|
INA333AIDRGT |
INA333AIDGKRG4 |
INA333AIDGKT |
INA333AIDGKTG4 |
INA333AIDRGR |
描述 |
Low-Power, Zero-Drift, Precision Instrumentation Amplifier 8-SON -40 to 125 |
Low-Power, Zero-Drift, Precision Instrumentation Amplifier 8-VSSOP -40 to 125 |
INST Amp Single R-R O/P ±2.75V/5.5V 8-Pin VSSOP T/R |
Low-Power, Zero-Drift, Precision Instrumentation Amplifier 8-VSSOP -40 to 125 |
Low-Power, Zero-Drift, Precision Instrumentation Amplifier 8-SON -40 to 125 |
Brand Name |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
是否无铅 |
不含铅 |
不含铅 |
不含铅 |
不含铅 |
不含铅 |
是否Rohs认证 |
符合 |
符合 |
符合 |
符合 |
符合 |
零件包装代码 |
SON |
MSOP |
MSOP |
MSOP |
SON |
包装说明 |
HVSON, SOLCC8,.12,20 |
TSSOP, TSSOP8,.19 |
TSSOP, TSSOP8,.19 |
TSSOP, TSSOP8,.19 |
HVSON, SOLCC8,.12,20 |
针数 |
8 |
8 |
8 |
8 |
8 |
Reach Compliance Code |
compliant |
compliant |
compliant |
compliant |
compliant |
ECCN代码 |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
Factory Lead Time |
6 weeks |
12 weeks |
6 weeks |
6 weeks |
6 weeks |
放大器类型 |
INSTRUMENTATION AMPLIFIER |
INSTRUMENTATION AMPLIFIER |
INSTRUMENTATION AMPLIFIER |
INSTRUMENTATION AMPLIFIER |
INSTRUMENTATION AMPLIFIER |
最大平均偏置电流 (IIB) |
0.0002 µA |
0.0002 µA |
0.0002 µA |
0.0002 µA |
0.0002 µA |
标称带宽 (3dB) |
0.15 MHz |
0.15 MHz |
0.15 MHz |
0.15 MHz |
0.15 MHz |
最小共模抑制比 |
100 dB |
100 dB |
100 dB |
100 dB |
100 dB |
最大输入失调电流 (IIO) |
0.0002 µA |
0.0002 µA |
0.0002 µA |
0.0002 µA |
0.0002 µA |
最大输入失调电压 |
25 µV |
25 µV |
25 µV |
25 µV |
25 µV |
JESD-30 代码 |
S-PDSO-N8 |
R-PDSO-G8 |
R-PDSO-G8 |
R-PDSO-G8 |
S-PDSO-N8 |
JESD-609代码 |
e4 |
e4 |
e4 |
e4 |
e4 |
长度 |
3 mm |
3 mm |
3 mm |
3 mm |
3 mm |
湿度敏感等级 |
2 |
2 |
2 |
2 |
2 |
功能数量 |
1 |
1 |
1 |
1 |
1 |
端子数量 |
8 |
8 |
8 |
8 |
8 |
最高工作温度 |
125 °C |
125 °C |
125 °C |
125 °C |
125 °C |
最低工作温度 |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
封装主体材料 |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
封装代码 |
HVSON |
TSSOP |
TSSOP |
TSSOP |
HVSON |
封装等效代码 |
SOLCC8,.12,20 |
TSSOP8,.19 |
TSSOP8,.19 |
TSSOP8,.19 |
SOLCC8,.12,20 |
封装形状 |
SQUARE |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
SQUARE |
封装形式 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
包装方法 |
TR |
TR |
TR |
TR |
TR |
峰值回流温度(摄氏度) |
260 |
260 |
260 |
260 |
260 |
电源 |
2/5 V |
2/5 V |
2/5 V |
2/5 V |
2/5 V |
认证状态 |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
座面最大高度 |
0.8 mm |
1.07 mm |
1.07 mm |
1.07 mm |
0.8 mm |
标称压摆率 |
0.05 V/us |
0.05 V/us |
0.05 V/us |
0.05 V/us |
0.05 V/us |
最大压摆率 |
0.08 mA |
0.08 mA |
0.08 mA |
0.08 mA |
0.08 mA |
供电电压上限 |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
标称供电电压 (Vsup) |
5 V |
5 V |
5 V |
5 V |
5 V |
表面贴装 |
YES |
YES |
YES |
YES |
YES |
温度等级 |
AUTOMOTIVE |
AUTOMOTIVE |
AUTOMOTIVE |
AUTOMOTIVE |
AUTOMOTIVE |
端子面层 |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
端子形式 |
NO LEAD |
GULL WING |
GULL WING |
GULL WING |
NO LEAD |
端子节距 |
0.5 mm |
0.65 mm |
0.65 mm |
0.65 mm |
0.5 mm |
端子位置 |
DUAL |
DUAL |
DUAL |
DUAL |
DUAL |
处于峰值回流温度下的最长时间 |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
最大电压增益 |
1000 |
1000 |
1000 |
1000 |
1000 |
最小电压增益 |
1 |
1 |
1 |
1 |
1 |
标称电压增益 |
10 |
10 |
10 |
10 |
10 |
宽度 |
3 mm |
3 mm |
3 mm |
3 mm |
3 mm |
Base Number Matches |
1 |
1 |
1 |
1 |
1 |