Display Driver Counter, CMOS, CDFP16
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Solid State Scientific Inc |
| 包装说明 | DFP, FL16,.3 |
| Reach Compliance Code | unknown |
| JESD-30 代码 | R-XDFP-F16 |
| JESD-609代码 | e0 |
| 负载/预设输入 | YES |
| 逻辑集成电路类型 | DISPLAY DRIVER COUNTER |
| 端子数量 | 16 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 封装主体材料 | CERAMIC |
| 封装代码 | DFP |
| 封装等效代码 | FL16,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | FLATPACK |
| 电源 | 3/15 V |
| 认证状态 | Not Qualified |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | FLAT |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| SCL4433ABF | 883/4426ABD | 883/4426ABC | SCL4426ABC | SCL4433ABE | SCL4433ABD | SCL4433ABC | SCL4426ABF | |
|---|---|---|---|---|---|---|---|---|
| 描述 | Display Driver Counter, CMOS, CDFP16 | Display Driver Counter, CMOS, CDIP16 | Display Driver Counter, CMOS, CDIP16 | Display Driver Counter, CMOS, CDIP16 | Display Driver Counter, CMOS, PDIP16 | Display Driver Counter, CMOS, CDIP16 | Display Driver Counter, CMOS, CDIP16 | Display Driver Counter, CMOS, CDFP16 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | Solid State Scientific Inc | Solid State Scientific Inc | Solid State Scientific Inc | Solid State Scientific Inc | Solid State Scientific Inc | Solid State Scientific Inc | Solid State Scientific Inc | Solid State Scientific Inc |
| 包装说明 | DFP, FL16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | DFP, FL16,.3 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| JESD-30 代码 | R-XDFP-F16 | R-XDIP-T16 | R-XDIP-T16 | R-XDIP-T16 | R-PDIP-T16 | R-XDIP-T16 | R-XDIP-T16 | R-XDFP-F16 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 负载/预设输入 | YES | YES | YES | YES | YES | YES | YES | YES |
| 逻辑集成电路类型 | DISPLAY DRIVER COUNTER | DISPLAY DRIVER COUNTER | DISPLAY DRIVER COUNTER | DISPLAY DRIVER COUNTER | DISPLAY DRIVER COUNTER | DISPLAY DRIVER COUNTER | DISPLAY DRIVER COUNTER | DISPLAY DRIVER COUNTER |
| 端子数量 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 85 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -40 °C | -55 °C | -55 °C | -55 °C |
| 封装主体材料 | CERAMIC | CERAMIC | CERAMIC | CERAMIC | PLASTIC/EPOXY | CERAMIC | CERAMIC | CERAMIC |
| 封装代码 | DFP | DIP | DIP | DIP | DIP | DIP | DIP | DFP |
| 封装等效代码 | FL16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 | FL16,.3 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | FLATPACK | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | FLATPACK |
| 电源 | 3/15 V | 3/15 V | 3/15 V | 3/15 V | 3/15 V | 3/15 V | 3/15 V | 3/15 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 表面贴装 | YES | NO | NO | NO | NO | NO | NO | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | INDUSTRIAL | MILITARY | MILITARY | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | FLAT | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | FLAT |
| 端子节距 | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
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