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FM27C010Q45

产品描述UVPROM, 128KX8, 45ns, CMOS, CDIP32, WINDOWED, CERDIP-32
产品类别存储    存储   
文件大小106KB,共10页
制造商Fairchild
官网地址http://www.fairchildsemi.com/
下载文档 详细参数 选型对比 全文预览

FM27C010Q45概述

UVPROM, 128KX8, 45ns, CMOS, CDIP32, WINDOWED, CERDIP-32

FM27C010Q45规格参数

参数名称属性值
是否无铅含铅
是否Rohs认证不符合
厂商名称Fairchild
零件包装代码DIP
包装说明WDIP, DIP32,.6
针数32
Reach Compliance Codeunknown
ECCN代码EAR99
最长访问时间45 ns
I/O 类型COMMON
JESD-30 代码R-GDIP-T32
JESD-609代码e0
内存密度1048576 bit
内存集成电路类型UVPROM
内存宽度8
功能数量1
端子数量32
字数131072 words
字数代码128000
工作模式ASYNCHRONOUS
最高工作温度70 °C
最低工作温度
组织128KX8
输出特性3-STATE
封装主体材料CERAMIC, GLASS-SEALED
封装代码WDIP
封装等效代码DIP32,.6
封装形状RECTANGULAR
封装形式IN-LINE, WINDOW
并行/串行PARALLEL
峰值回流温度(摄氏度)NOT SPECIFIED
电源5 V
认证状态Not Qualified
座面最大高度5.969 mm
最大待机电流0.0001 A
最大压摆率0.025 mA
最大供电电压 (Vsup)5.5 V
最小供电电压 (Vsup)4.5 V
标称供电电压 (Vsup)5 V
表面贴装NO
技术CMOS
温度等级COMMERCIAL
端子面层Tin/Lead (Sn/Pb)
端子形式THROUGH-HOLE
端子节距2.54 mm
端子位置DUAL
处于峰值回流温度下的最长时间NOT SPECIFIED
宽度15.24 mm

文档预览

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FM27C010 1,048,576-Bit (128K x 8) High Performance CMOS EPROM
January 2000
FM27C010
1,048,576-Bit (128K x 8) High Performance
CMOS EPROM
General Description
The FM27C010 is a high performance, 1,048,576-bit Electrically
Programmable UV Erasable Read Only Memory. It is organized
as 128K-words of 8 bits each. Its pin-compatibility with byte-wide
JEDEC EPROMs enables upgrades through 8 Mbit EPROMs.
The “Don’t Care” feature during read operations allows memory
expansions from 1M to 8M bits with no printed circuit board
changes.
The FM27C010 can directly replace lower density 28-pin EPROMs
by adding an A16 address line and V
CC
jumper. During the normal
read operation PGM and V
PP
are in a “Don’t Care” state which
allows higher order addresses, such as A17, A18, and A19 to be
connected without affecting the normal read operation. This
allows memory upgrades to 8M bits without hardware changes.
The FM27C010 is also offered in a 32-pin plastic DIP with the
same upgrade path.
The FM27C010 provides microprocessor-based systems exten-
sive storage capacity for large portions of operating system and
application software. Its 70 ns access time provides no-wait-state
operation with high-performance CPUs. The FM27C010 offers a
single chip solution for the code storage requirements of 100%
firmware-based equipment. Frequently-used software routines
are quickly executed from EPROM storage, greatly enhancing
system utility.
The FM27C010 is manufactured using Fairchild’s advanced CMOS
AMG™ EPROM technology.
The FM27C010 is one member of a high density EPROM Family
which range in densities up to 4 Megabit.
Features
I
High performance CMOS
— 70 ns access time
I
Fast turn-off for microprocessor compatibility
I
Simplified upgrade path
— V
PP
and PGM are “Don’t Care” during normal read
operation
I
Manufacturers identification code
I
Fast programming
I
JEDEC standard pin configurations
— 32-pin PDIP package
— 32-pin PLCC package
— 32-pin CERDIP package
Block Diagram
V
CC
GND
V
PP
OE
CE
PGM
Output Enable,
Chip Enable, and
Program Logic
Data Outputs O
0
- O
7
Output
Buffers
Y Decoder
..
1,048,576-Bit
Cell Matrix
A
0
- A
16
Address
Inputs
.......
X Decoder
DS800032-1
© 2000 Fairchild Semiconductor Corporation
FM27C010
1
www.fairchildsemi.com

