8-BIT, OTPROM, 8MHz, MICROCONTROLLER, PDSO28, 0.300 INCH, PLASTIC, SOP-28
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | ST(意法半导体) |
| 零件包装代码 | SOIC |
| 包装说明 | 0.300 INCH, PLASTIC, SOP-28 |
| 针数 | 28 |
| Reach Compliance Code | compliant |
| 具有ADC | YES |
| 其他特性 | ALSO OPERATES AT 3V MINIMUM SUPPLY |
| 地址总线宽度 | |
| 位大小 | 8 |
| CPU系列 | ST6200 |
| 最大时钟频率 | 8 MHz |
| DAC 通道 | NO |
| DMA 通道 | NO |
| 外部数据总线宽度 | |
| JESD-30 代码 | R-PDSO-G28 |
| JESD-609代码 | e4 |
| 长度 | 17.9 mm |
| I/O 线路数量 | 20 |
| 端子数量 | 28 |
| 片上程序ROM宽度 | 8 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| PWM 通道 | NO |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOP |
| 封装等效代码 | SOP28,.4 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | 3.3/5 V |
| 认证状态 | Not Qualified |
| RAM（字节） | 64 |
| ROM（单词） | 4096 |
| ROM可编程性 | OTPROM |
| 座面最大高度 | 2.65 mm |
| 速度 | 8 MHz |
| 最大压摆率 | 4.8 mA |
| 最大供电电压 | 6 V |
| 最小供电电压 | 3.6 V |
| 标称供电电压 | 5 V |
| 表面贴装 | YES |
| 技术 | HCMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | GULL WING |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 7.5 mm |
| uPs/uCs/外围集成电路类型 | MICROCONTROLLER |
| ST62T25CM1 | ST62E25CD3 | ST62E25CD1 | ST62T25CN3 | ST62E25CD6 | ST62T25CB1 | ST62T25CN1 | |
|---|---|---|---|---|---|---|---|
| 描述 | 8-BIT, OTPROM, 8MHz, MICROCONTROLLER, PDSO28, 0.300 INCH, PLASTIC, SOP-28 | 8-BIT, UVPROM, 8MHz, MICROCONTROLLER, CDIP28, SIDE BRAZED, CERAMIC, DIP-28 | 8-BIT, UVPROM, 8MHz, MICROCONTROLLER, CDIP28, SIDE BRAZED, CERAMIC, DIP-28 | 8-BIT, OTPROM, 8MHz, MICROCONTROLLER, PDSO28, PLASTIC, SSOP-28 | 8-BIT, UVPROM, 8MHz, MICROCONTROLLER, CDIP28, SIDE BRAZED, CERAMIC, DIP-28 | 8-BIT, OTPROM, 8MHz, MICROCONTROLLER, PDIP28, 0.600 INCH, PLASTIC, DIP-28 | 8-BIT, OTPROM, 8MHz, MICROCONTROLLER, PDSO28, PLASTIC, SSOP-28 |
| 是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 零件包装代码 | SOIC | DIP | DIP | SSOP | DIP | DIP | SSOP |
| 包装说明 | 0.300 INCH, PLASTIC, SOP-28 | SIDE BRAZED, CERAMIC, DIP-28 | SIDE BRAZED, CERAMIC, DIP-28 | SSOP, SSOP28,.3 | WDIP, DIP28,.6 | 0.600 INCH, PLASTIC, DIP-28 | PLASTIC, SSOP-28 |
| 针数 | 28 | 28 | 28 | 28 | 28 | 28 | 28 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compli |
| 具有ADC | YES | YES | YES | YES | YES | YES | YES |
| 其他特性 | ALSO OPERATES AT 3V MINIMUM SUPPLY | ALSO OPERATES AT 3V MINIMUM SUPPLY | ALSO OPERATES AT 3V MINIMUM SUPPLY | ALSO OPERATES AT 3V MINIMUM SUPPLY | ALSO OPERATES AT 3V MINIMUM SUPPLY | ALSO OPERATES AT 3V MINIMUM SUPPLY | ALSO OPERATES AT 3V MINIMUM SUPPLY |
| 位大小 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| CPU系列 | ST6200 | ST6200 | ST6200 | ST6200 | ST6200 | ST6200 | ST6200 |
| 最大时钟频率 | 8 MHz | 8 MHz | 8 MHz | 8 MHz | 8 MHz | 8 MHz | 8 MHz |
