Configuration Memory, 750400X1, Serial, CMOS, 6 X 6 MM, 1.04 MM HEIGHT, 1.27 MM PITCH, LAP-8
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Atmel (Microchip) |
| 零件包装代码 | SOIC |
| 包装说明 | SON, |
| 针数 | 8 |
| Reach Compliance Code | compliant |
| ECCN代码 | EAR99 |
| Is Samacsys | N |
| 最大时钟频率 (fCLK) | 15 MHz |
| JESD-30 代码 | R-XDSO-N8 |
| 长度 | 5.99 mm |
| 内存密度 | 750400 bit |
| 内存集成电路类型 | CONFIGURATION MEMORY |
| 内存宽度 | 1 |
| 湿度敏感等级 | 3 |
| 功能数量 | 1 |
| 端子数量 | 8 |
| 字数 | 750400 words |
| 字数代码 | 750400 |
| 工作模式 | SYNCHRONOUS |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 组织 | 750400X1 |
| 封装主体材料 | UNSPECIFIED |
| 封装代码 | SON |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 并行/串行 | SERIAL |
| 峰值回流温度（摄氏度） | 260 |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.14 mm |
| 最大供电电压 (Vsup) | 3.6 V |
| 最小供电电压 (Vsup) | 3 V |
| 标称供电电压 (Vsup) | 3.3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | COPPER NICKEL GOLD |
| 端子形式 | NO LEAD |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 40 |
| 宽度 | 5.99 mm |
| Base Number Matches | 1 |
| ATFS10-CJ | ATFS10-CL | ATFS05-CL | ATFS40-CJ | ATFS40-CL | ATFS05-CJ | |
|---|---|---|---|---|---|---|
| 描述 | Configuration Memory, 750400X1, Serial, CMOS, 6 X 6 MM, 1.04 MM HEIGHT, 1.27 MM PITCH, LAP-8 | Configuration Memory, 750400X1, Serial, CMOS, 6 X 6 MM, 1.04 MM HEIGHT, 1.27 MM PITCH, LAP-8 | Configuration Memory, 284992X1, Serial, CMOS, 6 X 6 MM, 1.04 MM HEIGHT, 1.27 MM PITCH, LAP-8 | Configuration Memory, 815382X1, Serial, CMOS, PDSO8, 6 X 6 MM, 1.04 MM HEIGHT, 1.27 MM PITCH, LAP-8 | Configuration Memory, 815382X1, Serial, CMOS, PDSO8, 6 X 6 MM, 1.04 MM HEIGHT, 1.27 MM PITCH, LAP-8 | Configuration Memory, 284992X1, Serial, CMOS, 6 X 6 MM, 1.04 MM HEIGHT, 1.27 MM PITCH, LAP-8 |
| 是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 零件包装代码 | SOIC | SOIC | SOIC | SOIC | SOIC | SOIC |
| 包装说明 | SON, | SON, | SON, | TSON, | TSON, | SON, |
| 针数 | 8 | 8 | 8 | 8 | 8 | 8 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 最大时钟频率 (fCLK) | 15 MHz | 15 MHz | 10 MHz | 10 MHz | 15 MHz | 10 MHz |
| JESD-30 代码 | R-XDSO-N8 | R-XDSO-N8 | R-XDSO-N8 | S-PDSO-N8 | S-PDSO-N8 | R-XDSO-N8 |
| 长度 | 5.99 mm | 5.99 mm | 5.99 mm | 6 mm | 6 mm | 5.99 mm |
| 内存密度 | 750400 bit | 750400 bit | 284992 bit | 815382 bit | 815382 bit | 284992 bit |
| 内存集成电路类型 | CONFIGURATION MEMORY | CONFIGURATION MEMORY | CONFIGURATION MEMORY | CONFIGURATION MEMORY | CONFIGURATION MEMORY | CONFIGURATION MEMORY |
| 内存宽度 | 1 | 1 | 1 | 1 | 1 | 1 |
| 湿度敏感等级 | 3 | 3 | 3 | 3 | 3 | 3 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 8 | 8 | 8 | 8 | 8 | 8 |
| 字数 | 750400 words | 750400 words | 284992 words | 815382 words | 815382 words | 284992 words |
| 字数代码 | 750400 | 750400 | 284992 | 815382 | 815382 | 284992 |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| 最高工作温度 | 85 °C | 70 °C | 70 °C | 85 °C | 70 °C | 85 °C |
| 组织 | 750400X1 | 750400X1 | 284992X1 | 815382X1 | 815382X1 | 284992X1 |
| 封装主体材料 | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | PLASTIC/EPOXY | PLASTIC/EPOXY | UNSPECIFIED |
| 封装代码 | SON | SON | SON | TSON | TSON | SON |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE |
| 并行/串行 | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL |
| 峰值回流温度（摄氏度） | 260 | 260 | 260 | 260 | 260 | 260 |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.14 mm | 1.14 mm | 1.14 mm | 1.14 mm | 1.14 mm | 1.14 mm |
| 最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| 最小供电电压 (Vsup) | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
| 标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL |
| 端子面层 | COPPER NICKEL GOLD | COPPER NICKEL GOLD | COPPER NICKEL GOLD | COPPER NICKEL GOLD | COPPER NICKEL GOLD | COPPER NICKEL GOLD |
| 端子形式 | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
| 端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | 40 | 40 | 40 | 40 | 40 | 40 |
| 宽度 | 5.99 mm | 5.99 mm | 5.99 mm | 6 mm | 6 mm | 5.99 mm |
| 厂商名称 | Atmel (Microchip) | - | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) |
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
