| 参数名称 | 属性值 |
| 功能数量 | 1 |
| 端子数量 | 48 |
| 最大工作温度 | 85 Cel |
| 最小工作温度 | -40 Cel |
| 最大供电/工作电压 | 3.6 V |
| 最小供电/工作电压 | 2.7 V |
| 额定供电电压 | 3 V |
| 最大存取时间 | 70 ns |
| 加工封装描述 | 12 X 20 MM, GREEN, TSOP-48 |
| 无铅 | Yes |
| 欧盟RoHS规范 | Yes |
| 状态 | ACTIVE |
| 包装形状 | RECTANGULAR |
| 包装尺寸 | SMALL OUTLINE, THIN PROFILE |
| 表面贴装 | Yes |
| 端子形式 | GULL WING |
| 端子间距 | 0.5000 mm |
| 端子涂层 | MATTE TIN |
| 端子位置 | DUAL |
| 包装材料 | PLASTIC/EPOXY |
| 温度等级 | INDUSTRIAL |
| 内存宽度 | 1 |
| 组织 | 32M X 1 |
| 存储密度 | 3.36E7 deg |
| 操作模式 | ASYNCHRONOUS |
| 位数 | 3.36E7 words |
| 位数 | 32M |
| 内存IC类型 | FLASH 3V PROM |
| 串行并行 | PARALLEL |
| W29GL032CT7B | W29GL032C | W29GL032CB7A | W29GL032CB7B | W29GL032CH7B | W29GL032CH7T | W29GL032CL7B | W29GL032CL7T | W29GL032CT7A | W29GL032CT7S | |
|---|---|---|---|---|---|---|---|---|---|---|
| 描述 | 32M X 1 FLASH 3V PROM, 70 ns, PDSO48 | 32M X 1 FLASH 3V PROM, 70 ns, PDSO48 | 32M X 1 FLASH 3V PROM, 70 ns, PDSO48 | Flash, 32MX1, 70ns, PBGA64, LFBGA-64 | 32M X 1 FLASH 3V PROM, 70 ns, PDSO48 | Flash, 32MX1, 70ns, PDSO56, TSOP-56 | 32M X 1 FLASH 3V PROM, 70 ns, PDSO48 | 32M X 1 FLASH 3V PROM, 70 ns, PDSO48 | Flash, 32MX1, 70ns, PBGA48, TFBGA-48 | 32M X 1 FLASH 3V PROM, 70 ns, PDSO48 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 48 | 48 | 48 | 64 | 64 | 56 | 64 | 48 | 48 | 48 |
| 表面贴装 | Yes | Yes | Yes | YES | YES | YES | YES | Yes | YES | YES |
| 端子形式 | GULL WING | GULL WING | GULL WING | BALL | BALL | GULL WING | BALL | GULL WING | BALL | GULL WING |
| 端子位置 | DUAL | DUAL | DUAL | BOTTOM | BOTTOM | DUAL | BOTTOM | DUAL | BOTTOM | DUAL |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 内存宽度 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 组织 | 32M X 1 | 32M X 1 | 32M X 1 | 32MX1 | 32MX1 | 32MX1 | 32MX1 | 32M X 1 | 32MX1 | 32MX1 |
| 是否无铅 | - | - | - | 不含铅 | 不含铅 | 不含铅 | 不含铅 | - | 不含铅 | 不含铅 |
| 是否Rohs认证 | - | - | - | 符合 | 符合 | 符合 | 符合 | - | 符合 | 符合 |
| 零件包装代码 | - | - | - | BGA | BGA | TSOP | BGA | - | BGA | TSOP |
| 包装说明 | - | - | - | LFBGA-64 | LFBGA-64 | TSOP-56 | LFBGA-64 | - | TFBGA-48 | TSOP-48 |
| 针数 | - | - | - | 64 | 64 | 56 | 64 | - | 48 | 48 |
| Reach Compliance Code | - | - | - | compliant | compli | compliant | compliant | - | compliant | compli |
| ECCN代码 | - | - | - | EAR99 | 3A991.B.1.A | EAR99 | 3A991.B.1.A | - | EAR99 | 3A991.B.1.A |
| 最长访问时间 | - | - | - | 70 ns | 70 ns | 70 ns | 70 ns | - | 70 ns | 70 ns |
| 备用内存宽度 | - | - | - | 8 | 8 | 8 | 8 | - | 8 | 8 |
| 命令用户界面 | - | - | - | YES | YES | YES | YES | - | YES | YES |
| 通用闪存接口 | - | - | - | YES | YES | YES | YES | - | YES | YES |
| 数据轮询 | - | - | - | YES | YES | YES | YES | - | YES | YES |
| JESD-30 代码 | - | - | - | R-PBGA-B64 | R-PBGA-B64 | R-PDSO-G56 | R-PBGA-B64 | - | R-PBGA-B48 | R-PDSO-G48 |
| JESD-609代码 | - | - | - | e1 | e1 | e3 | e1 | - | e1 | e3 |
| 长度 | - | - | - | 13 mm | 13 mm | 18.4 mm | 13 mm | - | 8 mm | 18.4 mm |
