IC 64K X 4 CACHE SRAM, 25 ns, PDSO28, 0.300 INCH, PLASTIC, SOJ-28, Static RAM
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Toshiba(东芝) |
| 零件包装代码 | SOJ |
| 针数 | 28 |
| Reach Compliance Code | unknown |
| 最长访问时间 | 25 ns |
| JESD-30 代码 | R-PDSO-J28 |
| JESD-609代码 | e0 |
| 长度 | 18.42 mm |
| 内存密度 | 262144 bit |
| 内存集成电路类型 | CACHE SRAM |
| 内存宽度 | 4 |
| 功能数量 | 1 |
| 端子数量 | 28 |
| 字数 | 65536 words |
| 字数代码 | 64000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 64KX4 |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOJ |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 并行/串行 | PARALLEL |
| 峰值回流温度（摄氏度） | 240 |
| 认证状态 | Not Qualified |
| 座面最大高度 | 3.7 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 温度等级 | COMMERCIAL |
| 端子面层 | TIN LEAD |
| 端子形式 | J BEND |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 7.7 mm |
| TC55465AJ-25 | TC55465AP-35 | TC55465AJ-15 | TC55465AJ-35 | TC55465AJ-20 | TC55465AP-25 | TC55465AP-20 | |
|---|---|---|---|---|---|---|---|
| 描述 | IC 64K X 4 CACHE SRAM, 25 ns, PDSO28, 0.300 INCH, PLASTIC, SOJ-28, Static RAM | IC 64K X 4 CACHE SRAM, 35 ns, PDIP28, 0.300 INCH, PLASTIC, DIP-28, Static RAM | IC 64K X 4 CACHE SRAM, 15 ns, PDSO28, 0.300 INCH, PLASTIC, SOJ-28, Static RAM | IC 64K X 4 CACHE SRAM, 35 ns, PDSO28, 0.300 INCH, PLASTIC, SOJ-28, Static RAM | IC 64K X 4 CACHE SRAM, 20 ns, PDSO28, 0.300 INCH, PLASTIC, SOJ-28, Static RAM | IC 64K X 4 CACHE SRAM, 25 ns, PDIP28, 0.300 INCH, PLASTIC, DIP-28, Static RAM | IC 64K X 4 CACHE SRAM, 20 ns, PDIP28, 0.300 INCH, PLASTIC, DIP-28, Static RAM |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | Toshiba(东芝) | Toshiba(东芝) | Toshiba(东芝) | Toshiba(东芝) | Toshiba(东芝) | Toshiba(东芝) | Toshiba(东芝) |
| 零件包装代码 | SOJ | DIP | SOJ | SOJ | SOJ | DIP | DIP |
| 针数 | 28 | 28 | 28 | 28 | 28 | 28 | 28 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknow |
| 最长访问时间 | 25 ns | 35 ns | 15 ns | 35 ns | 20 ns | 25 ns | 20 ns |
| JESD-30 代码 | R-PDSO-J28 | R-PDIP-T28 | R-PDSO-J28 | R-PDSO-J28 | R-PDSO-J28 | R-PDIP-T28 | R-PDIP-T28 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 长度 | 18.42 mm | 34.9 mm | 18.42 mm | 18.42 mm | 18.42 mm | 34.9 mm | 34.9 mm |
| 内存密度 | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bi |
| 内存集成电路类型 | CACHE SRAM | CACHE SRAM | CACHE SRAM | CACHE SRAM | CACHE SRAM | CACHE SRAM | CACHE SRAM |
| 内存宽度 | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 28 | 28 | 28 | 28 | 28 | 28 | 28 |
| 字数 | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words |
| 字数代码 | 64000 | 64000 | 64000 | 64000 | 64000 | 64000 | 64000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 组织 | 64KX4 | 64KX4 | 64KX4 | 64KX4 | 64KX4 | 64KX4 | 64KX4 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SOJ | DIP | SOJ | SOJ | SOJ | DIP | DIP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | IN-LINE |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 峰值回流温度（摄氏度） | 240 | 240 | 240 | 240 | 240 | 240 | 240 |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 3.7 mm | 4.45 mm | 3.7 mm | 3.7 mm | 3.7 mm | 4.45 mm | 4.45 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | NO | YES | YES | YES | NO | NO |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | TIN LEAD | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | J BEND | THROUGH-HOLE | J BEND | J BEND | J BEND | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 7.7 mm | 7.62 mm | 7.7 mm | 7.7 mm | 7.7 mm | 7.62 mm | 7.62 mm |
| 是否无铅 | - | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 |
| 包装说明 | - | DIP, DIP28,.3 | SOJ, SOJ28,.34 | SOJ, SOJ28,.34 | SOJ, SOJ28,.34 | DIP, DIP28,.3 | DIP, DIP28,.3 |
| ECCN代码 | - | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| I/O 类型 | - | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
| 输出特性 | - | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 封装等效代码 | - | DIP28,.3 | SOJ28,.34 | SOJ28,.34 | SOJ28,.34 | DIP28,.3 | DIP28,.3 |
| 电源 | - | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 最大待机电流 | - | 0.001 A | 0.001 A | 0.001 A | 0.001 A | 0.001 A | 0.001 A |
| 最小待机电流 | - | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 最大压摆率 | - | 0.1 mA | 0.12 mA | 0.1 mA | 0.12 mA | 0.12 mA | 0.12 mA |
| 技术 | - | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
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