Magnitude Comparator, ACT Series, 4-Bit, True Output, CMOS, CDFP16, FP-16
| 参数名称 | 属性值 |
| 厂商名称 | Cobham Semiconductor Solutions |
| 零件包装代码 | DFP |
| 包装说明 | DFP, |
| 针数 | 16 |
| Reach Compliance Code | unknown |
| 其他特性 | CASCADABLE |
| 系列 | ACT |
| JESD-30 代码 | R-CDFP-F16 |
| 逻辑集成电路类型 | MAGNITUDE COMPARATOR |
| 位数 | 4 |
| 功能数量 | 1 |
| 端子数量 | 16 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 输出极性 | TRUE |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | DFP |
| 封装形状 | RECTANGULAR |
| 封装形式 | FLATPACK |
| 传播延迟（tpd） | 22 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 2.921 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子形式 | FLAT |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 总剂量 | 1M Rad(Si) V |
| 宽度 | 6.731 mm |
| UT54ACTS85-UCC | UT54ACTS85-UCA | UT54ACTS85-PCC | UT54ACTS85-PCX | |
|---|---|---|---|---|
| 描述 | Magnitude Comparator, ACT Series, 4-Bit, True Output, CMOS, CDFP16, FP-16 | Magnitude Comparator, ACT Series, 4-Bit, True Output, CMOS, CDFP16, FP-16 | Magnitude Comparator, ACT Series, 4-Bit, True Output, CMOS, CDIP16, DIP-16 | Magnitude Comparator, ACT Series, 4-Bit, True Output, CMOS, CDIP16, DIP-16 |
| 厂商名称 | Cobham Semiconductor Solutions | Cobham Semiconductor Solutions | Cobham Semiconductor Solutions | Cobham Semiconductor Solutions |
| 零件包装代码 | DFP | DFP | DIP | DIP |
| 包装说明 | DFP, | DFP, | DIP, | DIP, |
| 针数 | 16 | 16 | 16 | 16 |
| Reach Compliance Code | unknown | unknown | unknown | unknow |
| 其他特性 | CASCADABLE | CASCADABLE | CASCADABLE | CASCADABLE |
| 系列 | ACT | ACT | ACT | ACT |
| JESD-30 代码 | R-CDFP-F16 | R-CDFP-F16 | R-CDIP-T16 | R-CDIP-T16 |
| 逻辑集成电路类型 | MAGNITUDE COMPARATOR | MAGNITUDE COMPARATOR | MAGNITUDE COMPARATOR | MAGNITUDE COMPARATOR |
| 位数 | 4 | 4 | 4 | 4 |
| 功能数量 | 1 | 1 | 1 | 1 |
| 端子数量 | 16 | 16 | 16 | 16 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C |
| 输出极性 | TRUE | TRUE | TRUE | TRUE |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | DFP | DFP | DIP | DIP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | FLATPACK | FLATPACK | IN-LINE | IN-LINE |
| 传播延迟（tpd） | 22 ns | 22 ns | 22 ns | 22 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 2.921 mm | 2.921 mm | 5.08 mm | 5.08 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | NO | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子形式 | FLAT | FLAT | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL |
| 总剂量 | 1M Rad(Si) V | 1M Rad(Si) V | 1M Rad(Si) V | 1M Rad(Si) V |
| 宽度 | 6.731 mm | 6.731 mm | 7.62 mm | 7.62 mm |
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