IC IC,I/O PORT,8-BIT,BIPOLAR,SOP,24PIN,PLASTIC, Parallel IO Port
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 包装说明 | SOP, SOP24,.4 |
| Reach Compliance Code | not_compliant |
| JESD-30 代码 | R-PDSO-G24 |
| 位数 | 8 |
| 端子数量 | 24 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOP |
| 封装等效代码 | SOP24,.4 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子形式 | GULL WING |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| SN74S412D3 | SN74S412JP4 | SN74S412J4 | SN74S412FN3 | SN74S412NP3 | SN74S412N1 | SN74S412D | SN74S412NP1 | SNC54S412J | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | IC IC,I/O PORT,8-BIT,BIPOLAR,SOP,24PIN,PLASTIC, Parallel IO Port | IC IC,I/O PORT,8-BIT,BIPOLAR,DIP,24PIN,CERAMIC, Parallel IO Port | IC IC,I/O PORT,8-BIT,BIPOLAR,DIP,24PIN,CERAMIC, Parallel IO Port | IC IC,I/O PORT,8-BIT,BIPOLAR,LDCC,28PIN,PLASTIC, Parallel IO Port | IC IC,I/O PORT,8-BIT,BIPOLAR,DIP,24PIN,PLASTIC, Parallel IO Port | IC IC,I/O PORT,8-BIT,BIPOLAR,DIP,24PIN,PLASTIC, Parallel IO Port | IC,I/O PORT,8-BIT,BIPOLAR,SOP,24PIN,PLASTIC | IC,I/O PORT,8-BIT,BIPOLAR,DIP,24PIN,PLASTIC | IC,I/O PORT,8-BIT,BIPOLAR,DIP,24PIN,CERAMIC |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
| 包装说明 | SOP, SOP24,.4 | DIP, DIP24,.6 | DIP, DIP24,.6 | QCCJ, LDCC28,.5SQ | DIP, DIP24,.6 | DIP, DIP24,.6 | SOP, SOP24,.4 | DIP, DIP24,.6 | DIP, DIP24,.6 |
| Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant |
| JESD-30 代码 | R-PDSO-G24 | R-XDIP-T24 | R-XDIP-T24 | S-PQCC-J28 | R-PDIP-T24 | R-PDIP-T24 | R-PDSO-G24 | R-PDIP-T24 | R-XDIP-T24 |
| 位数 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 端子数量 | 24 | 24 | 24 | 28 | 24 | 24 | 24 | 24 | 24 |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 125 °C |
| 封装主体材料 | PLASTIC/EPOXY | CERAMIC | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC |
| 封装代码 | SOP | DIP | DIP | QCCJ | DIP | DIP | SOP | DIP | DIP |
| 封装等效代码 | SOP24,.4 | DIP24,.6 | DIP24,.6 | LDCC28,.5SQ | DIP24,.6 | DIP24,.6 | SOP24,.4 | DIP24,.6 | DIP24,.6 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | IN-LINE | IN-LINE | CHIP CARRIER | IN-LINE | IN-LINE | SMALL OUTLINE | IN-LINE | IN-LINE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 表面贴装 | YES | NO | NO | YES | NO | NO | YES | NO | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | MILITARY |
| 端子形式 | GULL WING | THROUGH-HOLE | THROUGH-HOLE | J BEND | THROUGH-HOLE | THROUGH-HOLE | GULL WING | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL | QUAD | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
