ON Semiconductor Confidential and Proprietary
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AR1335HS: 1/3.2-Inch 13Mp CMOS Digital Image Sensor
Features
1/3.2-Inch 13 Mp CMOS Digital Image Sensor
AR1335HS Datasheet, Rev. 0
For the latest datasheet, please visit www.onsemi.com
Features
• High speed sensor supporting 13MP(4:3) at 30fps
and 1080P up to 90fps
• Advanced 1.1 um pixel BSI technology
• Data interfaces: two-, three-, and four-lane serial
mobile industry processor interface (MIPI)
• Bit-depth compression available for MIPI Interface:
10-8 and 10-6 to enable lower bandwidth receivers
for full frame rate applications
• 3D synchronization controls to enable stereo video
capture
• 6.8 kbits one-time programmable memory (OTPM)
for storing shading correction coefficients and
module information
• Programmable controls: gain, horizontal and vertical
blanking, auto black level offset correction, frame
size/rate, exposure, left-right and top-bottom image
reversal, window size, and panning
• Two on-die phase-locked loop (PLL) oscillators for
super low noise performance
• On-chip temperature sensor
• Bayer pattern horizontal down-size scaler
• Simple two-wire fast-mode+ serial interface
• Low dark current
• Interlaced multi-exposure readout enabling High
Dynamic Range (HDR) still and video applications
• On-chip lens shading correction
• Support for external mechanical shutter
• Support for external LED or Xenon Flash
• Extended Flash duration up to start of frame readout
Table 1:
Parameter
Optical format
Active pixels
Pixel size
Key Performance Parameters
Value
1/3.2 -inch 13 Mp (4:3)
4208H x 3120V
1.1
m
Back Side Illuminated (BSI)
11°
6.3 mm x 5.7 mm
6 - 48 MHz
4-lane MIPI (2- and 3-lane
supported);
Max data rate: 1.2Gbps/lane
skip2
bin2
skip3
bin3
skip4
bin4
skip2bin2
10 bits, on-die
1x – 7.75x
Up to 7.98x
Adjustable scaling up to 8x
10-bit, controlled by 2-wire serial I/F
DPCM: 10-8-10, 10-6-10
Frame rate and exposure
synchronization
2.6 - 2.9 V (2.7 V nominal)
1.7 - 1.9 V (1.8 V nominal)
Chief ray angle (CRA)
Die size
Input clock frequency
Interface
Subsampling modes
(column and row)
ADC resolution
Analog gain
Digital gain
Scaler
Temperature sensor
Compression
3D support
V
AA
, V
AA
_PIX
Supply
voltage V
DD
,
V
DD
_ANA,
V
DD
_PLL,
V
DD
_PHY
Responsivity
SNR
MAX
Dynamic Range
V
DD
_IO,
V
DD
IO_ANA
Applications
•
•
•
•
•
•
Cellular phones
Digital still cameras
PC cameras
PDAs
Sports Action Camera
Drone
1.14 - 1.3 V (1.2 V nominal)
270mW at 60°C (TYP) at 13Mp 30 fps
4700 e
-
/lux-sec
37 dB
69 dB
Power consumption
Operating Temperature
-30°C to +70°C
Range (at junction) - T
J
AR1335HS/D Rev. 0, 4/16 EN
1
©Semiconductor Components Industries, LLC 2016,
‡This document contains information on a new product. Specifications and information herein are subject to change without notice.
ON Semiconductor Confidential and Proprietary
Advance
AR1335HS: 1/3.2-Inch 13Mp CMOS Digital Image Sensor
Ordering Information
Table 2:
Mode of Operation and Power
Power
Consumption
[mW]
Mode
Resolution
Mode
4:3 Snapshot Mode
HFOV
FPS
13 M full resolution
13 M full resolution
4208x3120
4208x3120
13M full mode
13M full mode
100%
100%
30
24
270
250
16:9 Video Mode 30FPS ISP Scaling
4K, 1080P, 720P
4000x2250
Cropping
16:9 Video Mode 30FPS
4K UHD
4K Cinema
1080p
1080p LP
720p
3840 x 2160
4096 x 2160
1920 x 1080
1920 x 1080
1280 x 720
Cropping
Cropping
Crop+Subsampling+Scaling
Crop+Subsampling+Scaling
Crop+Subsampling+Scaling
91%
91%
91%
91%
91%
30
30
30
30
30
230
235
160
135
140
95%
30
258
16:9 Video Mode 60FPS ISP Scaling
1080p,720p
4000x1124
Crop+Subsampling
16:9 Video Mode 60FPS
1080p
1080p LP
720p
1920 x 1080
1920 x 1080
1280 x 720
Crop+Subsampling+Scaling
Crop+Subsampling+Scaling
Crop+Subsampling+Scaling
91%
91%
91%
60
60
60
160
135
140
95%
60
255
16:9 Video Mode 90FPS ISP Scaling
1080P
4000x1124
Crop+Subsampling
95%
90
320
Ordering Information
Table 3:
Part Number
AR1335HSSC11SMAA0-DPBR
AR1335HSSC11SMAA0-DPBR-E
AR1335HSSC11SMAA0-DRBR
AR1335HSSC11SMAAH3-GEVB
Available Part Numbers
Product Description
CLCC Package
CLCC Package
CLCC Package
CLCC Package
Orderable Product Attribute Description
Dry Pack, Protective film, AR Glass
Dry Pack, Protective film, AR Glass, Sample
Dry Pack, Without Protective Film, AR Glass,
Demo Board
AR1335HS/D Rev. 0, 4/16 EN
2
©Semiconductor Components Industries, LLC, 2016.
