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Datasheet> 器件分类 > 电源/电源管理> 电源电路> SG3423Y

SG3423Y: 产品描述Power Management Circuit, BIPolar, CDIP8,; 产品类别电源/电源管理电源电路; 文件大小182KB，共3页; 制造商Linfinity Microelectronics

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SG3423Y概述

Power Management Circuit, BIPolar, CDIP8,

SG3423Y规格参数

参数名称	属性值
是否Rohs认证	不符合
厂商名称	Linfinity Microelectronics
Reach Compliance Code	unknown
JESD-30 代码	R-XDIP-T8
JESD-609代码	e0
端子数量	8
最高工作温度	70 °C
最低工作温度
封装主体材料	CERAMIC
封装代码	DIP
封装等效代码	DIP8,.3
封装形状	RECTANGULAR
封装形式	IN-LINE
认证状态	Not Qualified
表面贴装	NO
技术	BIPOLAR
温度等级	COMMERCIAL
端子面层	Tin/Lead (Sn/Pb)
端子形式	THROUGH-HOLE
端子节距	2.54 mm
端子位置	DUAL

SG3423Y相似产品对比

	SG3423Y	SG3523Y	SG3523AY	SG3523AY/883B	SG3523Y/883C	SG3523AY/883C	SG3523Y/883B	SG3423M	SG3423AY	SG3423AM
描述	Power Management Circuit, BIPolar, CDIP8,	Power Management Circuit, BIPolar, CDIP8,	Power Management Circuit, BIPolar, CDIP8,	Power Management Circuit, BIPolar, CDIP8,	Power Management Circuit, BIPolar, CDIP8,	Power Management Circuit, BIPolar, CDIP8,	Power Management Circuit, BIPolar, CDIP8,	Power Management Circuit, BIPolar, PDIP8,	Power Management Circuit, BIPolar, CDIP8,	Power Management Circuit, BIPolar, PDIP8,
是否Rohs认证	不符合	不符合	不符合	不符合	不符合	不符合	不符合	不符合	不符合	不符合
厂商名称	Linfinity Microelectronics	Linfinity Microelectronics	Linfinity Microelectronics	Linfinity Microelectronics	Linfinity Microelectronics	Linfinity Microelectronics	Linfinity Microelectronics	Linfinity Microelectronics	Linfinity Microelectronics	Linfinity Microelectronics
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknow
JESD-30 代码	R-XDIP-T8	R-XDIP-T8	R-XDIP-T8	R-XDIP-T8	R-XDIP-T8	R-XDIP-T8	R-XDIP-T8	R-PDIP-T8	R-XDIP-T8	R-PDIP-T8
JESD-609代码	e0	e0	e0	e0	e0	e0	e0	e0	e0	e0
端子数量	8	8	8	8	8	8	8	8	8	8
最高工作温度	70 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	70 °C	70 °C	70 °C
最低工作温度	-	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-	-	-
封装主体材料	CERAMIC	CERAMIC	CERAMIC	CERAMIC	CERAMIC	CERAMIC	CERAMIC	PLASTIC/EPOXY	CERAMIC	PLASTIC/EPOXY
封装代码	DIP	DIP	DIP	DIP	DIP	DIP	DIP	DIP	DIP	DIP
封装等效代码	DIP8,.3	DIP8,.3	DIP8,.3	DIP8,.3	DIP8,.3	DIP8,.3	DIP8,.3	DIP8,.3	DIP8,.3	DIP8,.3
封装形状	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
表面贴装	NO	NO	NO	NO	NO	NO	NO	NO	NO	NO
技术	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR
温度等级	COMMERCIAL	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	COMMERCIAL	COMMERCIAL	COMMERCIAL
端子面层	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
端子形式	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
端子节距	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm
端子位置	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL

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