Magnitude Comparator, ACT Series, 4-Bit, True Output, CMOS, CDFP16, FP-16
参数名称 | 属性值 |
厂商名称 | Cobham Semiconductor Solutions |
零件包装代码 | DFP |
包装说明 | DFP, |
针数 | 16 |
Reach Compliance Code | unknown |
其他特性 | CASCADABLE |
系列 | ACT |
JESD-30 代码 | R-CDFP-F16 |
逻辑集成电路类型 | MAGNITUDE COMPARATOR |
位数 | 4 |
功能数量 | 1 |
端子数量 | 16 |
最高工作温度 | 125 °C |
最低工作温度 | -55 °C |
输出极性 | TRUE |
封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
封装代码 | DFP |
封装形状 | RECTANGULAR |
封装形式 | FLATPACK |
传播延迟(tpd) | 22 ns |
认证状态 | Not Qualified |
座面最大高度 | 2.921 mm |
最大供电电压 (Vsup) | 5.5 V |
最小供电电压 (Vsup) | 4.5 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | MILITARY |
端子形式 | FLAT |
端子节距 | 1.27 mm |
端子位置 | DUAL |
总剂量 | 1M Rad(Si) V |
宽度 | 6.731 mm |
UT54ACTS85-UCA | UT54ACTS85-PCC | UT54ACTS85-UCC | UT54ACTS85-PCX | |
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描述 | Magnitude Comparator, ACT Series, 4-Bit, True Output, CMOS, CDFP16, FP-16 | Magnitude Comparator, ACT Series, 4-Bit, True Output, CMOS, CDIP16, DIP-16 | Magnitude Comparator, ACT Series, 4-Bit, True Output, CMOS, CDFP16, FP-16 | Magnitude Comparator, ACT Series, 4-Bit, True Output, CMOS, CDIP16, DIP-16 |
厂商名称 | Cobham Semiconductor Solutions | Cobham Semiconductor Solutions | Cobham Semiconductor Solutions | Cobham Semiconductor Solutions |
零件包装代码 | DFP | DIP | DFP | DIP |
包装说明 | DFP, | DIP, | DFP, | DIP, |
针数 | 16 | 16 | 16 | 16 |
Reach Compliance Code | unknown | unknown | unknown | unknow |
其他特性 | CASCADABLE | CASCADABLE | CASCADABLE | CASCADABLE |
系列 | ACT | ACT | ACT | ACT |
JESD-30 代码 | R-CDFP-F16 | R-CDIP-T16 | R-CDFP-F16 | R-CDIP-T16 |
逻辑集成电路类型 | MAGNITUDE COMPARATOR | MAGNITUDE COMPARATOR | MAGNITUDE COMPARATOR | MAGNITUDE COMPARATOR |
位数 | 4 | 4 | 4 | 4 |
功能数量 | 1 | 1 | 1 | 1 |
端子数量 | 16 | 16 | 16 | 16 |
最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C |
最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C |
输出极性 | TRUE | TRUE | TRUE | TRUE |
封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
封装代码 | DFP | DIP | DFP | DIP |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | FLATPACK | IN-LINE | FLATPACK | IN-LINE |
传播延迟(tpd) | 22 ns | 22 ns | 22 ns | 22 ns |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 2.921 mm | 5.08 mm | 2.921 mm | 5.08 mm |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | NO | YES | NO |
技术 | CMOS | CMOS | CMOS | CMOS |
温度等级 | MILITARY | MILITARY | MILITARY | MILITARY |
端子形式 | FLAT | THROUGH-HOLE | FLAT | THROUGH-HOLE |
端子节距 | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL |
总剂量 | 1M Rad(Si) V | 1M Rad(Si) V | 1M Rad(Si) V | 1M Rad(Si) V |
宽度 | 6.731 mm | 7.62 mm | 6.731 mm | 7.62 mm |
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