ON Semiconductor Confidential and Proprietary
Advance
AR1335HS: 1/3.2-Inch 13Mp CMOS Digital Image Sensor
Table of Contents
Table of Contents
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1
Ordering Information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2
General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4
Functional Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4
Pixel Array . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6
Operating Modes. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6
Typical Connections. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7
Signal Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8
Output Data Format . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9
Two-Wire Serial Register Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9
Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14
Reading the Sensor Revision Number . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17
Programming Restrictions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18
Control of the Signal Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21
System States . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22
Soft Reset Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24
General Purpose Input and Output. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25
Streaming/Standby Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25
Clocking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .26
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .28
Additional Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .40
Multi-Camera Synchronization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .41
Gain . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .43
Sensor Core Digital Data Path . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .46
Timing Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .51
Image Sensor Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .55
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .58
Package Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .66
Package Mechanical Drawing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .67
AR1335HS/D Rev. 0, 4/16 EN
3
©Semiconductor Components Industries, LLC, 2016.
ON Semiconductor Confidential and Proprietary
Advance
AR1335HS: 1/3.2-Inch 13Mp CMOS Digital Image Sensor
General Description
General Description
The ON Semiconductor AR1335HS is a 1/3.2-inch BSI (back side illuminated) CMOS
active-pixel digital image sensor with a pixel array of 4208H
x
3120V (4224H
x
3136V
including border pixels). It incorporates sophisticated on-chip camera functions such as
mirroring, column and row skip modes, and snapshot mode. It is programmable
through a simple two-wire serial interface and has very low power consumption.
The AR1335HS digital image sensor features ON Semiconductor’s breakthrough low-
noise CMOS imaging technology that achieves near-CCD image quality (based on
signal-to-noise ratio and low-light sensitivity) while maintaining the inherent size, cost,
and integration advantages of CMOS.
The AR1335HS sensor can generate full resolution image at up to 30 frames per second
(fps). An on-chip analog-to-digital converter (ADC) generates a 10-bit value for each
pixel.
Functional Overview
The AR1335HS is a progressive-scan sensor that generates a stream of pixel data at a
constant frame rate. It uses an on-chip, phase-locked loop (PLL) to generate all internal
clocks from a single master input clock running between 6 and 48 MHz. The maximum
data rate is 1.2 Gbps per lane. A block diagram of the sensor is shown in Figure 1.
Figure 1:
Block Diagram
V
DD
_IO, V
DD
IO_ANA
V
AA
,
V
AA
_PIX
Imaging Sensor Core
Row Driver
DV
DD
, DV
DD
_ANA, DV
DD
_PLL
DV
DD
_PHY
Digital Processing Image Output
Data Calibration
FIFO & Optional
Compression
Digital Gain
Pixel
Array
Analog
Signal
Chain
ADC Gain
MIPI
Serial Data
Output [3:0]
Scaler
10-bit
Temperature
Sensor
Gain
Control
AR1335 S
PLL
Timing Control
XSHUTDOWN
Test Pattern
Generator
Register Control
Two-Wire
Serial Interface
GPIO[1:0]
External
Clock
GPI[3:2]
S
CLK
AR1335HS/D Rev. 0, 4/16 EN
4
S
DATA
©Semiconductor Components Industries, LLC, 2016.
MIPI
ON Semiconductor Confidential and Proprietary
Advance
AR1335HS: 1/3.2-Inch 13Mp CMOS Digital Image Sensor
Functional Overview
The core of the sensor is a 13Mp active-pixel array. The timing and control circuitry
sequences through the rows of the array, resetting and then reading each row in turn. In
the time interval between resetting a row and reading that row, the pixels in the row inte-
grate incident light. The exposure is controlled by varying the time interval between
reset and readout. Once a row has been read, the data from the columns is sequenced
through an analog signal chain (providing offset correction and gain), and then through
an ADC. The output from the ADC is a 10-bit value for each pixel in the array. The ADC
output passes through a digital processing signal chain (which provides further data
path corrections and applies digital gain).
The pixel array contains optically active and light-shielded (“dark”) pixels. The dark
pixels are used to provide data for on-chip offset-correction algorithms (“black level”
control).
The sensor contains a set of control and status registers that can be used to control many
aspects of the sensor behavior including the frame size, exposure, and gain setting.
These registers can be accessed through a two-wire serial interface.
The output from the sensor is a Bayer pattern; alternate rows are a sequence of either
green and red pixels or blue and green pixels. The offset and gain stages of the analog
signal chain provide global per-color control of the pixel data.
The control registers, timing and control, and digital processing functions shown in
Figure 1 on page 4 are partitioned into three logical parts:
• A sensor core that provides array control and data path corrections. The output of the
sensor core is a 10-bit serial pixel data stream qualified by a 4-lane MIPI output clock.
• Data processing functions, including a digital shading correction block to compen-
sate for color/brightness shading introduced by the lens or chief ray angle (CRA)
curve mismatch, digital gain, and dynamic defect correction
• Output processing functions, including a horizontal scaler, a limiter, a data
compressor, an output FIFO, and a serializer.
The output FIFO is present to prevent data bursts by keeping the data rate continuous.
Programmable slew rates are also available to reduce the effect of electromagnetic inter-
ference from the output interface.
A flash output signal is provided to allow an external xenon or LED light source to
synchronize with the sensor exposure time. Additional I/O signals support the provision
of an external mechanical shutter.
AR1335HS/D Rev. 0, 4/16 EN
5
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