Digital Media System-on-Chip 529-FCBGA 0 to 85
| 参数名称 | 属性值 |
| Brand Name | Texas Instruments |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 零件包装代码 | BGA |
| 包装说明 | FBGA, BGA529,23X23,32 |
| 针数 | 529 |
| Reach Compliance Code | unknow |
| Factory Lead Time | 1 week |
| 其他特性 | ALSO REQUIRES 3.3V I/O SUPPLY |
| 位大小 | 32 |
| 格式 | FIXED POINT |
| JESD-30 代码 | S-PBGA-B529 |
| JESD-609代码 | e1 |
| 长度 | 19 mm |
| 湿度敏感等级 | 4 |
| 端子数量 | 529 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | FBGA |
| 封装等效代码 | BGA529,23X23,32 |
| 封装形状 | SQUARE |
| 封装形式 | GRID ARRAY, FINE PITCH |
| 峰值回流温度（摄氏度） | 245 |
| 电源 | 1.3,1.8/3.3 V |
| 认证状态 | Not Qualified |
| RAM（字数） | 8192 |
| 座面最大高度 | 3.3 mm |
| 最大供电电压 | 1.365 V |
| 最小供电电压 | 1.235 V |
| 标称供电电压 | 1.3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | OTHER |
| 端子面层 | Tin/Silver/Copper (Sn/Ag/Cu) |
| 端子形式 | BALL |
| 端子节距 | 0.8 mm |
| 端子位置 | BOTTOM |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 19 mm |
| uPs/uCs/外围集成电路类型 | MICROPROCESSOR CIRCUIT |
| TMS320DM6467TZUT1 | TMS320DM6467TCUT1 | TMS320DM6467TCUT9 | TMS320DM6467TZUTD1 | TMS320DM6467TCUTD1 | |
|---|---|---|---|---|---|
| 描述 | Digital Media System-on-Chip 529-FCBGA 0 to 85 | Digital Media System-on-Chip 529-FCBGA 0 to 85 | Digital Media System-on-Chip 529-FCBGA 0 to 85 | Digital Signal Processors & Controllers - DSP, DSC Dig Media System-on- | Digital Media System-on-Chip 529-FCBGA -40 to 85 |
| Brand Name | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 零件包装代码 | BGA | BGA | BGA | BGA | BGA |
| 包装说明 | FBGA, BGA529,23X23,32 | HBGA, BGA529,23X23,32 | FCBGA-529 | FBGA, BGA529,23X23,32 | HBGA, BGA529,23X23,32 |
| 针数 | 529 | 529 | 529 | 529 | 529 |
| Reach Compliance Code | unknow | compli | compliant | compli | compli |
| 其他特性 | ALSO REQUIRES 3.3V I/O SUPPLY | ALSO REQUIRES 3.3V I/O SUPPLY | ALSO REQUIRES 3.3V I/O SUPPLY | ALSO REQUIRES 3.3V I/O SUPPLY | ALSO REQUIRES 3.3V I/O SUPPLY |
| 位大小 | 32 | 32 | 32 | 32 | 32 |
| 格式 | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT |
| JESD-30 代码 | S-PBGA-B529 | S-PBGA-B529 | S-PBGA-B529 | S-PBGA-B529 | S-PBGA-B529 |
| JESD-609代码 | e1 | e1 | e1 | e1 | e1 |
| 长度 | 19 mm | 19 mm | 19 mm | 19 mm | 19 mm |
| 湿度敏感等级 | 4 | 4 | 4 | 4 | 4 |
| 端子数量 | 529 | 529 | 529 | 529 | 529 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | FBGA | HBGA | HBGA | FBGA | HBGA |
| 封装等效代码 | BGA529,23X23,32 | BGA529,23X23,32 | BGA529,23X23,32 | BGA529,23X23,32 | BGA529,23X23,32 |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | GRID ARRAY, FINE PITCH | GRID ARRAY, HEAT SINK/SLUG | GRID ARRAY, HEAT SINK/SLUG | GRID ARRAY, FINE PITCH | GRID ARRAY, HEAT SINK/SLUG |
| 峰值回流温度（摄氏度） | 245 | 245 | 245 | 245 | 245 |
| 电源 | 1.3,1.8/3.3 V | 1.3,1.8/3.3 V | 1.3,1.8/3.3 V | 1.3,1.8/3.3 V | 1.3,1.8/3.3 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| RAM（字数） | 8192 | 8192 | 8192 | 8192 | 8192 |
| 座面最大高度 | 3.3 mm | 3.3 mm | 3.3 mm | 3.3 mm | 3.3 mm |
| 最大供电电压 | 1.365 V | 1.365 V | 1.365 V | 1.365 V | 1.365 V |
| 最小供电电压 | 1.235 V | 1.235 V | 1.235 V | 1.235 V | 1.235 V |
| 标称供电电压 | 1.3 V | 1.3 V | 1.3 V | 1.3 V | 1.3 V |
| 表面贴装 | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | OTHER | OTHER | OTHER | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) |
| 端子形式 | BALL | BALL | BALL | BALL | BALL |
| 端子节距 | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm |
| 端子位置 | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 19 mm | 19 mm | 19 mm | 19 mm | 19 mm |
| uPs/uCs/外围集成电路类型 | MICROPROCESSOR CIRCUIT | MICROPROCESSOR CIRCUIT | MICROPROCESSOR CIRCUIT | MICROPROCESSOR CIRCUIT | MICROPROCESSOR CIRCUIT |
| 厂商名称 | Texas Instruments(德州仪器) | - | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | - |
| Factory Lead Time | 1 week | 6 weeks | 12 weeks | - | 6 weeks |
| 是否无铅 | - | 不含铅 | 不含铅 | 含铅 | 不含铅 |
| ECCN代码 | - | 3A991.A.2 | 3A991.A.2 | - | 3A991.A.2 |
| 总线兼容性 | - | ETHERNET; I2C; SPI; UART; USB | ETHERNET; I2C; SPI; UART; USB | - | ETHERNET; I2C; SPI; UART; USB |
| 最大时钟频率 | - | 35 MHz | 35 MHz | - | 35 MHz |
| 外部数据总线宽度 | - | 48 | 48 | - | 48 |
| Base Number Matches | - | 1 | 1 | - | 1 |
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