| 内存密度 | - | - | - | 33554432 bit | 33554432 bi | 33554432 bit | 33554432 bit | - | 33554432 bit | 33554432 bi |
| 内存集成电路类型 | - | - | - | FLASH | FLASH | FLASH | FLASH | - | FLASH | FLASH |
| 部门数/规模 | - | - | - | 8,63 | 64 | 64 | 64 | - | 8,63 | 8,63 |
| 字数 | - | - | - | 33554432 words | 33554432 words | 33554432 words | 33554432 words | - | 33554432 words | 33554432 words |
| 字数代码 | - | - | - | 32000000 | 32000000 | 32000000 | 32000000 | - | 32000000 | 32000000 |
| 工作模式 | - | - | - | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | - | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | - | - | - | 85 °C | 85 °C | 85 °C | 85 °C | - | 85 °C | 85 °C |
| 最低工作温度 | - | - | - | -40 °C | -40 °C | -40 °C | -40 °C | - | -40 °C | -40 °C |
| 封装主体材料 | - | - | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | - | - | - | LBGA | LBGA | TSOP1 | LBGA | - | TFBGA | TSOP1 |
| 封装等效代码 | - | - | - | BGA64,8X8,40 | BGA64,8X8,40 | TSSOP56,.8,20 | BGA64,8X8,40 | - | BGA48,6X8,32 | TSSOP48,.8,20 |
| 封装形状 | - | - | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | RECTANGULAR |
| 封装形式 | - | - | - | GRID ARRAY, LOW PROFILE | GRID ARRAY, LOW PROFILE | SMALL OUTLINE, THIN PROFILE | GRID ARRAY, LOW PROFILE | - | GRID ARRAY, THIN PROFILE, FINE PITCH | SMALL OUTLINE, THIN PROFILE |
| 页面大小 | - | - | - | 8/16 words | 8/16 words | 8/16 words | 8/16 words | - | 8/16 words | 8/16 words |
| 并行/串行 | - | - | - | PARALLEL | PARALLEL | PARALLEL | PARALLEL | - | PARALLEL | PARALLEL |
| 编程电压 | - | - | - | 3 V | 3 V | 3 V | 3 V | - | 3 V | 3 V |
| 认证状态 | - | - | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified |
| 就绪/忙碌 | - | - | - | YES | YES | YES | YES | - | YES | YES |
| 座面最大高度 | - | - | - | 1.4 mm | 1.4 mm | 1.2 mm | 1.4 mm | - | 1.2 mm | 1.2 mm |
| 部门规模 | - | - | - | 8K,64K | 64K | 64K | 64K | - | 8K,64K | 8K,64K |
| 最大待机电流 | - | - | - | 0.000005 A | 0.000005 A | 0.000005 A | 0.000005 A | - | 0.000005 A | 0.000005 A |
| 最大压摆率 | - | - | - | 0.055 mA | 0.055 mA | 0.055 mA | 0.055 mA | - | 0.055 mA | 0.055 mA |
| 最大供电电压 (Vsup) | - | - | - | 3.6 V | 3.6 V | 3.6 V | 3.6 V | - | 3.6 V | 3.6 V |
| 最小供电电压 (Vsup) | - | - | - | 2.7 V | 2.7 V | 2.7 V | 2.7 V | - | 2.7 V | 2.7 V |
| 标称供电电压 (Vsup) | - | - | - | 3 V | 3 V | 3 V | 3 V | - | 3 V | 3 V |
| 技术 | - | - | - | CMOS | CMOS | CMOS | CMOS | - | CMOS | CMOS |
| 端子面层 | - | - | - | TIN SILVER COPPER | TIN SILVER COPPER | MATTE TIN | TIN SILVER COPPER | - | TIN SILVER COPPER | Matte Tin (Sn) |
| 端子节距 | - | - | - | 1 mm | 1 mm | 0.5 mm | 1 mm | - | 0.8 mm | 0.5 mm |
| 切换位 | - | - | - | YES | YES | YES | YES | - | YES | YES |
| 类型 | - | - | - | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | - | NOR TYPE | NOR TYPE |
| 宽度 | - | - | - | 11 mm | 11 mm | 14 mm | 11 mm | - | 6 mm | 12 mm |
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