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709379L7PFG

产品描述TQFP-100, Tray
产品类别存储    存储   
文件大小329KB,共17页
制造商IDT (Integrated Device Technology)
标准  
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709379L7PFG概述

TQFP-100, Tray

709379L7PFG规格参数

参数名称属性值
Brand NameIntegrated Device Technology
是否无铅不含铅
是否Rohs认证符合
厂商名称IDT (Integrated Device Technology)
零件包装代码TQFP
包装说明LFQFP, QFP100,.63SQ,20
针数100
制造商包装代码PNG100
Reach Compliance Codecompliant
ECCN代码3A991.B.2.B
Samacsys DescriptionTQFP 14.0 X 14.0 X 1.4 MM
最长访问时间7.5 ns
最大时钟频率 (fCLK)83 MHz
I/O 类型COMMON
JESD-30 代码S-PQFP-G100
JESD-609代码e3
长度14 mm
内存密度589824 bit
内存集成电路类型DUAL-PORT SRAM
内存宽度18
湿度敏感等级3
功能数量1
端口数量2
端子数量100
字数32768 words
字数代码32000
工作模式SYNCHRONOUS
最高工作温度70 °C
最低工作温度
组织32KX18
输出特性3-STATE
封装主体材料PLASTIC/EPOXY
封装代码LFQFP
封装等效代码QFP100,.63SQ,20
封装形状SQUARE
封装形式FLATPACK, LOW PROFILE, FINE PITCH
并行/串行PARALLEL
峰值回流温度(摄氏度)260
电源5 V
认证状态Not Qualified
座面最大高度1.6 mm
最大待机电流0.005 A
最小待机电流4.5 V
最大压摆率0.44 mA
最大供电电压 (Vsup)5.5 V
最小供电电压 (Vsup)4.5 V
标称供电电压 (Vsup)5 V
表面贴装YES
技术CMOS
温度等级COMMERCIAL
端子面层Matte Tin (Sn) - annealed
端子形式GULL WING
端子节距0.5 mm
端子位置QUAD
处于峰值回流温度下的最长时间30
宽度14 mm

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HIGH-SPEED 32/16K x 18
SYNCHRONOUS PIPELINED
DUAL-PORT STATIC RAM
*SPECIFIED PART IS OBSOLETE NOT RECOMMENDED FOR NEW DESIGNS
709379
*709369
Features
True Dual-Ported memory cells which allow simultaneous
access of the same memory location
High-speed clock to data access
– Commercial: 7.5/9/12ns (max.)
– Insustrial: 9ns (max.)
Low-power operation
– IDT709379/69L
Active: 1.2W (typ.)
Standby: 2.5mW (typ.)
Flow-Through or Pipelined output mode on either Port via
the
FT/PIPE
pins
Counter enable and reset features
Dual chip enables allow for depth expansion without
additional logic
Full synchronous operation on both ports
– 4ns setup to clock and 0ns hold on all control, data, and
address inputs
– Data input, address, and control registers
– Fast 7.5ns clock to data out in the Pipelined output mode
– Self-timed write allows fast cycle time
– 10ns cycle time, 100MHz operation in Pipelined output mode
Separate upper-byte and lower-byte controls for
multiplexed bus and bus matching compatibility
TTL- compatible, single 5V (±10%) power supply
Industrial temperature range (–40°C to +85°C) is
available for selected speeds
Available in a 100-pin Thin Quad Flatpack (TQFP) package
Green parts available, see ordering information
Note that information regarding recently obsoleted parts is included in this datasheet for customer convenience.
Functional Block Diagram
R/
W
L
UB
L
CE
0L
R/
W
R
UB
R
CE
0R
CE
1L
LB
L
OE
L
1
0
0/1
1
0
0/1
CE
1R
LB
R
OE
R
FT
/PIPE
L
0/1
1b 0b
b a
1a 0a
0a 1a
a
0b 1b
b
0/1
FT
/PIPE
R
I/O
9L
-I/O
17L
I/O
0L
-I/O
8L
A
14L
(1)
A
0L
CLK
L
Counter/
Address
Reg.
I/O
Control
I/O
9R
-I/O
17R
I/O
Control
I/O
0R
-I/O
8R
A
14R
(1)
MEMORY
ARRAY
Counter/
Address
Reg.
A
0R
CLK
R
ADS
L
CNTEN
L
CNTRST
L
ADS
R
CNTEN
R
CNTRST
R
4845 drw 01
NOTE:
1. A
14X
is a NC for IDT709369.
FEBRUARY 2018
1
©2018 Integrated Device Technology, Inc.
DSC-4845/8

