F-213
QTH–090–01–C–D–A
®
(0,50 mm) .0197"
QTH SERIES
QTH–060–07–F–D–A
QTH–030–01–L–D–A
HIGH SPEED GROUND PLANE HEADER
SPECIFICATIONS
For complete specifications and
recommended PCB layouts see
www.samtec.com?QTH
Insulator Material:
Liquid Crystal
Polymer
Terminal Material:
Phosphor Bronze
Plating:
Au or Sn over
50µ" (1,27 µm) Ni
Current Rating:
Contact:
1.0A per contact @ 30°C
Temperature Rise
Ground Plane:
7.8A per ground plane @ 30°C
Temperature Rise
Operating Temp Range:
-55°C to +125°C
Voltage Rating:
125 VAC (5 mm Stack Height)
Max Cycles:
100
RoHS Compliant:
Yes
Board Mates:
QSH
Cable Mates:
HQCD, HQDP
(See Application Specific note)
Integral metal plane for
power or ground
Standard Stack Heights
from 5 mm to 25 mm
®
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TM
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nch.com
EXTENDED LIFE PRODUCT
10 year Mixed Flowing Gas with 50µ" Gold
Call Samtec for maximum cycles mated with QSH
ols
otoc ted
Pr or
Supp
100 GbE
™
spor t
Hyper tran
XAUI
®
I Express
PC
SATA
™
finiBand
In
at
QTH/QSH
5 mm Stack Height
Rated @ 3dB Insertion Loss
with PCB effects* w/o PCB effects**
Single-Ended Signaling
–D
9 GHz / 18 Gbps
9.5 GHz / 19 Gbps
Differential Pair Signaling
–D
8 GHz / 16 Gbps 10.5 GHz / 21 Gbps
Differential Pair Signaling
–DP 9.5 GHz / 19 Gbps 16.5 GHz / 33 Gbps
*Performance data includes effects of a non-optimized PCB.
**Test board losses de-embedded from performance data.
Performance data for other stack heights and complete test data
available at www.samtec.com?QTH or contact sig@samtec.com
Type
notes
Download app ppnote
com/a
www.samtec.
m
@ samtec.co
Contact SIG
on protocols
for questions
Processing:
Lead–Free Solderable:
Yes
SMT Lead Coplanarity:
(0,10 mm) .004" max (030-060)
(0,15 mm) .006" max (090)
Board Stacking:
For applications requiring
more than two connectors per
board contact ipg@samtec.com
QTH
PINS PER ROW
NO. OF PAIRS
LEAD
STYLE
PLATING
OPTION
TYPE
A
OTHER
OPTION
–030, –060, –090
(60 total pins per bank = –D)
APPLICATION
SPECIFIC OPTION
• 14 mm, 15 mm, 22 mm
and 30 mm stack height
(Caution: Some automatic
placement/inspection
machines may have
component height
restrictions. Please consult
machinery specifications.)
• 30µ" (0,76 µm) Gold
(Specify -H plating
for Data Rate cable mating
applications.)
• Edge Mount & Guide Posts
• 80 (-DP), 120, 150
positions per row
• Retention Option
Call Samtec.
*Note:
–C Plating passes
10 year MFG testing
Note:
Some lengths, styles
and options are non-standard,
non-returnable.
–020, –040, –060
(20 pairs per bank = –D–DP)
Specify
LEAD
STYLE
from
chart
–K
–F
= Gold Flash on
Signal Pins and
Ground Plane,
Matte Tin on tails
–D
= Single-Ended
–D–DP
= Differential Pair
(–01 only)
–L
–D = (No. of Pins per Row/30) x (20,00) .7875
–DP = (No. of Pairs per Row/20) x (20,00) .7875
(20,00) .7875
01
= (7,00 mm)
.275" DIA
Polyimide
film Pick &
Place Pad
(N/A with -05 &
-07 lead style)
= 10µ" (0,25 µm)
Gold on Signal Pins
and Ground Plane,
Matte Tin on tails
–TR
QTH
LEAD
STYLE
A
(4,27)
.168
(7,26)
.286
(10,27)
.404
(15,25)
.600
(18,26)
.718
(24,24)
.954
(7,11)
.280
02
–C*
(0,50)
.0197
(0,20)
.008
= Electro-Polished
Selective
50µ" (1,27 µm) min Au
over 150µ" (3,81 µm)
Ni on Signal Pins in
contact area,
10µ" (0,25 µm) min Au
over 50µ" (1,27 µm)
Ni on Ground Plane
in contact area,
Matte Tin over 50µ"
(1,27 µm) min Ni
on all solder tails
= Tape & Reel
HEIGHT
(–090 positions
maximum)
WITH
QSH*
(5,00)
.197
(8,00)
.315
(11,00)
.433
(16,00)
.630
(19,00)
.748
(25,00)
.984
–01
–02
–03
–04
–05
–07
–L
= Latching
Option
(–01 lead
style only)
(N/A on
–060 (–D–DP),
–080, –090
& –120)
A
–01 & –02
–03 thru –07
A
*Processing conditions
will affect mated height.
(0,76)
.030
(0,89)
.035
DIA
(0,64)
.025
–L
ALSO AVAILABLE
Board Spacing Standoffs.
See SO Series.
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