Fully Integrated Power Management IC (PMIC) with Switch Mode Charger 187-FCBGA -40 to 85
| 参数名称 | 属性值 |
| Brand Name | Texas Instruments |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 零件包装代码 | BGA |
| 包装说明 | VFBGA, |
| 针数 | 187 |
| Reach Compliance Code | compli |
| ECCN代码 | EAR99 |
| Factory Lead Time | 12 weeks |
| 可调阈值 | YES |
| 模拟集成电路 - 其他类型 | POWER SUPPLY SUPPORT CIRCUIT |
| JESD-30 代码 | S-PBGA-B187 |
| JESD-609代码 | e1 |
| 长度 | 7 mm |
| 湿度敏感等级 | 3 |
| 信道数量 | 1 |
| 功能数量 | 1 |
| 端子数量 | 187 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | VFBGA |
| 封装形状 | SQUARE |
| 封装形式 | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| 峰值回流温度（摄氏度） | 260 |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1 mm |
| 最大供电电压 (Vsup) | 4.8 V |
| 最小供电电压 (Vsup) | 2.5 V |
| 标称供电电压 (Vsup) | 3.8 V |
| 表面贴装 | YES |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Tin/Silver/Copper (Sn/Ag/Cu) |
| 端子形式 | BALL |
| 端子节距 | 0.4 mm |
| 端子位置 | BOTTOM |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 7 mm |
| Base Number Matches | 1 |
| TWL6030B1A4CMR | TWL6030B1A0CMR | TWL6030B1A0CMRR | TWL6030B1A4CMRR | TWL6030B1AACMR | TWL6030B1AACMRR | |
|---|---|---|---|---|---|---|
| 描述 | Fully Integrated Power Management IC (PMIC) with Switch Mode Charger 187-FCBGA -40 to 85 | Fully Integrated Power Management IC (PMIC) with Switch Mode Charger 187-FCBGA | Fully Integrated Power Management IC (PMIC) with Switch Mode Charger 187-FCBGA | Fully Integrated Power Management IC (PMIC) with Switch Mode Charger 187-FCBGA -40 to 85 | Fully Integrated Power Management IC (PMIC) with Switch Mode Charger 187-FCBGA | Fully Integrated Power Management IC (PMIC) with Switch Mode Charger 187-FCBGA |
| Brand Name | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 零件包装代码 | BGA | BGA | BGA | BGA | BGA | BGA |
| 包装说明 | VFBGA, | VFBGA, | VFBGA, | VFBGA, | VFBGA, | VFBGA, |
| 针数 | 187 | 187 | 187 | 187 | 187 | 187 |
| Reach Compliance Code | compli | compli | compli | compli | compli | compli |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 可调阈值 | YES | YES | YES | YES | YES | YES |
| 模拟集成电路 - 其他类型 | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY MANAGEMENT CIRCUIT | POWER SUPPLY MANAGEMENT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY MANAGEMENT CIRCUIT | POWER SUPPLY MANAGEMENT CIRCUIT |
| JESD-30 代码 | S-PBGA-B187 | S-PBGA-B187 | S-PBGA-B187 | S-PBGA-B187 | S-PBGA-B187 | S-PBGA-B187 |
| JESD-609代码 | e1 | e1 | e1 | e1 | e1 | e1 |
| 长度 | 7 mm | 7 mm | 7 mm | 7 mm | 7 mm | 7 mm |
| 湿度敏感等级 | 3 | 3 | 3 | 3 | 3 | 3 |
| 信道数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 187 | 187 | 187 | 187 | 187 | 187 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | VFBGA | VFBGA | VFBGA | VFBGA | VFBGA | VFBGA |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| 峰值回流温度（摄氏度） | 260 | 260 | 260 | 260 | 260 | 260 |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1 mm | 1 mm | 1 mm | 1 mm | 1 mm | 1 mm |
| 最大供电电压 (Vsup) | 4.8 V | 4.8 V | 4.8 V | 4.8 V | 4.8 V | 4.8 V |
| 最小供电电压 (Vsup) | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| 标称供电电压 (Vsup) | 3.8 V | 3.8 V | 3.8 V | 3.8 V | 3.8 V | 3.8 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) |
| 端子形式 | BALL | BALL | BALL | BALL | BALL | BALL |
| 端子节距 | 0.4 mm | 0.4 mm | 0.4 mm | 0.4 mm | 0.4 mm | 0.4 mm |
| 端子位置 | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 7 mm | 7 mm | 7 mm | 7 mm | 7 mm | 7 mm |
| 是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | - | - |
| Factory Lead Time | 12 weeks | 12 weeks | 6 weeks | 16 weeks | - | - |
| Base Number Matches | 1 | - | - | 1 | 1 | 1 |
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