Operating Temperature Range ......................... -40°C to +125°C
Storage Temperature Range ............................ -65°C to +150°C
Junction Temperature ......................................................+150°C
Lead Temperature (soldering, 10s) .................................+300°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these
or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Package Information
5 SOT23
PACKAGE CODE
Outline Number
Land Pattern Number
Thermal Resistance, Four-Layer Board:
Junction to Ambient (θ
JA
)
Junction to Case (θ
JC
)
Thermal Resistance, Multilayer Board:
Junction to Ambient (θ
JA
)
Junction to Case (θ
JC
)
255.9°C/W
81°C/W
U6+1/U6+1A
21-0058
90-0175
N/A
80°C/W
115°C/W
80°C/W
K8SN+1
21-0078
90-0176
N/A
80°C/W
180°C/W
60°C/W
324.3°C/W
82°C/W
21-0057
90-0174
U5+1
6 SOT23
PACKAGE CODE
Outline Number
Land Pattern Number
Thermal Resistance, Four-Layer Board:
Junction to Ambient (θ
JA
)
Junction to Case (θ
JC
)
Thermal Resistance, Multilayer Board:
Junction to Ambient (θ
JA
)
Junction to Case (θ
JC
)
8 SOT23
PACKAGE CODE
Outline Number
Land Pattern Number
Thermal Resistance, Four-Layer Board:
Junction to Ambient (θ
JA
)
Junction to Case (θ
JC
)
Thermal Resistance, Multilayer Board:
Junction to Ambient (θ
JA
)
Junction to Case (θ
JC
)
For the latest package outline information and land patterns (footprints), go to
www.maximintegrated.com/packages.
Note that a “+”, “#”, or “-” in the package
code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status.
Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on
package thermal considerations, refer to
www.maximintegrated.com/thermal-tutorial.
www.maximintegrated.com
Maxim Integrated │
2
MAX6715A–MAX6729A/
MAX6797A
Electrical Characteristics
PARAMETER
Supply Voltage
Dual/Triple, Ultra-Low-Voltage, SOT23 μP
Supervisory Circuits
(V
CC1
= 0.8V to 5.5V, V
CC2
= 0.8V to 5.5V, GND = 0V, T
A
= -40°C to +125°C, unless otherwise noted. Typical values are at
T
A
= +25°C.) (Note 1)
SYMBOL
V
CC
I
CC1
Supply Current
I
CC2
CONDITIONS
V
CC1
< 5.5V all I/O connections open,
outputs not asserted
V
CC1
< 3.6V all I/O connections open,
outputs not asserted
V
CC2
< 3.6V all I/O connections open,
outputs not asserted
V
CC2
< 2.75V all I/O connections open,
outputs not asserted
L (falling)
M (falling)
T (falling)
S (falling)
V
CC1
Reset Threshold
V
TH1
R (falling)
Z (falling)
Y (falling)
W (falling)
V (falling)
T (falling)
S (falling)
R (falling)
Z (falling)
Y (falling)
W (falling)
V
CC2
Reset Threshold
V
TH2
V (falling)
I (falling)
H (falling)
G (falling)
F (falling)
E (falling)
D (falling)
4.500
4.250
3.000
2.850
2.550
2.250
2.125
1.620
1.530
3.000
2.850
2.550
2.250
2.125
1.620
1.530
1.350
1.275
1.080
1.020
0.810
0.765
MIN
0.8
15
10
4
3
4.625
4.375
3.075
2.925
2.625
2.313
2.188
1.665
1.575
3.075
2.925
2.625
2.313
2.188
1.665
1.575
1.388
1.313
1.110
1.050
0.833
0.788
TYP
MAX
5.5
39
28
11
9
4.750
4.500
3.150
3.000
2.700
2.375
2.250
1.710
1.620
3.150
3.000
2.700
2.375
2.250
1.710
1.620
1.425
1.350
1.140
1.080
0.855
0.810
V
V
UNITS
V
µA
www.maximintegrated.com
Maxim Integrated │ 3
MAX6715A–MAX6729A/
MAX6797A
Electrical Characteristics (continued)
PARAMETER
Reset Threshold Tempco
Reset Threshold Hysteresis
V
CC
to Reset Output Delay
SYMBOL
ΔV
TH
/°C
V
HYST
t
RD
Dual/Triple, Ultra-Low-Voltage, SOT23 μP
Supervisory Circuits
(V
CC1
= 0.8V to 5.5V, V
CC2
= 0.8V to 5.5V, GND = 0V, T
A
= -40°C to +125°C, unless otherwise noted. Typical values are at
这标志着在物流供应链打印中处于全球领先地位的美国普印力PRINTRONIX更加看好中国市场，进一步加大在中国的投资力度，依托国际性分销商和本土的行业巨头进一步深入中国市场。 来自政府相关部门的领导、自动识别行业专家、行业客户代表以及新闻媒体出席了新闻发布会，普印力全球高级销售总裁James B. McWilson以及大中华区总经理Roger Zhao出席会议，与闪联总裁孙育宁博士现场...[详细]
射频识别(Radio Frequency Identification，RFID)技术是一种利用无线射频通信实现的非接触式自动识别技术，与目前广泛采用的条形码技术相比，RFID具有容量大、识别距离远、穿透能力强、抗污性强等特点。RFID技术已经发展得比较成熟并获得了大规模商用，但超高频RFID技术相对滞后。本文分析了射频芯片nRF9E5的功能特性，并将其用于RFID系统中，设计了一套有源超高频(...[详细]
在全球半导体产业因景气不佳而纷传并购、整合之际，两大IT巨头三星、IBM日前却双双宣布，将强化半导体产业投资。 三星电子本周一宣布，已向韩国证券交易所提交一份申请文件，打算2008年投下10.5亿美元，用于升级内存芯片生产线、改进技术工艺，从而提高产能并降低成本。无独有偶。本周二IBM公司宣布，未来3年将投资10亿美元，用于扩充位于纽约州 East Fishkill 的半导体工厂，以消...[详细]
传感器
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
