Flash, 128MX16, 76ns, PBGA63, 11 X 13 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, FBGA-63
| 参数名称 | 属性值 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | SAMSUNG(三星) |
| 零件包装代码 | BGA |
| 包装说明 | TFBGA, BGA63,10X12,32 |
| 针数 | 63 |
| Reach Compliance Code | compliant |
| ECCN代码 | 3A991.B.1.A |
| 最长访问时间 | 76 ns |
| 其他特性 | SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE |
| 命令用户界面 | YES |
| 数据轮询 | NO |
| JESD-30 代码 | R-PBGA-B63 |
| JESD-609代码 | e1 |
| 长度 | 13 mm |
| 内存密度 | 2147483648 bit |
| 内存集成电路类型 | FLASH |
| 内存宽度 | 16 |
| 湿度敏感等级 | 2 |
| 功能数量 | 1 |
| 部门数/规模 | 2K |
| 端子数量 | 63 |
| 字数 | 134217728 words |
| 字数代码 | 128000000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -30 °C |
| 组织 | 128MX16 |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | TFBGA |
| 封装等效代码 | BGA63,10X12,32 |
| 封装形状 | RECTANGULAR |
| 封装形式 | GRID ARRAY, THIN PROFILE, FINE PITCH |
| 页面大小 | 1K words |
| 并行/串行 | PARALLEL |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | 1.8 V |
| 编程电压 | 1.8 V |
| 认证状态 | Not Qualified |
| 就绪/忙碌 | YES |
| 座面最大高度 | 1.2 mm |
| 部门规模 | 64K |
| 最大待机电流 | 0.00005 A |
| 最大压摆率 | 0.04 mA |
| 最大供电电压 (Vsup) | 1.95 V |
| 最小供电电压 (Vsup) | 1.7 V |
| 标称供电电压 (Vsup) | 1.8 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | OTHER |
| 端子面层 | Tin/Silver/Copper (Sn/Ag/Cu) |
| 端子形式 | BALL |
| 端子节距 | 0.8 mm |
| 端子位置 | BOTTOM |
| 处于峰值回流温度下的最长时间 | 40 |
| 切换位 | YES |
| 类型 | SLC NAND TYPE |
| 宽度 | 11 mm |
| KFN2G16Q2M-DEB50 | KFM1G16Q2M-DEB6000 | KFM1G16Q2M-DEB6T | KFN2G16Q2M-DEB6T | KFN2G16Q2M-DEB6000 | KFN2G16Q2M-DEB5T | KFM1G16Q2M-DEB5T | |
|---|---|---|---|---|---|---|---|
| 描述 | Flash, 128MX16, 76ns, PBGA63, 11 X 13 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, FBGA-63 | Flash, 64MX16, 76ns, PBGA63 | Flash, 64MX16, 76ns, PBGA63 | Flash, 128MX16, 76ns, PBGA63 | Flash, 128MX16, 76ns, PBGA63 | Flash, 128MX16, 76ns, PBGA63 | Flash, 64MX16, 76ns, PBGA63 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | SAMSUNG(三星) | SAMSUNG(三星) | SAMSUNG(三星) | SAMSUNG(三星) | SAMSUNG(三星) | SAMSUNG(三星) | SAMSUNG(三星) |
| 包装说明 | TFBGA, BGA63,10X12,32 | FBGA, BGA63,10X12,32 | FBGA, BGA63,10X12,32 | FBGA, BGA63,10X12,32 | FBGA, BGA63,10X12,32 | FBGA, BGA63,10X12,32 | FBGA, BGA63,10X12,32 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compli |
| 最长访问时间 | 76 ns | 76 ns | 76 ns | 76 ns | 76 ns | 76 ns | 76 ns |
| 命令用户界面 | YES | YES | YES | YES | YES | YES | YES |
| 数据轮询 | NO | NO | NO | NO | NO | NO | NO |
| JESD-30 代码 | R-PBGA-B63 | R-PBGA-B63 | R-PBGA-B63 | R-PBGA-B63 | R-PBGA-B63 | R-PBGA-B63 | R-PBGA-B63 |
| JESD-609代码 | e1 | e3 | e3 | e3 | e3 | e3 | e3 |
| 内存密度 | 2147483648 bit | 1073741824 bit | 1073741824 bit | 2147483648 bit | 2147483648 bit | 2147483648 bit | 1073741824 bi |
| 内存集成电路类型 | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH |
| 内存宽度 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| 湿度敏感等级 | 2 | 1 | 1 | 1 | 1 | 1 | 1 |
| 部门数/规模 | 2K | 1K | 1K | 2K | 2K | 2K | 1K |
| 端子数量 | 63 | 63 | 63 | 63 | 63 | 63 | 63 |
| 字数 | 134217728 words | 67108864 words | 67108864 words | 134217728 words | 134217728 words | 134217728 words | 67108864 words |
| 字数代码 | 128000000 | 64000000 | 64000000 | 128000000 | 128000000 | 128000000 | 64000000 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -30 °C | -30 °C | -30 °C | -30 °C | -30 °C | -30 °C | -30 °C |
| 组织 | 128MX16 | 64MX16 | 64MX16 | 128MX16 | 128MX16 | 128MX16 | 64MX16 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | TFBGA | FBGA | FBGA | FBGA | FBGA | FBGA | FBGA |
| 封装等效代码 | BGA63,10X12,32 | BGA63,10X12,32 | BGA63,10X12,32 | BGA63,10X12,32 | BGA63,10X12,32 | BGA63,10X12,32 | BGA63,10X12,32 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | GRID ARRAY, THIN PROFILE, FINE PITCH | GRID ARRAY, FINE PITCH | GRID ARRAY, FINE PITCH | GRID ARRAY, FINE PITCH | GRID ARRAY, FINE PITCH | GRID ARRAY, FINE PITCH | GRID ARRAY, FINE PITCH |
| 页面大小 | 1K words | 1K words | 1K words | 1K words | 1K words | 1K words | 1K words |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 峰值回流温度（摄氏度） | 260 | 225 | 225 | 225 | 225 | 225 | 225 |
| 电源 | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 就绪/忙碌 | YES | YES | YES | YES | YES | YES | YES |
| 部门规模 | 64K | 64K | 64K | 64K | 64K | 64K | 64K |
| 最大待机电流 | 0.00005 A | 0.00005 A | 0.00005 A | 0.00005 A | 0.00005 A | 0.00005 A | 0.00005 A |
| 最大压摆率 | 0.04 mA | 0.04 mA | 0.04 mA | 0.04 mA | 0.04 mA | 0.04 mA | 0.04 mA |
| 标称供电电压 (Vsup) | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | OTHER | OTHER | OTHER | OTHER | OTHER | OTHER | OTHER |
| 端子面层 | Tin/Silver/Copper (Sn/Ag/Cu) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) |
| 端子形式 | BALL | BALL | BALL | BALL | BALL | BALL | BALL |
| 端子节距 | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm |
| 端子位置 | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
| 处于峰值回流温度下的最长时间 | 40 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 切换位 | YES | YES | YES | YES | YES | YES | YES |
| 类型 | SLC NAND TYPE | SLC NAND TYPE | SLC NAND TYPE | SLC NAND TYPE | SLC NAND TYPE | SLC NAND TYPE | SLC NAND TYPE |
| 是否无铅 | - | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
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