Configuration Memory, 284992X1, Serial, CMOS, 6 X 6 MM, 1.04 MM HEIGHT, 1.27 MM PITCH, LAP-8
参数名称 | 属性值 |
是否无铅 | 不含铅 |
是否Rohs认证 | 符合 |
厂商名称 | Atmel (Microchip) |
零件包装代码 | SOIC |
包装说明 | SON, |
针数 | 8 |
Reach Compliance Code | compliant |
ECCN代码 | EAR99 |
最大时钟频率 (fCLK) | 10 MHz |
JESD-30 代码 | R-XDSO-N8 |
长度 | 5.99 mm |
内存密度 | 284992 bit |
内存集成电路类型 | CONFIGURATION MEMORY |
内存宽度 | 1 |
湿度敏感等级 | 3 |
功能数量 | 1 |
端子数量 | 8 |
字数 | 284992 words |
字数代码 | 284992 |
工作模式 | SYNCHRONOUS |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
组织 | 284992X1 |
封装主体材料 | UNSPECIFIED |
封装代码 | SON |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE |
并行/串行 | SERIAL |
峰值回流温度(摄氏度) | 260 |
认证状态 | Not Qualified |
座面最大高度 | 1.14 mm |
最大供电电压 (Vsup) | 3.6 V |
最小供电电压 (Vsup) | 3 V |
标称供电电压 (Vsup) | 3.3 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子面层 | COPPER NICKEL GOLD |
端子形式 | NO LEAD |
端子节距 | 1.27 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | 40 |
宽度 | 5.99 mm |
ATFS05-CJ | ATFS10-CJ | ATFS10-CL | ATFS05-CL | ATFS40-CJ | ATFS40-CL | |
---|---|---|---|---|---|---|
描述 | Configuration Memory, 284992X1, Serial, CMOS, 6 X 6 MM, 1.04 MM HEIGHT, 1.27 MM PITCH, LAP-8 | Configuration Memory, 750400X1, Serial, CMOS, 6 X 6 MM, 1.04 MM HEIGHT, 1.27 MM PITCH, LAP-8 | Configuration Memory, 750400X1, Serial, CMOS, 6 X 6 MM, 1.04 MM HEIGHT, 1.27 MM PITCH, LAP-8 | Configuration Memory, 284992X1, Serial, CMOS, 6 X 6 MM, 1.04 MM HEIGHT, 1.27 MM PITCH, LAP-8 | Configuration Memory, 815382X1, Serial, CMOS, PDSO8, 6 X 6 MM, 1.04 MM HEIGHT, 1.27 MM PITCH, LAP-8 | Configuration Memory, 815382X1, Serial, CMOS, PDSO8, 6 X 6 MM, 1.04 MM HEIGHT, 1.27 MM PITCH, LAP-8 |
是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
零件包装代码 | SOIC | SOIC | SOIC | SOIC | SOIC | SOIC |
包装说明 | SON, | SON, | SON, | SON, | TSON, | TSON, |
针数 | 8 | 8 | 8 | 8 | 8 | 8 |
Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
最大时钟频率 (fCLK) | 10 MHz | 15 MHz | 15 MHz | 10 MHz | 10 MHz | 15 MHz |
JESD-30 代码 | R-XDSO-N8 | R-XDSO-N8 | R-XDSO-N8 | R-XDSO-N8 | S-PDSO-N8 | S-PDSO-N8 |
长度 | 5.99 mm | 5.99 mm | 5.99 mm | 5.99 mm | 6 mm | 6 mm |
内存密度 | 284992 bit | 750400 bit | 750400 bit | 284992 bit | 815382 bit | 815382 bit |
内存集成电路类型 | CONFIGURATION MEMORY | CONFIGURATION MEMORY | CONFIGURATION MEMORY | CONFIGURATION MEMORY | CONFIGURATION MEMORY | CONFIGURATION MEMORY |
内存宽度 | 1 | 1 | 1 | 1 | 1 | 1 |
湿度敏感等级 | 3 | 3 | 3 | 3 | 3 | 3 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 8 | 8 | 8 | 8 | 8 | 8 |
字数 | 284992 words | 750400 words | 750400 words | 284992 words | 815382 words | 815382 words |
字数代码 | 284992 | 750400 | 750400 | 284992 | 815382 | 815382 |
工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
最高工作温度 | 85 °C | 85 °C | 70 °C | 70 °C | 85 °C | 70 °C |
组织 | 284992X1 | 750400X1 | 750400X1 | 284992X1 | 815382X1 | 815382X1 |
封装主体材料 | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | SON | SON | SON | SON | TSON | TSON |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE |
封装形式 | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE |
并行/串行 | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL |
峰值回流温度(摄氏度) | 260 | 260 | 260 | 260 | 260 | 260 |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 1.14 mm | 1.14 mm | 1.14 mm | 1.14 mm | 1.14 mm | 1.14 mm |
最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
最小供电电压 (Vsup) | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
表面贴装 | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL |
端子面层 | COPPER NICKEL GOLD | COPPER NICKEL GOLD | COPPER NICKEL GOLD | COPPER NICKEL GOLD | COPPER NICKEL GOLD | COPPER NICKEL GOLD |
端子形式 | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
处于峰值回流温度下的最长时间 | 40 | 40 | 40 | 40 | 40 | 40 |
宽度 | 5.99 mm | 5.99 mm | 5.99 mm | 5.99 mm | 6 mm | 6 mm |
厂商名称 | Atmel (Microchip) | Atmel (Microchip) | - | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) |
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