Standard SRAM, 8KX8, 20ns, PDSO28
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | FUJITSU(富士通) |
| 零件包装代码 | SOJ |
| 包装说明 | SOJ, SOJ28,.34 |
| 针数 | 28 |
| Reach Compliance Code | compliant |
| 最长访问时间 | 20 ns |
| I/O 类型 | COMMON |
| JESD-30 代码 | R-PDSO-J28 |
| JESD-609代码 | e0 |
| 内存密度 | 65536 bit |
| 内存集成电路类型 | STANDARD SRAM |
| 内存宽度 | 8 |
| 端子数量 | 28 |
| 字数 | 8192 words |
| 字数代码 | 8000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 8KX8 |
| 输出特性 | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOJ |
| 封装等效代码 | SOJ28,.34 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 并行/串行 | PARALLEL |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| 最大压摆率 | 0.12 mA |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | J BEND |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| MB82B78-20PJ | MB82B78-20PSK | MB82B78-15PF | MB82B78-15PSK | MB82B78-20PF | MB82B78-15PJ | |
|---|---|---|---|---|---|---|
| 描述 | Standard SRAM, 8KX8, 20ns, PDSO28 | 8KX8 STANDARD SRAM, 20ns, PDIP28, 0.300 INCH, SKINNY, PLASTIC, DIP-28 | Standard SRAM, 8KX8, 15ns, PDSO32 | 8KX8 STANDARD SRAM, 15ns, PDIP28, 0.300 INCH, SKINNY, PLASTIC, DIP-28 | Standard SRAM, 8KX8, 20ns, PDSO32 | Standard SRAM, 8KX8, 15ns, PDSO28 |
| 厂商名称 | FUJITSU(富士通) | FUJITSU(富士通) | FUJITSU(富士通) | FUJITSU(富士通) | FUJITSU(富士通) | FUJITSU(富士通) |
| 零件包装代码 | SOJ | DIP | SOIC | DIP | SOIC | SOJ |
| 包装说明 | SOJ, SOJ28,.34 | DIP, | SOP, SOP32,.5 | DIP, | SOP, SOP32,.5 | SOJ, SOJ28,.34 |
| 针数 | 28 | 28 | 28 | 28 | 28 | 28 |
| Reach Compliance Code | compliant | unknown | compliant | unknown | compliant | compliant |
| 最长访问时间 | 20 ns | 20 ns | 15 ns | 15 ns | 20 ns | 15 ns |
| JESD-30 代码 | R-PDSO-J28 | R-PDIP-T28 | R-PDSO-G32 | R-PDIP-T28 | R-PDSO-G32 | R-PDSO-J28 |
| 内存密度 | 65536 bit | 65536 bit | 65536 bit | 65536 bit | 65536 bit | 65536 bit |
| 内存集成电路类型 | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
| 内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 |
| 端子数量 | 28 | 28 | 32 | 28 | 32 | 28 |
| 字数 | 8192 words | 8192 words | 8192 words | 8192 words | 8192 words | 8192 words |
| 字数代码 | 8000 | 8000 | 8000 | 8000 | 8000 | 8000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 组织 | 8KX8 | 8KX8 | 8KX8 | 8KX8 | 8KX8 | 8KX8 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SOJ | DIP | SOP | DIP | SOP | SOJ |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | IN-LINE | SMALL OUTLINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | NO | YES | NO | YES | YES |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子形式 | J BEND | THROUGH-HOLE | GULL WING | THROUGH-HOLE | GULL WING | J BEND |
| 端子节距 | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 是否Rohs认证 | 不符合 | - | 不符合 | - | 不符合 | 不符合 |
| I/O 类型 | COMMON | - | COMMON | - | COMMON | COMMON |
| JESD-609代码 | e0 | - | e0 | - | e0 | e0 |
| 输出特性 | 3-STATE | - | 3-STATE | - | 3-STATE | 3-STATE |
| 封装等效代码 | SOJ28,.34 | - | SOP32,.5 | - | SOP32,.5 | SOJ28,.34 |
| 电源 | 5 V | - | 5 V | - | 5 V | 5 V |
| 最大压摆率 | 0.12 mA | - | 0.12 mA | - | 0.12 mA | 0.12 mA |
| 端子面层 | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
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