FIFO, 16KX9, 25ns, Asynchronous, CMOS, PDIP28, 0.300 INCH, PLASTIC, DIP-28
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | SHARP |
| 包装说明 | 0.300 INCH, PLASTIC, DIP-28 |
| Reach Compliance Code | unknown |
| 最长访问时间 | 25 ns |
| 其他特性 | RETRANSMIT |
| 周期时间 | 35 ns |
| JESD-30 代码 | R-PDIP-T28 |
| JESD-609代码 | e0 |
| 长度 | 34.7 mm |
| 内存密度 | 147456 bit |
| 内存宽度 | 9 |
| 功能数量 | 1 |
| 端子数量 | 28 |
| 字数 | 16384 words |
| 字数代码 | 16000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 16KX9 |
| 输出特性 | TOTEM POLE |
| 可输出 | NO |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | DIP |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 并行/串行 | PARALLEL |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 认证状态 | Not Qualified |
| 座面最大高度 | 4.4 mm |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 7.62 mm |
| LH540206D-25 | LH540206-20 | LH540206-25 | LH540206-35 | LH540206-50 | LH540206D-20 | LH540206D-35 | LH540206D-50 | |
|---|---|---|---|---|---|---|---|---|
| 描述 | FIFO, 16KX9, 25ns, Asynchronous, CMOS, PDIP28, 0.300 INCH, PLASTIC, DIP-28 | FIFO, 16KX9, 20ns, Asynchronous, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28 | FIFO, 16KX9, 25ns, Asynchronous, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28 | FIFO, 16KX9, 35ns, Asynchronous, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28 | FIFO, 16KX9, 50ns, Asynchronous, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28 | FIFO, 16KX9, 20ns, Asynchronous, CMOS, PDIP28, 0.300 INCH, PLASTIC, DIP-28 | FIFO, 16KX9, 35ns, Asynchronous, CMOS, PDIP28, 0.300 INCH, PLASTIC, DIP-28 | FIFO, 16KX9, 50ns, Asynchronous, CMOS, PDIP28, 0.300 INCH, PLASTIC, DIP-28 |
| 厂商名称 | SHARP | SHARP | SHARP | SHARP | SHARP | SHARP | SHARP | SHARP |
| 包装说明 | 0.300 INCH, PLASTIC, DIP-28 | 0.600 INCH, PLASTIC, DIP-28 | 0.600 INCH, PLASTIC, DIP-28 | 0.600 INCH, PLASTIC, DIP-28 | 0.600 INCH, PLASTIC, DIP-28 | 0.300 INCH, PLASTIC, DIP-28 | 0.300 INCH, PLASTIC, DIP-28 | 0.300 INCH, PLASTIC, DIP-28 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| 最长访问时间 | 25 ns | 20 ns | 25 ns | 35 ns | 50 ns | 20 ns | 35 ns | 50 ns |
| 其他特性 | RETRANSMIT | RETRANSMIT | RETRANSMIT | RETRANSMIT | RETRANSMIT | RETRANSMIT | RETRANSMIT | RETRANSMIT |
| 周期时间 | 35 ns | 30 ns | 35 ns | 45 ns | 65 ns | 30 ns | 45 ns | 65 ns |
| JESD-30 代码 | R-PDIP-T28 | R-PDIP-T28 | R-PDIP-T28 | R-PDIP-T28 | R-PDIP-T28 | R-PDIP-T28 | R-PDIP-T28 | R-PDIP-T28 |
| 长度 | 34.7 mm | 36 mm | 36 mm | 36 mm | 36 mm | 34.7 mm | 34.7 mm | 34.7 mm |
| 内存密度 | 147456 bit | 147456 bit | 147456 bit | 147456 bit | 147456 bit | 147456 bit | 147456 bit | 147456 bit |
| 内存宽度 | 9 | 9 | 9 | 9 | 9 | 9 | 9 | 9 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 28 | 28 | 28 | 28 | 28 | 28 | 28 | 28 |
| 字数 | 16384 words | 16384 words | 16384 words | 16384 words | 16384 words | 16384 words | 16384 words | 16384 words |
| 字数代码 | 16000 | 16000 | 16000 | 16000 | 16000 | 16000 | 16000 | 16000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 组织 | 16KX9 | 16KX9 | 16KX9 | 16KX9 | 16KX9 | 16KX9 | 16KX9 | 16KX9 |
| 输出特性 | TOTEM POLE | TOTEM POLE | TOTEM POLE | TOTEM POLE | TOTEM POLE | TOTEM POLE | TOTEM POLE | TOTEM POLE |
| 可输出 | NO | NO | NO | NO | NO | NO | NO | NO |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | DIP | DIP | DIP | DIP | DIP | DIP | DIP | DIP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 4.4 mm | 5.2 mm | 5.2 mm | 5.2 mm | 5.2 mm | 4.4 mm | 4.4 mm | 4.4 mm |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | NO | NO | NO | NO | NO | NO | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 宽度 | 7.62 mm | 15.24 mm | 15.24 mm | 15.24 mm | 15.24 mm | 7.62 mm | 7.62 mm | 7.62 mm |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | - |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | - |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - |
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