2.5A, Singe Input, Single Cell Switchmode Li-Ion BATTERY CHARGER with Power Path Management 24-VQFN -40 to 85
| 参数名称 | 属性值 |
| Brand Name | Texas Instruments |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 包装说明 | HVQCCN, |
| Reach Compliance Code | compliant |
| ECCN代码 | EAR99 |
| Factory Lead Time | 6 weeks |
| 模拟集成电路 - 其他类型 | POWER SUPPLY MANAGEMENT CIRCUIT |
| JESD-30 代码 | S-PQCC-N24 |
| JESD-609代码 | e4 |
| 湿度敏感等级 | 2 |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | HVQCCN |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| 峰值回流温度（摄氏度） | 260 |
| 最大供电电压 (Vsup) | 10 V |
| 最小供电电压 (Vsup) | 4.2 V |
| 表面贴装 | YES |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | NO LEAD |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| bq24272RGER | bq24272RGET | bq24272YFFR | bq24272YFFT | |
|---|---|---|---|---|
| 描述 | 2.5A, Singe Input, Single Cell Switchmode Li-Ion BATTERY CHARGER with Power Path Management 24-VQFN -40 to 85 | 2.5A, Singe Input, Single Cell Switchmode Li-Ion BATTERY CHARGER with Power Path Management 24-VQFN -40 to 85 | 2.5A, Singe Input, Single Cell Switchmode Li-Ion BATTERY CHARGER with Power Path Management 49-DSBGA -40 to 85 | 2.5A, Singe Input, Single Cell Switchmode Li-Ion BATTERY CHARGER with Power Path Management 49-DSBGA -40 to 85 |
| Brand Name | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| 是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
| 包装说明 | HVQCCN, | HVQCCN, | VFBGA, | VFBGA, |
| Reach Compliance Code | compliant | compli | compliant | compli |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 |
| Factory Lead Time | 6 weeks | 6 weeks | 16 weeks | 16 weeks |
| 模拟集成电路 - 其他类型 | POWER SUPPLY MANAGEMENT CIRCUIT | POWER SUPPLY MANAGEMENT CIRCUIT | POWER SUPPLY MANAGEMENT CIRCUIT | POWER SUPPLY MANAGEMENT CIRCUIT |
| JESD-30 代码 | S-PQCC-N24 | S-PQCC-N24 | R-XBGA-B49 | R-XBGA-B49 |
| JESD-609代码 | e4 | e4 | e1 | e1 |
| 湿度敏感等级 | 2 | 2 | 1 | 1 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | UNSPECIFIED | UNSPECIFIED |
| 封装代码 | HVQCCN | HVQCCN | VFBGA | VFBGA |
| 封装形状 | SQUARE | SQUARE | RECTANGULAR | RECTANGULAR |
| 封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| 峰值回流温度（摄氏度） | 260 | 260 | 260 | 260 |
| 最大供电电压 (Vsup) | 10 V | 10 V | 10 V | 10 V |
| 最小供电电压 (Vsup) | 4.2 V | 4.2 V | 4.2 V | 4.2 V |
| 表面贴装 | YES | YES | YES | YES |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) |
| 端子形式 | NO LEAD | NO LEAD | BALL | BALL |
| 端子位置 | QUAD | QUAD | BOTTOM | BOTTOM |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
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