SRAM Module, 256KX32, 12ns, PQCC68,
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | White Electronic Designs Corporation |
Reach Compliance Code | unknown |
最长访问时间 | 12 ns |
I/O 类型 | COMMON |
JESD-30 代码 | S-PQCC-J68 |
JESD-609代码 | e0 |
内存密度 | 8388608 bit |
内存集成电路类型 | SRAM MODULE |
内存宽度 | 32 |
端子数量 | 68 |
字数 | 262144 words |
字数代码 | 256000 |
工作模式 | ASYNCHRONOUS |
最高工作温度 | 70 °C |
最低工作温度 | |
组织 | 256KX32 |
输出特性 | 3-STATE |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | QCCJ |
封装等效代码 | LDCC68,1.0SQ |
封装形状 | SQUARE |
封装形式 | CHIP CARRIER |
并行/串行 | PARALLEL |
电源 | 5 V |
认证状态 | Not Qualified |
最大压摆率 | 0.54 mA |
标称供电电压 (Vsup) | 5 V |
表面贴装 | YES |
温度等级 | COMMERCIAL |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | J BEND |
端子节距 | 1.27 mm |
端子位置 | QUAD |
WPS256K32B-12PJC | WPS256K32B-15PJC | WPS256K32B-15PJI | WPS256K32-25PJI | WPS256K32-17PJC | WPS256K32-25PJC | WPS256K32-17PJI | WPS256K32B-12PJI | |
---|---|---|---|---|---|---|---|---|
描述 | SRAM Module, 256KX32, 12ns, PQCC68, | SRAM Module, 256KX32, 15ns, PQCC68, | SRAM Module, 256KX32, 15ns, PQCC68, | SRAM Module, 256KX32, 25ns, CMOS, PQMA68, | SRAM Module, 256KX32, 17ns, CMOS, PQMA68, | SRAM Module, 256KX32, 25ns, CMOS, PQMA68, | SRAM Module, 256KX32, 17ns, CMOS, PQMA68, | SRAM Module, 256KX32, 12ns, PQCC68, |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
厂商名称 | White Electronic Designs Corporation | White Electronic Designs Corporation | White Electronic Designs Corporation | White Electronic Designs Corporation | White Electronic Designs Corporation | White Electronic Designs Corporation | White Electronic Designs Corporation | White Electronic Designs Corporation |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknow |
最长访问时间 | 12 ns | 15 ns | 15 ns | 25 ns | 17 ns | 25 ns | 17 ns | 12 ns |
I/O 类型 | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
JESD-30 代码 | S-PQCC-J68 | S-PQCC-J68 | S-PQCC-J68 | S-PQMA-J68 | S-PQMA-J68 | S-PQMA-J68 | S-PQMA-J68 | S-PQCC-J68 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
内存密度 | 8388608 bit | 8388608 bit | 8388608 bit | 8388608 bit | 8388608 bit | 8388608 bit | 8388608 bit | 8388608 bi |
内存集成电路类型 | SRAM MODULE | SRAM MODULE | SRAM MODULE | SRAM MODULE | SRAM MODULE | SRAM MODULE | SRAM MODULE | SRAM MODULE |
内存宽度 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
端子数量 | 68 | 68 | 68 | 68 | 68 | 68 | 68 | 68 |
字数 | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words |
字数代码 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 |
工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
最高工作温度 | 70 °C | 70 °C | 85 °C | 85 °C | 70 °C | 70 °C | 85 °C | 85 °C |
组织 | 256KX32 | 256KX32 | 256KX32 | 256KX32 | 256KX32 | 256KX32 | 256KX32 | 256KX32 |
输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | QCCJ | QCCJ | QCCJ | QCCJ | QCCJ | QCCJ | QCCJ | QCCJ |
封装等效代码 | LDCC68,1.0SQ | LDCC68,1.0SQ | LDCC68,1.0SQ | LDCC68,1.0SQ | LDCC68,1.0SQ | LDCC68,1.0SQ | LDCC68,1.0SQ | LDCC68,1.0SQ |
封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
封装形式 | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | CHIP CARRIER |
并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
最大压摆率 | 0.54 mA | 0.54 mA | 0.54 mA | 0.45 mA | 0.45 mA | 0.45 mA | 0.45 mA | 0.54 mA |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES |
温度等级 | COMMERCIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | J BEND | J BEND | J BEND | J BEND | J BEND | J BEND | J BEND | J BEND |
端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
端子位置 | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD |
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