Correlator, 4-Bit, CMOS, CPGA68,
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| Objectid | 1450420174 |
| Reach Compliance Code | unknown |
| YTEOL | 0 |
| 其他特性 | ICC SPECIFIED @ 20MHZ |
| 边界扫描 | NO |
| 最大时钟频率 | 17 MHz |
| 外部数据总线宽度 | 4 |
| JESD-30 代码 | S-CPGA-P68 |
| JESD-609代码 | e0 |
| 低功率模式 | NO |
| 端子数量 | 68 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 输出数据总线宽度 | 1 |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | PGA |
| 封装等效代码 | PGA68,11X11 |
| 封装形状 | SQUARE |
| 封装形式 | GRID ARRAY |
| 认证状态 | Not Qualified |
| 最大压摆率 | 70 mA |
| 最大供电电压 | 5.25 V |
| 最小供电电压 | 4.75 V |
| 标称供电电压 | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | TIN LEAD |
| 端子形式 | PIN/PEG |
| 端子节距 | 2.54 mm |
| 端子位置 | PERPENDICULAR |
| uPs/uCs/外围集成电路类型 | DSP PERIPHERAL, CORRELATOR |
| TMC2220G8C | TMC2221B6V1 | TMC2221B6C1 | TMC2220H8C1 | TMC2220G8V1 | TMC2220G8C1 | TMC2220H8C | TMC2221B6C | TMC2221B6V | TMC2220G8V | |
|---|---|---|---|---|---|---|---|---|---|---|
| 描述 | Correlator, 4-Bit, CMOS, CPGA68, | Correlator, 1-Bit, CMOS, CDIP28, | Correlator, 1-Bit, CMOS, CDIP28, | Correlator, 4-Bit, CMOS, PPGA69, | Correlator, 4-Bit, CMOS, CPGA68, | Correlator, 4-Bit, CMOS, CPGA68, | Correlator, 4-Bit, CMOS, PPGA69, | Correlator, 1-Bit, CMOS, CDIP28, | Correlator, 1-Bit, CMOS, CDIP28, | Correlator, 4-Bit, CMOS, CPGA68, |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknow | unknown |
| 边界扫描 | NO | NO | NO | NO | NO | NO | NO | NO | NO | NO |
| 最大时钟频率 | 17 MHz | 20 MHz | 20 MHz | 20 MHz | 20 MHz | 20 MHz | 17 MHz | 17 MHz | 17 MHz | 17 MHz |
| 外部数据总线宽度 | 4 | 1 | 1 | 4 | 4 | 4 | 4 | 1 | 1 | 4 |
| JESD-30 代码 | S-CPGA-P68 | R-GDIP-T28 | R-GDIP-T28 | S-PPGA-P69 | S-CPGA-P68 | S-CPGA-P68 | S-PPGA-P69 | R-GDIP-T28 | R-GDIP-T28 | S-CPGA-P68 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 低功率模式 | NO | NO | NO | NO | NO | NO | NO | NO | NO | NO |
| 端子数量 | 68 | 28 | 28 | 69 | 68 | 68 | 69 | 28 | 28 | 68 |
| 最高工作温度 | 70 °C | 125 °C | 70 °C | 70 °C | 125 °C | 70 °C | 70 °C | 70 °C | 125 °C | 125 °C |
| 输出数据总线宽度 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | PGA | DIP | DIP | PGA | PGA | PGA | PGA | DIP | DIP | PGA |
| 封装等效代码 | PGA68,11X11 | DIP28,.6 | DIP28,.6 | PGA68,11X11 | PGA68,11X11 | PGA68,11X11 | PGA68,11X11 | DIP28,.6 | DIP28,.6 | PGA68,11X11 |
| 封装形状 | SQUARE | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE | SQUARE | SQUARE | RECTANGULAR | RECTANGULAR | SQUARE |
| 封装形式 | GRID ARRAY | IN-LINE | IN-LINE | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | IN-LINE | IN-LINE | GRID ARRAY |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最大压摆率 | 70 mA | 80 mA | 70 mA | 70 mA | 80 mA | 70 mA | 70 mA | 70 mA | 80 mA | 80 mA |
| 最大供电电压 | 5.25 V | 5.5 V | 5.25 V | 5.25 V | 5.5 V | 5.25 V | 5.25 V | 5.25 V | 5.5 V | 5.5 V |
| 最小供电电压 | 4.75 V | 4.5 V | 4.75 V | 4.75 V | 4.5 V | 4.75 V | 4.75 V | 4.75 V | 4.5 V | 4.5 V |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | NO | NO | NO | NO | NO | NO | NO | NO | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | MILITARY | COMMERCIAL | COMMERCIAL | MILITARY | COMMERCIAL | COMMERCIAL | COMMERCIAL | MILITARY | MILITARY |
| 端子面层 | TIN LEAD | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | TIN LEAD | TIN LEAD | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | TIN LEAD |
| 端子形式 | PIN/PEG | THROUGH-HOLE | THROUGH-HOLE | PIN/PEG | PIN/PEG | PIN/PEG | PIN/PEG | THROUGH-HOLE | THROUGH-HOLE | PIN/PEG |
| 端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| 端子位置 | PERPENDICULAR | DUAL | DUAL | PERPENDICULAR | PERPENDICULAR | PERPENDICULAR | PERPENDICULAR | DUAL | DUAL | PERPENDICULAR |
| uPs/uCs/外围集成电路类型 | DSP PERIPHERAL, CORRELATOR | DSP PERIPHERAL, CORRELATOR | DSP PERIPHERAL, CORRELATOR | DSP PERIPHERAL, CORRELATOR | DSP PERIPHERAL, CORRELATOR | DSP PERIPHERAL, CORRELATOR | DSP PERIPHERAL, CORRELATOR | DSP PERIPHERAL, CORRELATOR | DSP PERIPHERAL, CORRELATOR | DSP PERIPHERAL, CORRELATOR |
| 其他特性 | ICC SPECIFIED @ 20MHZ | OPTEMP SPECIFIED AS TC | - | - | OPTEMP SPECIFIED AS TC | - | ICC SPECIFIED @ 20MHZ | ICC SPECIFIED @ 20MHZ | OPTEMP SPECIFIED AS TC; ICC SPECIFIED @ 20MHZ | OPTEMP SPECIFIED AS TC; ICC SPECIFIED @ 20MHZ |
| 峰值回流温度（摄氏度） | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - |
| 电源 | - | 5 V | 5 V | 5 V | - | - | 5 V | 5 V | 5 V | - |
| 处于峰值回流温度下的最长时间 | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - |
PCB设计
WindowsCE
微控制器 MCU
RF/无线
单片机
FPGA/CPLD
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
