IC,SMPS CONTROLLER,CURRENT-MODE,BIPOLAR,SOP,8PIN,PLASTIC
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | NXP(恩智浦) |
包装说明 | SOP, SOP8,.25 |
Reach Compliance Code | unknown |
控制模式 | CURRENT-MODE |
JESD-30 代码 | R-PDSO-G8 |
JESD-609代码 | e0 |
端子数量 | 8 |
最高工作温度 | 70 °C |
最低工作温度 | |
最大输出电流 | 0.2 A |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | SOP |
封装等效代码 | SOP8,.25 |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE |
认证状态 | Not Qualified |
表面贴装 | YES |
最大切换频率 | 500 kHz |
技术 | BIPOLAR |
温度等级 | COMMERCIAL |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | GULL WING |
端子节距 | 1.27 mm |
端子位置 | DUAL |
UC3844BD1 | UC3844BN | UC2845BD1 | UC3845BVD | UC2844BD | UC3845BVN | UC3844BVN | |
---|---|---|---|---|---|---|---|
描述 | IC,SMPS CONTROLLER,CURRENT-MODE,BIPOLAR,SOP,8PIN,PLASTIC | IC,SMPS CONTROLLER,CURRENT-MODE,BIPOLAR,DIP,8PIN,PLASTIC | IC,SMPS CONTROLLER,CURRENT-MODE,BIPOLAR,SOP,8PIN,PLASTIC | IC,SMPS CONTROLLER,CURRENT-MODE,BIPOLAR,SOP,14PIN,PLASTIC | IC,SMPS CONTROLLER,CURRENT-MODE,BIPOLAR,SOP,14PIN,PLASTIC | IC,SMPS CONTROLLER,CURRENT-MODE,BIPOLAR,DIP,8PIN,PLASTIC | IC,SMPS CONTROLLER,CURRENT-MODE,BIPOLAR,DIP,8PIN,PLASTIC |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
包装说明 | SOP, SOP8,.25 | DIP, DIP8,.3 | SOP, SOP8,.25 | SOP, SOP14,.25 | SOP, SOP14,.25 | DIP, DIP8,.3 | DIP, DIP8,.3 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
控制模式 | CURRENT-MODE | CURRENT-MODE | CURRENT-MODE | CURRENT-MODE | CURRENT-MODE | CURRENT-MODE | CURRENT-MODE |
JESD-30 代码 | R-PDSO-G8 | R-PDIP-T8 | R-PDSO-G8 | R-PDSO-G14 | R-PDSO-G14 | R-PDIP-T8 | R-PDIP-T8 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
端子数量 | 8 | 8 | 8 | 14 | 14 | 8 | 8 |
最高工作温度 | 70 °C | 70 °C | 85 °C | 105 °C | 85 °C | 105 °C | 105 °C |
最低工作温度 | - | - | -25 °C | -40 °C | -25 °C | -40 °C | -40 °C |
最大输出电流 | 0.2 A | 0.2 A | 0.2 A | 0.2 A | 0.2 A | 0.2 A | 0.2 A |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | SOP | DIP | SOP | SOP | SOP | DIP | DIP |
封装等效代码 | SOP8,.25 | DIP8,.3 | SOP8,.25 | SOP14,.25 | SOP14,.25 | DIP8,.3 | DIP8,.3 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | IN-LINE |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
表面贴装 | YES | NO | YES | YES | YES | NO | NO |
最大切换频率 | 500 kHz | 500 kHz | 500 kHz | 500 kHz | 500 kHz | 500 kHz | 500 kHz |
技术 | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR |
温度等级 | COMMERCIAL | COMMERCIAL | OTHER | INDUSTRIAL | OTHER | INDUSTRIAL | INDUSTRIAL |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | GULL WING | THROUGH-HOLE | GULL WING | GULL WING | GULL WING | THROUGH-HOLE | THROUGH-HOLE |
端子节距 | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
厂商名称 | NXP(恩智浦) | - | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) |
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