FM27C010Q45相似产品对比

FM27C010Q45 FM27C010Q90 FM27C010DWF FM27C010QE120 FM27C010Q150 FM27C010V150 FM27C010T45L FM27C010T45
描述 UVPROM, 128KX8, 45ns, CMOS, CDIP32, WINDOWED, CERDIP-32 UVPROM, 128KX8, 90ns, CMOS, CDIP32, WINDOWED, CERDIP-32 OTP ROM, 128KX8, CMOS, WAFER-32 UVPROM, 128KX8, 120ns, CMOS, CDIP32, WINDOWED, CERDIP-32 UVPROM, 128KX8, 150ns, CMOS, CDIP32, WINDOWED, CERDIP-32 OTP ROM, 128KX8, 150ns, CMOS, PQCC32, PLASTIC, LCC-32 OTP ROM, 128KX8, 45ns, CMOS, PDSO32, TSOP-32 OTP ROM, 128KX8, 45ns, CMOS, PDSO32, TSOP-32
厂商名称 Fairchild Fairchild Fairchild Fairchild Fairchild Fairchild Fairchild Fairchild
零件包装代码 DIP DIP WAFER DIP DIP QFJ TSOP TSOP
包装说明 WDIP, DIP32,.6 WDIP, DIP32,.6 DIE, WDIP, DIP32,.6 WDIP, DIP32,.6 QCCJ, LDCC32,.5X.6 TSOP1, TSSOP32,.8,20 TSOP1, TSSOP32,.56,20
针数 32 32 32 32 32 32 32 32
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown unknow
ECCN代码 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
JESD-30 代码 R-GDIP-T32 R-GDIP-T32 X-XUUC-N32 R-GDIP-T32 R-GDIP-T32 R-PQCC-J32 R-PDSO-G32 R-PDSO-G32
内存密度 1048576 bit 1048576 bit 1048576 bit 1048576 bit 1048576 bit 1048576 bit 1048576 bit 1048576 bi
内存集成电路类型 UVPROM UVPROM OTP ROM UVPROM UVPROM OTP ROM OTP ROM OTP ROM
内存宽度 8 8 8 8 8 8 8 8
功能数量 1 1 1 1 1 1 1 1
端子数量 32 32 32 32 32 32 32 32
字数 131072 words 131072 words 131072 words 131072 words 131072 words 131072 words 131072 words 131072 words
字数代码 128000 128000 128000 128000 128000 128000 128000 128000
工作模式 ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
最高工作温度 70 °C 70 °C 70 °C 85 °C 70 °C 70 °C 70 °C 70 °C
组织 128KX8 128KX8 128KX8 128KX8 128KX8 128KX8 128KX8 128KX8
封装主体材料 CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED UNSPECIFIED CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 WDIP WDIP DIE WDIP WDIP QCCJ TSOP1 TSOP1
封装形状 RECTANGULAR RECTANGULAR UNSPECIFIED RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 IN-LINE, WINDOW IN-LINE, WINDOW UNCASED CHIP IN-LINE, WINDOW IN-LINE, WINDOW CHIP CARRIER SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE
并行/串行 PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
最大供电电压 (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
最小供电电压 (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
标称供电电压 (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
表面贴装 NO NO YES NO NO YES YES YES
技术 CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 COMMERCIAL COMMERCIAL COMMERCIAL INDUSTRIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
端子形式 THROUGH-HOLE THROUGH-HOLE NO LEAD THROUGH-HOLE THROUGH-HOLE J BEND GULL WING GULL WING
端子位置 DUAL DUAL UPPER DUAL DUAL QUAD DUAL DUAL
是否无铅 含铅 含铅 - 含铅 含铅 含铅 - -
是否Rohs认证 不符合 不符合 - 不符合 不符合 不符合 不符合 不符合
最长访问时间 45 ns 90 ns - 120 ns 150 ns 150 ns 45 ns 45 ns
I/O 类型 COMMON COMMON - COMMON COMMON COMMON COMMON COMMON
JESD-609代码 e0 e0 - e0 e0 e0 e0 e0
输出特性 3-STATE 3-STATE - 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
封装等效代码 DIP32,.6 DIP32,.6 - DIP32,.6 DIP32,.6 LDCC32,.5X.6 TSSOP32,.8,20 TSSOP32,.56,20
峰值回流温度(摄氏度) NOT SPECIFIED NOT SPECIFIED - NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
电源 5 V 5 V - 5 V 5 V 5 V 5 V 5 V
座面最大高度 5.969 mm 5.969 mm - 5.969 mm 5.969 mm 3.56 mm 1.2 mm 1.2 mm
最大待机电流 0.0001 A 0.0001 A - 0.0001 A 0.0001 A 0.0001 A 0.00001 A 0.0001 A
最大压摆率 0.025 mA 0.03 mA - 0.03 mA 0.03 mA 0.03 mA 0.03 mA 0.025 mA
端子面层 Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) - Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
端子节距 2.54 mm 2.54 mm - 2.54 mm 2.54 mm 1.27 mm 0.5 mm 0.5 mm
处于峰值回流温度下的最长时间 NOT SPECIFIED NOT SPECIFIED - NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
宽度 15.24 mm 15.24 mm - 15.24 mm 15.24 mm 11.455 mm 8 mm 8 mm

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