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PNX1701EH/G,557

产品描述IC SPECIALTY CONSUMER CIRCUIT, PBGA456, 27 X 27MM, 1.75 MM HEIGHT, LEAD FREE, PLASTIC, MS-034, SOT900-1, BGA-456, Consumer IC:Other
产品类别其他集成电路(IC)    消费电路   
文件大小3MB,共832页
制造商NXP(恩智浦)
官网地址https://www.nxp.com
标准  
下载文档 详细参数 选型对比 全文预览

PNX1701EH/G,557概述

IC SPECIALTY CONSUMER CIRCUIT, PBGA456, 27 X 27MM, 1.75 MM HEIGHT, LEAD FREE, PLASTIC, MS-034, SOT900-1, BGA-456, Consumer IC:Other

PNX1701EH/G,557规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
厂商名称NXP(恩智浦)
零件包装代码BGA
包装说明BGA,
针数456
制造商包装代码SOT-900-1
Reach Compliance Codecompliant
商用集成电路类型CONSUMER CIRCUIT
JESD-30 代码R-PBGA-B456
长度27 mm
湿度敏感等级3
功能数量1
端子数量456
最高工作温度85 °C
最低工作温度
封装主体材料PLASTIC/EPOXY
封装代码BGA
封装形状RECTANGULAR
封装形式GRID ARRAY
峰值回流温度(摄氏度)250
认证状态Not Qualified
座面最大高度2.45 mm
最大供电电压 (Vsup)1.37 V
最小供电电压 (Vsup)1.23 V
表面贴装YES
技术CMOS
温度等级OTHER
端子形式BALL
端子节距1 mm
端子位置BOTTOM
处于峰值回流温度下的最长时间30
宽度27 mm

PNX1701EH/G,557相似产品对比

PNX1701EH/G,557 PNX1700EH/G,557 PNX1700EH/G PNX1701EH/G PNX1701EH PNX1702EH/G,557 PNX1702EH/G PNX1702EH
描述 IC SPECIALTY CONSUMER CIRCUIT, PBGA456, 27 X 27MM, 1.75 MM HEIGHT, LEAD FREE, PLASTIC, MS-034, SOT900-1, BGA-456, Consumer IC:Other IC SPECIALTY CONSUMER CIRCUIT, PBGA456, 27 X 27MM, 1.75 MM HEIGHT, LEAD FREE, PLASTIC, MS-034, SOT900-1, BGA-456, Consumer IC:Other IC SPECIALTY CONSUMER CIRCUIT, PBGA456, 27 X 27MM, 1.75 MM HEIGHT, LEAD FREE, PLASTIC, MS-034, SOT900-1, BGA-456, Consumer IC:Other IC SPECIALTY CONSUMER CIRCUIT, PBGA456, 27 X 27MM, 1.75 MM HEIGHT, LEAD FREE, PLASTIC, MS-034, SOT900-1, BGA-456, Consumer IC:Other IC SPECIALTY CONSUMER CIRCUIT, PBGA456, 27 X 27MM, 1.75 MM HEIGHT, PLASTIC, MS-034, SOT900-1, BGA-456, Consumer IC:Other IC SPECIALTY CONSUMER CIRCUIT, PBGA456, 27 X 27MM, 1.75 MM HEIGHT, LEAD FREE, PLASTIC, MS-034, SOT900-1, BGA-456, Consumer IC:Other IC SPECIALTY CONSUMER CIRCUIT, PBGA456, 27 X 27MM, 1.75 MM HEIGHT, LEAD FREE, PLASTIC, MS-034, SOT900-1, BGA-456, Consumer IC:Other IC SPECIALTY CONSUMER CIRCUIT, PBGA456, 27 X 27MM, 1.75 MM HEIGHT, PLASTIC, MS-034, SOT900-1, BGA-456, Consumer IC:Other
厂商名称 NXP(恩智浦) NXP(恩智浦) NXP(恩智浦) NXP(恩智浦) NXP(恩智浦) NXP(恩智浦) NXP(恩智浦) NXP(恩智浦)
零件包装代码 BGA BGA BGA BGA BGA BGA BGA BGA
包装说明 BGA, BGA, BGA, BGA, BGA, BGA, BGA, BGA,
针数 456 456 456 456 456 456 456 456
制造商包装代码 SOT-900-1 SOT-900-1 SOT-900-1 SOT-900-1 SOT-900-1 SOT-900-1 SOT-900-1 SOT-900-1
Reach Compliance Code compliant compliant unknown unknown unknown compliant unknown unknown
商用集成电路类型 CONSUMER CIRCUIT CONSUMER CIRCUIT CONSUMER CIRCUIT CONSUMER CIRCUIT CONSUMER CIRCUIT CONSUMER CIRCUIT CONSUMER CIRCUIT CONSUMER CIRCUIT
JESD-30 代码 R-PBGA-B456 R-PBGA-B456 R-PBGA-B456 R-PBGA-B456 R-PBGA-B456 R-PBGA-B456 R-PBGA-B456 R-PBGA-B456
长度 27 mm 27 mm 27 mm 27 mm 27 mm 27 mm 27 mm 27 mm
功能数量 1 1 1 1 1 1 1 1
端子数量 456 456 456 456 456 456 456 456
最高工作温度 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 BGA BGA BGA BGA BGA BGA BGA BGA
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 2.45 mm 2.45 mm 2.45 mm 2.45 mm 2.45 mm 2.45 mm 2.45 mm 2.45 mm
最大供电电压 (Vsup) 1.37 V 1.37 V 1.37 V 1.37 V 1.37 V 1.37 V 1.37 V 1.37 V
最小供电电压 (Vsup) 1.23 V 1.23 V 1.23 V 1.23 V 1.23 V 1.23 V 1.23 V 1.23 V
表面贴装 YES YES YES YES YES YES YES YES
技术 CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 OTHER OTHER OTHER OTHER OTHER OTHER OTHER OTHER
端子形式 BALL BALL BALL BALL BALL BALL BALL BALL
端子节距 1 mm 1 mm 1 mm 1 mm 1 mm 1 mm 1 mm 1 mm
端子位置 BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM
宽度 27 mm 27 mm 27 mm 27 mm 27 mm 27 mm 27 mm 27 mm
Source Url Status Check Date - - 2013-06-14 00:00:00 2013-06-14 00:00:00 2013-06-14 00:00:00 - 2013-06-14 00:00:00 2013-06-14 00:00:00

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