IC,MICROCONTROLLER,8-BIT,68HC08 CPU,CMOS,TSSOP,16PIN,PLASTIC
| 参数名称 | 属性值 |
| 厂商名称 | NXP(恩智浦) |
| Reach Compliance Code | unknown |
| 位大小 | 8 |
| CPU系列 | 68HC08 |
| JESD-30 代码 | R-PDSO-G16 |
| 端子数量 | 16 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | TSSOP |
| 封装等效代码 | TSSOP16,.25 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 电源 | 3.3/5 V |
| 认证状态 | Not Qualified |
| RAM（字节） | 128 |
| ROM（单词） | 2048 |
| ROM可编程性 | FLASH |
| 速度 | 8 MHz |
| 最大压摆率 | 4.5 mA |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子形式 | GULL WING |
| 端子节距 | 0.635 mm |
| 端子位置 | DUAL |
| MC68HC908QL2CDT | MC68HC908QL3VDT | MC68HC908QL2VDW | MC68HC908QL3CDT | MC68HC908QL2MDT | MC68HC908QL2CDW | MC68HC908QL3MDW | MC68HC908QL3MDT | |
|---|---|---|---|---|---|---|---|---|
| 描述 | IC,MICROCONTROLLER,8-BIT,68HC08 CPU,CMOS,TSSOP,16PIN,PLASTIC | IC,MICROCONTROLLER,8-BIT,68HC08 CPU,CMOS,TSSOP,16PIN,PLASTIC | IC,MICROCONTROLLER,8-BIT,68HC08 CPU,CMOS,SOP,16PIN,PLASTIC | IC,MICROCONTROLLER,8-BIT,68HC08 CPU,CMOS,TSSOP,16PIN,PLASTIC | IC,MICROCONTROLLER,8-BIT,68HC08 CPU,CMOS,TSSOP,16PIN,PLASTIC | IC,MICROCONTROLLER,8-BIT,68HC08 CPU,CMOS,SOP,16PIN,PLASTIC | IC,MICROCONTROLLER,8-BIT,68HC08 CPU,CMOS,SOP,16PIN,PLASTIC | IC,MICROCONTROLLER,8-BIT,68HC08 CPU,CMOS,TSSOP,16PIN,PLASTIC |
| 厂商名称 | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) |
| Reach Compliance Code | unknown | unknown | unknown | unknown | compliant | unknown | unknown | unknown |
| 位大小 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| CPU系列 | 68HC08 | 68HC08 | 68HC08 | 68HC08 | 68HC08 | 68HC08 | 68HC08 | 68HC08 |
| JESD-30 代码 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 |
| 端子数量 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| 最高工作温度 | 85 °C | 105 °C | 105 °C | 85 °C | 125 °C | 85 °C | 125 °C | 125 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | TSSOP | TSSOP | SOP | TSSOP | TSSOP | SOP | SOP | TSSOP |
| 封装等效代码 | TSSOP16,.25 | TSSOP16,.25 | SOP16,.4 | TSSOP16,.25 | TSSOP16,.25 | SOP16,.4 | SOP16,.4 | TSSOP16,.25 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 电源 | 3.3/5 V | 3.3/5 V | 3.3/5 V | 3.3/5 V | 3.3/5 V | 3.3/5 V | 3.3/5 V | 3.3/5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| RAM（字节） | 128 | 128 | 128 | 128 | 128 | 128 | 128 | 128 |
| ROM（单词） | 2048 | 4096 | 2048 | 4096 | 2048 | 2048 | 4096 | 4096 |
| ROM可编程性 | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH |
| 速度 | 8 MHz | 8 MHz | 8 MHz | 8 MHz | 8 MHz | 8 MHz | 8 MHz | 8 MHz |
| 最大压摆率 | 4.5 mA | 4.5 mA | 4.5 mA | 4.5 mA | 4.5 mA | 4.5 mA | 4.5 mA | 4.5 mA |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | AUTOMOTIVE | INDUSTRIAL | AUTOMOTIVE | AUTOMOTIVE |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 0.635 mm | 0.635 mm | 1.27 mm | 0.635 mm | 0.65 mm | 1.27 mm | 1.27 mm | 0.635 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
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