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BR24C02-10TU-1.8E2

产品描述EEPROM, 256X8, Serial, CMOS, PDSO8
产品类别存储    存储   
文件大小309KB,共6页
制造商ROHM(罗姆半导体)
官网地址https://www.rohm.com/
标准
下载文档 详细参数 选型对比 全文预览

BR24C02-10TU-1.8E2概述

EEPROM, 256X8, Serial, CMOS, PDSO8

BR24C02-10TU-1.8E2规格参数

参数名称属性值
是否Rohs认证符合
厂商名称ROHM(罗姆半导体)
包装说明TSSOP, TSSOP8,.25
Reach Compliance Codeunknown
数据保留时间-最小值100
耐久性1000000 Write/Erase Cycles
I2C控制字节1010DDDR
JESD-30 代码R-PDSO-G8
内存密度2048 bit
内存集成电路类型EEPROM
内存宽度8
端子数量8
字数256 words
字数代码256
最高工作温度85 °C
最低工作温度-40 °C
组织256X8
封装主体材料PLASTIC/EPOXY
封装代码TSSOP
封装等效代码TSSOP8,.25
封装形状RECTANGULAR
封装形式SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
并行/串行SERIAL
电源2/5 V
认证状态Not Qualified
串行总线类型I2C
最大待机电流0.000003 A
最大压摆率0.003 mA
表面贴装YES
技术CMOS
温度等级INDUSTRIAL
端子形式GULL WING
端子节距0.635 mm
端子位置DUAL
写保护HARDWARE

BR24C02-10TU-1.8E2文档预览

Appendix
Notes
No technical content pages of this document may be reproduced in any form or transmitted by any
means without prior permission of ROHM CO.,LTD.
The contents described herein are subject to change without notice. The specifications for the
product described in this document are for reference only. Upon actual use, therefore, please request
that specifications to be separately delivered.
Application circuit diagrams and circuit constants contained herein are shown as examples of standard
use and operation. Please pay careful attention to the peripheral conditions when designing circuits
and deciding upon circuit constants in the set.
Any data, including, but not limited to application circuit diagrams information, described herein
are intended only as illustrations of such devices and not as the specifications for such devices. ROHM
CO.,LTD. disclaims any warranty that any use of such devices shall be free from infringement of any
third party's intellectual property rights or other proprietary rights, and further, assumes no liability of
whatsoever nature in the event of any such infringement, or arising from or connected with or related
to the use of such devices.
Upon the sale of any such devices, other than for buyer's right to use such devices itself, resell or
otherwise dispose of the same, no express or implied right or license to practice or commercially
exploit any intellectual property rights or other proprietary rights owned or controlled by
ROHM CO., LTD. is granted to any such buyer.
Products listed in this document are no antiradiation design.
The products listed in this document are designed to be used with ordinary electronic equipment or devices
(such as audio visual equipment, office-automation equipment, communications devices, electrical
appliances and electronic toys).
Should you intend to use these products with equipment or devices which require an extremely high level of
reliability and the malfunction of with would directly endanger human life (such as medical instruments,
transportation equipment, aerospace machinery, nuclear-reactor controllers, fuel controllers and other
safety devices), please be sure to consult with our sales representative in advance.
About Export Control Order in Japan
Products described herein are the objects of controlled goods in Annex 1 (Item 16) of Export Trade Control
Order in Japan.
In case of export from Japan, please confirm if it applies to "objective" criteria or an "informed" (by MITI clause)
on the basis of "catch all controls for Non-Proliferation of Weapons of Mass Destruction.
Appendix1-Rev1.1

BR24C02-10TU-1.8E2相似产品对比

BR24C02-10TU-1.8E2 BR24C01A-10TU-1.8E2 BR24C01A-10TU-1.8E1 BR24C02-10TU-1.8E1 BR24C04-10TU-1.8E1 BR24C04-10TU-1.8E2
描述 EEPROM, 256X8, Serial, CMOS, PDSO8 EEPROM, 128X8, Serial, CMOS, PDSO8 EEPROM, 128X8, Serial, CMOS, PDSO8 EEPROM, 256X8, Serial, CMOS, PDSO8 EEPROM, 512X8, Serial, CMOS, PDSO8 EEPROM, 512X8, Serial, CMOS, PDSO8
是否Rohs认证 符合 符合 符合 符合 符合 符合
厂商名称 ROHM(罗姆半导体) ROHM(罗姆半导体) ROHM(罗姆半导体) ROHM(罗姆半导体) ROHM(罗姆半导体) ROHM(罗姆半导体)
包装说明 TSSOP, TSSOP8,.25 TSSOP, TSSOP8,.25 TSSOP, TSSOP8,.25 TSSOP, TSSOP8,.25 TSSOP, TSSOP8,.25 TSSOP, TSSOP8,.25
Reach Compliance Code unknown unknown unknown unknown unknown unknown
数据保留时间-最小值 100 100 100 100 100 100
耐久性 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles
I2C控制字节 1010DDDR 1010DDDR 1010DDDR 1010DDDR 1010DDMR 1010DDMR
JESD-30 代码 R-PDSO-G8 R-PDSO-G8 R-PDSO-G8 R-PDSO-G8 R-PDSO-G8 R-PDSO-G8
内存密度 2048 bit 1024 bit 1024 bit 2048 bit 4096 bit 4096 bit
内存集成电路类型 EEPROM EEPROM EEPROM EEPROM EEPROM EEPROM
内存宽度 8 8 8 8 8 8
端子数量 8 8 8 8 8 8
字数 256 words 128 words 128 words 256 words 512 words 512 words
字数代码 256 128 128 256 512 512
最高工作温度 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C
最低工作温度 -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
组织 256X8 128X8 128X8 256X8 512X8 512X8
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 TSSOP TSSOP TSSOP TSSOP TSSOP TSSOP
封装等效代码 TSSOP8,.25 TSSOP8,.25 TSSOP8,.25 TSSOP8,.25 TSSOP8,.25 TSSOP8,.25
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
并行/串行 SERIAL SERIAL SERIAL SERIAL SERIAL SERIAL
电源 2/5 V 2/5 V 2/5 V 2/5 V 2/5 V 2/5 V
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
串行总线类型 I2C I2C I2C I2C I2C I2C
最大待机电流 0.000003 A 0.000003 A 0.000003 A 0.000003 A 0.000003 A 0.000003 A
最大压摆率 0.003 mA 0.003 mA 0.003 mA 0.003 mA 0.003 mA 0.003 mA
表面贴装 YES YES YES YES YES YES
技术 CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
端子形式 GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING
端子节距 0.635 mm 0.635 mm 0.635 mm 0.635 mm 0.635 mm 0.635 mm
端子位置 DUAL DUAL DUAL DUAL DUAL DUAL
写保护 HARDWARE HARDWARE HARDWARE HARDWARE HARDWARE HARDWARE
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