Power Supply Management Circuit, Fixed, 1 Channel, CDIP8, CERDIP-8
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Maxim(美信半导体) |
| 零件包装代码 | DIP |
| 包装说明 | CERDIP-8 |
| 针数 | 8 |
| Reach Compliance Code | not_compliant |
| ECCN代码 | EAR99 |
| 可调阈值 | NO |
| 模拟集成电路 - 其他类型 | POWER SUPPLY MANAGEMENT CIRCUIT |
| JESD-30 代码 | R-GDIP-T8 |
| JESD-609代码 | e0 |
| 信道数量 | 1 |
| 功能数量 | 1 |
| 端子数量 | 8 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 封装主体材料 | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 认证状态 | Not Qualified |
| 座面最大高度 | 5.08 mm |
| 表面贴装 | NO |
| 温度等级 | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 7.62 mm |
| MAX790MJA | MAX790C/D | MAX790CPA | MAX790EPA | MAX791CWE | |
|---|---|---|---|---|---|
| 描述 | Power Supply Management Circuit, Fixed, 1 Channel, CDIP8, CERDIP-8 | Power Supply Management Circuit, Fixed, 1 Channel, DIE | Power Supply Management Circuit, Fixed, 1 Channel, PDIP8, PLASTIC, DIP-8 | Power Supply Management Circuit, Fixed, 1 Channel, PDIP8, PLASTIC, DIP-8 | Power Supply Management Circuit, Fixed, 1 Channel, PDSO16, 0.300 INCH, SOIC-16 |
| 是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) |
| 零件包装代码 | DIP | DIE | DIP | DIP | SOIC |
| 包装说明 | CERDIP-8 | DIE, | PLASTIC, DIP-8 | PLASTIC, DIP-8 | SOP, |
| 针数 | 8 | 8 | 8 | 8 | 16 |
| Reach Compliance Code | not_compliant | compliant | not_compliant | not_compliant | compliant |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 可调阈值 | NO | NO | NO | NO | NO |
| 模拟集成电路 - 其他类型 | POWER SUPPLY MANAGEMENT CIRCUIT | POWER SUPPLY MANAGEMENT CIRCUIT | POWER SUPPLY MANAGEMENT CIRCUIT | POWER SUPPLY MANAGEMENT CIRCUIT | POWER SUPPLY MANAGEMENT CIRCUIT |
| JESD-30 代码 | R-GDIP-T8 | R-XUUC-N8 | R-PDIP-T8 | R-PDIP-T8 | R-PDSO-G16 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 |
| 信道数量 | 1 | 1 | 1 | 1 | 1 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 8 | 8 | 8 | 8 | 16 |
| 最高工作温度 | 125 °C | 70 °C | 70 °C | 85 °C | 70 °C |
| 封装主体材料 | CERAMIC, GLASS-SEALED | UNSPECIFIED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | DIP | DIE | DIP | DIP | SOP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | UNCASED CHIP | IN-LINE | IN-LINE | SMALL OUTLINE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | 240 |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 表面贴装 | NO | YES | NO | NO | YES |
| 温度等级 | MILITARY | COMMERCIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | TIN LEAD | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | TIN LEAD |
| 端子形式 | THROUGH-HOLE | NO LEAD | THROUGH-HOLE | THROUGH-HOLE | GULL WING |
| 端子位置 | DUAL | UPPER | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 座面最大高度 | 5.08 mm | - | 4.572 mm | 4.572 mm | 2.642 mm |
| 端子节距 | 2.54 mm | - | 2.54 mm | 2.54 mm | 1.27 mm |
| 宽度 | 7.62 mm | - | 7.62 mm | 7.62 mm | 7.6745 mm |
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