LINE DRIVER, CDIP16, CERAMIC, DIP-16
| 参数名称 | 属性值 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 包装说明 | DIP, |
| Reach Compliance Code | unknown |
| ECCN代码 | EAR99 |
| 差分输出 | YES |
| 驱动器位数 | 4 |
| 输入特性 | STANDARD |
| 接口集成电路类型 | LINE DRIVER |
| 接口标准 | EIA-422 |
| JESD-30 代码 | R-GDIP-T16 |
| JESD-609代码 | e0 |
| 长度 | 19.43 mm |
| 功能数量 | 1 |
| 端子数量 | 16 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 输出特性 | 3-STATE |
| 输出极性 | COMPLEMENTARY |
| 封装主体材料 | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 认证状态 | Not Qualified |
| 最大接收延迟 | |
| 筛选级别 | MIL-STD-883 |
| 座面最大高度 | 5.08 mm |
| 最大压摆率 | 2.1 mA |
| 最大供电电压 | 5.5 V |
| 最小供电电压 | 4.5 V |
| 标称供电电压 | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子面层 | TIN LEAD |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 最大传输延迟 | 14 ns |
| 宽度 | 7.62 mm |
| 5962-9163901MJA | 5962-9163901MWA | DS26C31TJ | |
|---|---|---|---|
| 描述 | LINE DRIVER, CDIP16, CERAMIC, DIP-16 | LINE DRIVER, CDFP16, CERAMIC, FP-16 | LINE DRIVER, CDIP16, CERAMIC, DIP-16 |
| 厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
| 包装说明 | DIP, | DFP, | DIP, DIP16,.3 |
| Reach Compliance Code | unknown | unknown | unknown |
| ECCN代码 | EAR99 | EAR99 | EAR99 |
| 差分输出 | YES | YES | YES |
| 驱动器位数 | 4 | 4 | 4 |
| 输入特性 | STANDARD | STANDARD | STANDARD |
| 接口集成电路类型 | LINE DRIVER | LINE DRIVER | LINE DRIVER |
| 接口标准 | EIA-422 | EIA-422 | EIA-422 |
| JESD-30 代码 | R-GDIP-T16 | R-GDFP-F16 | R-GDIP-T16 |
| JESD-609代码 | e0 | e0 | e0 |
| 长度 | 19.43 mm | 9.6645 mm | 19.43 mm |
| 功能数量 | 1 | 1 | 1 |
| 端子数量 | 16 | 16 | 16 |
| 最高工作温度 | 125 °C | 125 °C | 85 °C |
| 最低工作温度 | -55 °C | -55 °C | -40 °C |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE |
| 输出极性 | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY |
| 封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP | DFP | DIP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | FLATPACK | IN-LINE |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 5.08 mm | 2.032 mm | 5.08 mm |
| 最大压摆率 | 2.1 mA | 2.1 mA | 2 mA |
| 最大供电电压 | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 | 5 V | 5 V | 5 V |
| 表面贴装 | NO | YES | NO |
| 技术 | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | INDUSTRIAL |
| 端子面层 | TIN LEAD | TIN LEAD | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | FLAT | THROUGH-HOLE |
| 端子节距 | 2.54 mm | 1.27 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL |
| 最大传输延迟 | 14 ns | 14 ns | 11 ns |
| 宽度 | 7.62 mm | 6.604 mm | 7.62 mm |
| 筛选级别 | MIL-STD-883 | MIL-STD-883 | - |
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