709379L7PFG相似产品对比

709379L7PFG 709379L7PF8 709379L9PFI 709379L9PFI8 709379L9PF8 709369L12PF8 709369L9PFI 709369L9PF 709369L7PF8
描述 TQFP-100, Tray TQFP-100, Reel TQFP-100, Tray TQFP-100, Reel TQFP-100, Reel TQFP-100, Reel TQFP-100, Tray TQFP-100, Tray TQFP-100, Reel
Brand Name Integrated Device Technology Integrated Device Technology Integrated Device Technology Integrated Device Technology Integrated Device Technology Integrated Device Technology Integrated Device Technology Integrated Device Technology Integrated Device Technology
是否无铅 不含铅 含铅 含铅 含铅 含铅 含铅 含铅 含铅 含铅
是否Rohs认证 符合 不符合 不符合 不符合 不符合 不符合 不符合 不符合 不符合
厂商名称 IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology)
零件包装代码 TQFP TQFP TQFP TQFP TQFP TQFP TQFP TQFP TQFP
包装说明 LFQFP, QFP100,.63SQ,20 TQFP-100 14 X 14 MM, 1.4 MM HEIGHT, TQFP-100 TQFP-100 TQFP-100 TQFP-100 14 X 14 MM, 1.4 MM HEIGHT, TQFP-100 14 X 14 MM, 1.4 MM HEIGHT, TQFP-100 TQFP-100
针数 100 100 100 100 100 100 100 100 100
制造商包装代码 PNG100 PN100 PN100 PN100 PN100 PN100 PN100 PN100 PN100
Reach Compliance Code compliant not_compliant not_compliant not_compliant not_compliant not_compliant not_compliant not_compliant not_compliant
ECCN代码 3A991.B.2.B 3A991.B.2.B 3A991.B.2.B 3A991.B.2.B 3A991.B.2.B 3A991.B.2.B 3A991 3A991.B.2.B 3A991.B.2.B
最长访问时间 7.5 ns 7.5 ns 9 ns 20 ns 9 ns 25 ns 9 ns 9 ns 18 ns
最大时钟频率 (fCLK) 83 MHz 83 MHz 66 MHz 66 MHz 66 MHz 50 MHz 66 MHz 66 MHz 83 MHz
I/O 类型 COMMON COMMON COMMON COMMON COMMON COMMON COMMON COMMON COMMON
JESD-30 代码 S-PQFP-G100 S-PQFP-G100 S-PQFP-G100 S-PQFP-G100 S-PQFP-G100 S-PQFP-G100 S-PQFP-G100 S-PQFP-G100 S-PQFP-G100
JESD-609代码 e3 e0 e0 e0 e0 e0 e0 e0 e0
长度 14 mm 14 mm 14 mm 14 mm 14 mm 14 mm 14 mm 14 mm 14 mm
内存密度 589824 bit 589824 bit 589824 bit 589824 bit 589824 bit 294912 bit 294912 bit 294912 bit 294912 bit
内存集成电路类型 DUAL-PORT SRAM DUAL-PORT SRAM DUAL-PORT SRAM DUAL-PORT SRAM DUAL-PORT SRAM DUAL-PORT SRAM DUAL-PORT SRAM DUAL-PORT SRAM DUAL-PORT SRAM
内存宽度 18 18 18 18 18 18 18 18 18
湿度敏感等级 3 3 3 3 3 3 3 3 3
功能数量 1 1 1 1 1 1 1 1 1
端口数量 2 2 2 2 2 2 2 2 2
端子数量 100 100 100 100 100 100 100 100 100
字数 32768 words 32768 words 32768 words 32768 words 32768 words 16384 words 16384 words 16384 words 16384 words
字数代码 32000 32000 32000 32000 32000 16000 16000 16000 16000
工作模式 SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
最高工作温度 70 °C 70 °C 85 °C 85 °C 70 °C 70 °C 85 °C 70 °C 70 °C
组织 32KX18 32KX18 32KX18 32KX18 32KX18 16KX18 16KX18 16KX18 16KX18
输出特性 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 LFQFP LFQFP LFQFP LFQFP LFQFP LFQFP LFQFP LFQFP LFQFP
封装等效代码 QFP100,.63SQ,20 QFP100,.63SQ,20 QFP100,.63SQ,20 QFP100,.63SQ,20 QFP100,.63SQ,20 QFP100,.63SQ,20 QFP100,.63SQ,20 QFP100,.63SQ,20 QFP100,.63SQ,20
封装形状 SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE
封装形式 FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH
并行/串行 PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
峰值回流温度(摄氏度) 260 240 240 240 240 240 240 240 240
电源 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 1.6 mm 1.6 mm 1.4 mm 1.6 mm 1.6 mm 1.6 mm 1.4 mm 1.4 mm 1.6 mm
最大待机电流 0.005 A 0.005 A 0.006 A 0.006 A 0.003 A 0.003 A 0.006 A 0.003 A 0.005 A
最小待机电流 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
最大压摆率 0.44 mA 0.465 mA 0.43 mA 0.43 mA 0.4 mA 0.355 mA 0.43 mA 0.4 mA 0.465 mA
最大供电电压 (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
最小供电电压 (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
标称供电电压 (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
表面贴装 YES YES YES YES YES YES YES YES YES
技术 CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 COMMERCIAL COMMERCIAL INDUSTRIAL INDUSTRIAL COMMERCIAL COMMERCIAL INDUSTRIAL COMMERCIAL COMMERCIAL
端子面层 Matte Tin (Sn) - annealed Tin/Lead (Sn85Pb15) Tin/Lead (Sn85Pb15) Tin/Lead (Sn85Pb15) Tin/Lead (Sn85Pb15) Tin/Lead (Sn85Pb15) Tin/Lead (Sn85Pb15) Tin/Lead (Sn85Pb15) Tin/Lead (Sn85Pb15)
端子形式 GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING
端子节距 0.5 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm
端子位置 QUAD QUAD QUAD QUAD QUAD QUAD QUAD QUAD QUAD
处于峰值回流温度下的最长时间 30 20 20 20 20 20 20 20 20
宽度 14 mm 14 mm 14 mm 14 mm 14 mm 14 mm 14 mm 14 mm 14 mm
Base Number Matches - 1 1 1 1 1 - - -
其他特性 - - FLOW-THROUGH OR PIPELINED ARCHITECTURE FLOW-THROUGH OR PIPELINED ARCHITECTURE - FLOW-THROUGH OR PIPELINED ARCHITECTURE FLOW-THROUGH OR PIPELINED ARCHITECTURE FLOW-THROUGH OR PIPELINED ARCHITECTURE FLOW-THROUGH OR PIPELINED ARCHITECTURE

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