| DAC 通道 | NO | NO | NO | NO | NO | NO | NO |
| DMA 通道 | NO | NO | NO | NO | NO | NO | NO |
| JESD-30 代码 | R-PDSO-G28 | R-GDIP-T28 | R-GDIP-T28 | R-PDSO-G28 | R-GDIP-T28 | R-PDIP-T28 | R-PDSO-G28 |
| JESD-609代码 | e4 | e3 | e3 | e4 | e3 | e3 | e4 |
| 长度 | 17.9 mm | 35.56 mm | 35.56 mm | 10.2 mm | 35.56 mm | 37.4 mm | 10.2 mm |
| I/O 线路数量 | 20 | 20 | 20 | 20 | 20 | 20 | 20 |
| 端子数量 | 28 | 28 | 28 | 28 | 28 | 28 | 28 |
| 片上程序ROM宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 最高工作温度 | 70 °C | 125 °C | 70 °C | 125 °C | 85 °C | 70 °C | 70 °C |
| PWM 通道 | NO | NO | NO | NO | NO | NO | NO |
| 封装主体材料 | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SOP | WDIP | WDIP | SSOP | WDIP | DIP | SSOP |
| 封装等效代码 | SOP28,.4 | DIP28,.6 | DIP28,.6 | SSOP28,.3 | DIP28,.6 | DIP28,.6 | SSOP28,.3 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | IN-LINE, WINDOW | IN-LINE, WINDOW | SMALL OUTLINE, SHRINK PITCH | IN-LINE, WINDOW | IN-LINE | SMALL OUTLINE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | 260 | NOT SPECIFIED | NOT SPECIFIED | 260 | NOT SPECIFIED | NOT SPECIFIED | 260 |
| 电源 | 3.3/5 V | 3.3/5 V | 3.3/5 V | 3.3/5 V | 3.3/5 V | 3.3/5 V | 3.3/5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| RAM（字节） | 64 | 64 | 64 | 64 | 64 | 64 | 64 |
| ROM（单词） | 4096 | 4096 | 4096 | 4096 | 4096 | 4096 | 4096 |
| ROM可编程性 | OTPROM | UVPROM | UVPROM | OTPROM | UVPROM | OTPROM | OTPROM |
| 座面最大高度 | 2.65 mm | 4.17 mm | 4.17 mm | 2 mm | 4.17 mm | 6.35 mm | 2 mm |
| 速度 | 8 MHz | 8 MHz | 8 MHz | 8 MHz | 8 MHz | 8 MHz | 8 MHz |
| 最大压摆率 | 4.8 mA | 4.8 mA | 4.8 mA | 3.5 mA | 4.8 mA | 4.8 mA | 4.8 mA |
| 最大供电电压 | 6 V | 6 V | 6 V | 6 V | 6 V | 6 V | 6 V |
| 最小供电电压 | 3.6 V | 4.5 V | 3.6 V | 4.5 V | 3.6 V | 3.6 V | 3.6 V |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | NO | NO | YES | NO | NO | YES |
| 技术 | HCMOS | HCMOS | HCMOS | HCMOS | HCMOS | HCMOS | HCMOS |
| 温度等级 | COMMERCIAL | AUTOMOTIVE | COMMERCIAL | AUTOMOTIVE | INDUSTRIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | Matte Tin (Sn) | Matte Tin (Sn) | Nickel/Palladium/Gold (Ni/Pd/Au) | Matte Tin (Sn) | Matte Tin (Sn) | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | GULL WING | THROUGH-HOLE | THROUGH-HOLE | GULL WING | THROUGH-HOLE | THROUGH-HOLE | GULL WING |
| 端子节距 | 1.27 mm | 2.54 mm | 2.54 mm | 0.65 mm | 2.54 mm | 2.54 mm | 0.65 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | 30 | NOT SPECIFIED | NOT SPECIFIED | 30 |
| 宽度 | 7.5 mm | 15.24 mm | 15.24 mm | 5.3 mm | 15.24 mm | 15.24 mm | 5.3 mm |
| uPs/uCs/外围集成电路类型 | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER |
| 厂商名称 | ST(意法半导体) | - | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) |
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