8-BIT, MROM, 4MHz, MICROCONTROLLER, PDSO28, 0.300 INCH, PLASTIC, SOP-28
参数名称 | 属性值 |
是否无铅 | 含铅 |
是否Rohs认证 | 不符合 |
厂商名称 | ST(意法半导体) |
零件包装代码 | SOIC |
包装说明 | 0.300 INCH, PLASTIC, SOP-28 |
针数 | 28 |
Reach Compliance Code | not_compliant |
具有ADC | NO |
地址总线宽度 | |
位大小 | 8 |
CPU系列 | ST72 |
最大时钟频率 | 4 MHz |
DAC 通道 | NO |
DMA 通道 | NO |
外部数据总线宽度 | |
JESD-30 代码 | R-PDSO-G28 |
JESD-609代码 | e0 |
长度 | 17.9 mm |
I/O 线路数量 | 22 |
端子数量 | 28 |
片上程序ROM宽度 | 8 |
最高工作温度 | 70 °C |
最低工作温度 | |
PWM 通道 | NO |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | SOP |
封装等效代码 | SOP28,.4 |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE |
峰值回流温度(摄氏度) | NOT SPECIFIED |
电源 | 3/5 V |
认证状态 | Not Qualified |
RAM(字节) | 224 |
ROM(单词) | 6144 |
ROM可编程性 | MROM |
座面最大高度 | 2.85 mm |
速度 | 4 MHz |
最大压摆率 | 2.5 mA |
最大供电电压 | 5.5 V |
最小供电电压 | 2.5 V |
标称供电电压 | 5 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | COMMERCIAL |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | GULL WING |
端子节距 | 1.27 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
宽度 | 7.5 mm |
uPs/uCs/外围集成电路类型 | MICROCONTROLLER |
ST7294C6M1 | ST7293C3M1 | ST7293C3B1 | ST7293C3B6 | ST7293C3M6 | ST7294C6B6 | ST7294C6B1 | ST7294C6M6 | |
---|---|---|---|---|---|---|---|---|
描述 | 8-BIT, MROM, 4MHz, MICROCONTROLLER, PDSO28, 0.300 INCH, PLASTIC, SOP-28 | 8-BIT, MROM, 8MHz, MICROCONTROLLER, PDSO28, 0.300 INCH, PLASTIC, SOP-28 | 8-BIT, MROM, 8MHz, MICROCONTROLLER, PDIP28, 0.600 INCH, PLASTIC, DIP-28 | 8-BIT, MROM, 8MHz, MICROCONTROLLER, PDIP28, 0.600 INCH, PLASTIC, DIP-28 | 8-BIT, MROM, 8MHz, MICROCONTROLLER, PDSO28, 0.300 INCH, PLASTIC, SOP-28 | 8-BIT, MROM, 4MHz, MICROCONTROLLER, PDIP28, 0.600 INCH, PLASTIC, DIP-28 | 8-BIT, MROM, 4MHz, MICROCONTROLLER, PDIP28, 0.600 INCH, PLASTIC, DIP-28 | 8-BIT, MROM, 4MHz, MICROCONTROLLER, PDSO28, 0.300 INCH, PLASTIC, SOP-28 |
是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
厂商名称 | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) |
零件包装代码 | SOIC | SOIC | DIP | DIP | SOIC | DIP | DIP | SOIC |
包装说明 | 0.300 INCH, PLASTIC, SOP-28 | 0.300 INCH, PLASTIC, SOP-28 | 0.600 INCH, PLASTIC, DIP-28 | 0.600 INCH, PLASTIC, DIP-28 | 0.300 INCH, PLASTIC, SOP-28 | 0.600 INCH, PLASTIC, DIP-28 | 0.600 INCH, PLASTIC, DIP-28 | 0.300 INCH, PLASTIC, SOP-28 |
针数 | 28 | 28 | 28 | 28 | 28 | 28 | 28 | 28 |
Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | _compli |
具有ADC | NO | NO | NO | NO | NO | NO | NO | NO |
位大小 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
CPU系列 | ST72 | ST72 | ST72 | ST72 | ST72 | ST72 | ST72 | ST72 |
最大时钟频率 | 4 MHz | 8 MHz | 8 MHz | 8 MHz | 8 MHz | 4 MHz | 4 MHz | 4 MHz |
DAC 通道 | NO | NO | NO | NO | NO | NO | NO | NO |
DMA 通道 | NO | NO | NO | NO | NO | NO | NO | NO |
JESD-30 代码 | R-PDSO-G28 | R-PDSO-G28 | R-PDIP-T28 | R-PDIP-T28 | R-PDSO-G28 | R-PDIP-T28 | R-PDIP-T28 | R-PDSO-G28 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
长度 | 17.9 mm | 17.9 mm | 35.64 mm | 35.64 mm | 17.9 mm | 35.64 mm | 35.64 mm | 17.9 mm |
I/O 线路数量 | 22 | 22 | 22 | 22 | 22 | 22 | 22 | 22 |
端子数量 | 28 | 28 | 28 | 28 | 28 | 28 | 28 | 28 |
片上程序ROM宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
最高工作温度 | 70 °C | 70 °C | 70 °C | 85 °C | 85 °C | 85 °C | 70 °C | 85 °C |
PWM 通道 | NO | NO | NO | NO | NO | NO | NO | NO |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | SOP | SOP | DIP | DIP | SOP | DIP | DIP | SOP |
封装等效代码 | SOP28,.4 | SOP28,.4 | DIP28,.6 | DIP28,.6 | SOP28,.4 | DIP28,.6 | DIP28,.6 | SOP28,.4 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | IN-LINE | SMALL OUTLINE | IN-LINE | IN-LINE | SMALL OUTLINE |
峰值回流温度(摄氏度) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
电源 | 3/5 V | 3/5 V | 3/5 V | 3/5 V | 3/5 V | 3/5 V | 3/5 V | 3/5 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
RAM(字节) | 224 | 128 | 128 | 128 | 128 | 224 | 224 | 224 |
ROM(单词) | 6144 | 3328 | 3328 | 3328 | 3328 | 6144 | 6144 | 6144 |
ROM可编程性 | MROM | MROM | MROM | MROM | MROM | MROM | MROM | MROM |
座面最大高度 | 2.85 mm | 2.85 mm | 4.8 mm | 4.8 mm | 2.85 mm | 4.8 mm | 4.8 mm | 2.85 mm |
速度 | 4 MHz | 8 MHz | 8 MHz | 8 MHz | 8 MHz | 4 MHz | 4 MHz | 4 MHz |
最大供电电压 | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | YES | NO | NO | YES | NO | NO | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | GULL WING | GULL WING | THROUGH-HOLE | THROUGH-HOLE | GULL WING | THROUGH-HOLE | THROUGH-HOLE | GULL WING |
端子节距 | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
宽度 | 7.5 mm | 7.5 mm | 15.24 mm | 15.24 mm | 7.5 mm | 15.24 mm | 15.24 mm | 7.5 mm |
uPs/uCs/外围集成电路类型 | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER |
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