10-BIT, 25MSPS, 35mW A/D CONVERTER
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | ST(意法半导体) |
| 零件包装代码 | QFP |
| 包装说明 | 7 X 7 MM, PLASTIC, TQFP-48 |
| 针数 | 48 |
| Reach Compliance Code | _compli |
| ECCN代码 | EAR99 |
| 最大模拟输入电压 | 1.1 V |
| 最小模拟输入电压 | 0.2 V |
| 转换器类型 | ADC, PROPRIETARY METHOD |
| JESD-30 代码 | S-PQFP-G48 |
| JESD-609代码 | e0 |
| 长度 | 7 mm |
| 最大线性误差 (EL) | 0.0781% |
| 模拟输入通道数量 | 1 |
| 位数 | 10 |
| 功能数量 | 1 |
| 端子数量 | 48 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 输出位码 | BINARY, 2\'S COMPLEMENT BINARY |
| 输出格式 | PARALLEL, WORD |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | LFQFP |
| 封装等效代码 | QFP48,.35SQ,20 |
| 封装形状 | SQUARE |
| 封装形式 | FLATPACK, LOW PROFILE, FINE PITCH |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 2.5 V |
| 认证状态 | Not Qualified |
| 采样速率 | 25 MHz |
| 采样并保持/跟踪并保持 | SAMPLE |
| 座面最大高度 | 1.6 mm |
| 标称供电电压 | 2.5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING |
| 端子节距 | 0.5 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 7 mm |
| TSA1001CF | TSA1001IFT | TSA1001IF | TSA1001CFT | TSA1001 | |
|---|---|---|---|---|---|
| 描述 | 10-BIT, 25MSPS, 35mW A/D CONVERTER | 10-BIT, 25MSPS, 35mW A/D CONVERTER | 10-BIT, 25MSPS, 35mW A/D CONVERTER | 10-BIT, 25MSPS, 35mW A/D CONVERTER | 10-BIT, 25MSPS, 35mW A/D CONVERTER |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | - |
| 厂商名称 | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) | - | - |
| 零件包装代码 | QFP | QFP | QFP | QFP | - |
| 包装说明 | 7 X 7 MM, PLASTIC, TQFP-48 | 7 X 7 MM, PLASTIC, TQFP-48 | 7 X 7 MM, PLASTIC, TQFP-48 | 7 X 7 MM, PLASTIC, TQFP-48 | - |
| 针数 | 48 | 48 | 48 | 48 | - |
| Reach Compliance Code | _compli | _compli | _compli | _compli | - |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | - |
| 最大模拟输入电压 | 1.1 V | 1.1 V | 1.1 V | 1.1 V | - |
| 最小模拟输入电压 | 0.2 V | 0.2 V | 0.2 V | 0.2 V | - |
| 转换器类型 | ADC, PROPRIETARY METHOD | ADC, PROPRIETARY METHOD | ADC, PROPRIETARY METHOD | ADC, PROPRIETARY METHOD | - |
| JESD-30 代码 | S-PQFP-G48 | S-PQFP-G48 | S-PQFP-G48 | S-PQFP-G48 | - |
| JESD-609代码 | e0 | e0 | e0 | e0 | - |
| 长度 | 7 mm | 7 mm | 7 mm | 7 mm | - |
| 最大线性误差 (EL) | 0.0781% | 0.0781% | 0.0781% | 0.0781% | - |
| 模拟输入通道数量 | 1 | 1 | 1 | 1 | - |
| 位数 | 10 | 10 | 10 | 10 | - |
| 功能数量 | 1 | 1 | 1 | 1 | - |
| 端子数量 | 48 | 48 | 48 | 48 | - |
| 最高工作温度 | 70 °C | 85 °C | 85 °C | 70 °C | - |
| 输出位码 | BINARY, 2\'S COMPLEMENT BINARY | BINARY, 2\'S COMPLEMENT BINARY | BINARY, 2\'S COMPLEMENT BINARY | BINARY, 2'S COMPLEMENT BINARY | - |
| 输出格式 | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD | - |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - |
| 封装代码 | LFQFP | LFQFP | LFQFP | LFQFP | - |
| 封装等效代码 | QFP48,.35SQ,20 | QFP48,.35SQ,20 | QFP48,.35SQ,20 | QFP48,.35SQ,20 | - |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | - |
| 封装形式 | FLATPACK, LOW PROFILE, FINE PITCH | FLATPACK, LOW PROFILE, FINE PITCH | FLATPACK, LOW PROFILE, FINE PITCH | FLATPACK, LOW PROFILE, FINE PITCH | - |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - |
| 电源 | 2.5 V | 2.5 V | 2.5 V | 2.5 V | - |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - |
| 采样速率 | 25 MHz | 25 MHz | 25 MHz | 25 MHz | - |
| 采样并保持/跟踪并保持 | SAMPLE | SAMPLE | SAMPLE | SAMPLE | - |
| 座面最大高度 | 1.6 mm | 1.6 mm | 1.6 mm | 1.6 mm | - |
| 标称供电电压 | 2.5 V | 2.5 V | 2.5 V | 2.5 V | - |
| 表面贴装 | YES | YES | YES | YES | - |
| 技术 | CMOS | CMOS | CMOS | CMOS | - |
| 温度等级 | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | - |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | - |
| 端子节距 | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | - |
| 端子位置 | QUAD | QUAD | QUAD | QUAD | - |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - |
| 宽度 | 7 mm | 7 mm | 7 mm | 7 mm | - |
stm32/stm8
stm32/stm8
RF/无线
下载中心专版
NXP MCU
RF/无线
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
