SRAM Module, 256KX32, 17ns, CMOS, PQMA68,
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | White Electronic Designs Corporation |
| Reach Compliance Code | unknown |
| 最长访问时间 | 17 ns |
| 其他特性 | USER CONFIGURABLE 512K X 16; BYTE READ/WRITE |
| I/O 类型 | COMMON |
| JESD-30 代码 | S-PQMA-J68 |
| JESD-609代码 | e0 |
| 内存密度 | 8388608 bit |
| 内存集成电路类型 | SRAM MODULE |
| 内存宽度 | 32 |
| 功能数量 | 1 |
| 端子数量 | 68 |
| 字数 | 262144 words |
| 字数代码 | 256000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 组织 | 256KX32 |
| 输出特性 | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | QCCJ |
| 封装等效代码 | LDCC68,1.0SQ |
| 封装形状 | SQUARE |
| 封装形式 | MICROELECTRONIC ASSEMBLY |
| 并行/串行 | PARALLEL |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| 最大待机电流 | 0.03 A |
| 最小待机电流 | 4.5 V |
| 最大压摆率 | 0.45 mA |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | J BEND |
| 端子节距 | 1.27 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| WPS256K32-17PJI | WPS256K32B-12PJC | WPS256K32B-15PJC | WPS256K32B-15PJI | WPS256K32-25PJI | WPS256K32-17PJC | WPS256K32-25PJC | WPS256K32B-12PJI | |
|---|---|---|---|---|---|---|---|---|
| 描述 | SRAM Module, 256KX32, 17ns, CMOS, PQMA68, | SRAM Module, 256KX32, 12ns, PQCC68, | SRAM Module, 256KX32, 15ns, PQCC68, | SRAM Module, 256KX32, 15ns, PQCC68, | SRAM Module, 256KX32, 25ns, CMOS, PQMA68, | SRAM Module, 256KX32, 17ns, CMOS, PQMA68, | SRAM Module, 256KX32, 25ns, CMOS, PQMA68, | SRAM Module, 256KX32, 12ns, PQCC68, |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | White Electronic Designs Corporation | White Electronic Designs Corporation | White Electronic Designs Corporation | White Electronic Designs Corporation | White Electronic Designs Corporation | White Electronic Designs Corporation | White Electronic Designs Corporation | White Electronic Designs Corporation |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknow |
| 最长访问时间 | 17 ns | 12 ns | 15 ns | 15 ns | 25 ns | 17 ns | 25 ns | 12 ns |
| I/O 类型 | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
| JESD-30 代码 | S-PQMA-J68 | S-PQCC-J68 | S-PQCC-J68 | S-PQCC-J68 | S-PQMA-J68 | S-PQMA-J68 | S-PQMA-J68 | S-PQCC-J68 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 内存密度 | 8388608 bit | 8388608 bit | 8388608 bit | 8388608 bit | 8388608 bit | 8388608 bit | 8388608 bit | 8388608 bi |
| 内存集成电路类型 | SRAM MODULE | SRAM MODULE | SRAM MODULE | SRAM MODULE | SRAM MODULE | SRAM MODULE | SRAM MODULE | SRAM MODULE |
| 内存宽度 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
| 端子数量 | 68 | 68 | 68 | 68 | 68 | 68 | 68 | 68 |
| 字数 | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words |
| 字数代码 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 85 °C | 70 °C | 70 °C | 85 °C | 85 °C | 70 °C | 70 °C | 85 °C |
| 组织 | 256KX32 | 256KX32 | 256KX32 | 256KX32 | 256KX32 | 256KX32 | 256KX32 | 256KX32 |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | QCCJ | QCCJ | QCCJ | QCCJ | QCCJ | QCCJ | QCCJ | QCCJ |
| 封装等效代码 | LDCC68,1.0SQ | LDCC68,1.0SQ | LDCC68,1.0SQ | LDCC68,1.0SQ | LDCC68,1.0SQ | LDCC68,1.0SQ | LDCC68,1.0SQ | LDCC68,1.0SQ |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | MICROELECTRONIC ASSEMBLY | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | CHIP CARRIER |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最大压摆率 | 0.45 mA | 0.54 mA | 0.54 mA | 0.54 mA | 0.45 mA | 0.45 mA | 0.45 mA | 0.54 mA |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES |
| 温度等级 | INDUSTRIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | J BEND | J BEND | J BEND | J BEND | J BEND | J BEND | J BEND | J BEND |
| 端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| 端子位置 | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD |
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