ACT SERIES, TRIPLE 3-INPUT NAND GATE, CDFP14, CERAMIC, FP-14
| 参数名称 | 属性值 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 零件包装代码 | DFP |
| 包装说明 | DFP, |
| 针数 | 14 |
| Reach Compliance Code | unknown |
| 系列 | ACT |
| JESD-30 代码 | R-GDFP-F14 |
| 长度 | 9.21 mm |
| 负载电容（CL） | 50 pF |
| 逻辑集成电路类型 | NAND GATE |
| 功能数量 | 3 |
| 输入次数 | 3 |
| 端子数量 | 14 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 封装主体材料 | CERAMIC, GLASS-SEALED |
| 封装代码 | DFP |
| 封装形状 | RECTANGULAR |
| 封装形式 | FLATPACK |
| 传播延迟（tpd） | 9.5 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 2.03 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子形式 | FLAT |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 宽度 | 6.29 mm |
| SN54ACT10W | SN74ACT10QDRQ1 | SN74ACT10DBLE | SN74ACT10PWLE | SN54ACT10J | SN54ACT10FK | |
|---|---|---|---|---|---|---|
| 描述 | ACT SERIES, TRIPLE 3-INPUT NAND GATE, CDFP14, CERAMIC, FP-14 | ACT SERIES, TRIPLE 3-INPUT NAND GATE, PDSO14, SOIC-14 | Triple 3-Input Positive-NAND Gates 14-SSOP -40 to 85 | Triple 3-Input Positive-NAND Gates 14-TSSOP -40 to 85 | ACT SERIES, TRIPLE 3-INPUT NAND GATE, CDIP14, CERAMIC, DIP-14 | ACT SERIES, TRIPLE 3-INPUT NAND GATE, CQCC20, CERAMIC, LCC-20 |
| 零件包装代码 | DFP | SOIC | SSOP | TSSOP | DIP | QLCC |
| 包装说明 | DFP, | SOP, SOP14,.25 | SSOP, SSOP14,.3 | TSSOP, TSSOP14,.25 | CERAMIC, DIP-14 | QCCN, |
| 针数 | 14 | 14 | 14 | 14 | 14 | 20 |
| Reach Compliance Code | unknown | unknown | not_compliant | not_compliant | unknown | unknown |
| 系列 | ACT | ACT | ACT | ACT | ACT | ACT |
| JESD-30 代码 | R-GDFP-F14 | R-PDSO-G14 | R-PDSO-G14 | R-PDSO-G14 | R-GDIP-T14 | S-CQCC-N20 |
| 长度 | 9.21 mm | 8.65 mm | 6.2 mm | 5 mm | 19.56 mm | 8.89 mm |
| 负载电容（CL） | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
| 逻辑集成电路类型 | NAND GATE | NAND GATE | NAND GATE | NAND GATE | NAND GATE | NAND GATE |
| 功能数量 | 3 | 3 | 3 | 3 | 3 | 3 |
| 输入次数 | 3 | 3 | 3 | 3 | 3 | 3 |
| 端子数量 | 14 | 14 | 14 | 14 | 14 | 20 |
| 最高工作温度 | 125 °C | 125 °C | 85 °C | 85 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -40 °C | -40 °C | -40 °C | -55 °C | -55 °C |
| 封装主体材料 | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | DFP | SOP | SSOP | TSSOP | DIP | QCCN |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE |
| 封装形式 | FLATPACK | SMALL OUTLINE | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | IN-LINE | CHIP CARRIER |
| 传播延迟（tpd） | 9.5 ns | 10 ns | 10 ns | 10 ns | 9.5 ns | 9.5 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 2.03 mm | 1.75 mm | 2 mm | 1.2 mm | 5.08 mm | 2.03 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | YES | NO | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | AUTOMOTIVE | INDUSTRIAL | INDUSTRIAL | MILITARY | MILITARY |
| 端子形式 | FLAT | GULL WING | GULL WING | GULL WING | THROUGH-HOLE | NO LEAD |
| 端子节距 | 1.27 mm | 1.27 mm | 0.65 mm | 0.65 mm | 2.54 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | QUAD |
| 宽度 | 6.29 mm | 3.9 mm | 5.3 mm | 4.4 mm | 7.62 mm | 8.89 mm |
| 厂商名称 | Texas Instruments(德州仪器) | - | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
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