Fast Page DRAM Module, 1MX9, 70ns, CMOS, SIMM-30
参数名称 | 属性值 |
厂商名称 | Motorola ( NXP ) |
包装说明 | SIMM-30 |
Reach Compliance Code | unknown |
ECCN代码 | EAR99 |
访问模式 | FAST PAGE |
最长访问时间 | 70 ns |
其他特性 | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH; SEPARATE CAS FOR NINTH BIT |
JESD-30 代码 | R-XSMA-N30 |
内存密度 | 9437184 bit |
内存集成电路类型 | FAST PAGE DRAM MODULE |
内存宽度 | 9 |
功能数量 | 1 |
端口数量 | 1 |
端子数量 | 30 |
字数 | 1048576 words |
字数代码 | 1000000 |
工作模式 | ASYNCHRONOUS |
最高工作温度 | 70 °C |
最低工作温度 | |
组织 | 1MX9 |
输出特性 | 3-STATE |
封装主体材料 | UNSPECIFIED |
封装形状 | RECTANGULAR |
封装形式 | MICROELECTRONIC ASSEMBLY |
认证状态 | Not Qualified |
刷新周期 | 512 |
最大供电电压 (Vsup) | 5.5 V |
最小供电电压 (Vsup) | 4.5 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | NO |
技术 | CMOS |
温度等级 | COMMERCIAL |
端子形式 | NO LEAD |
端子位置 | SINGLE |
MCM91000SG70 | MCM91000S80 | MCM91000L80 | MCM91000SG80 | MCM91000LH80 | MCM91000LH70 | MCM91000S70 | MCM91000AS70 | MCM91000AS80 | MCM91000L70 | |
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描述 | Fast Page DRAM Module, 1MX9, 70ns, CMOS, SIMM-30 | 1MX9 FAST PAGE DRAM MODULE, 80ns, SMA30, SIMM-30 | 1MX9 FAST PAGE DRAM MODULE, 80ns, SMA30, SIMM-30 | Fast Page DRAM Module, 1MX9, 80ns, CMOS, SIMM-30 | Fast Page DRAM Module, 1MX9, 80ns, CMOS, SIMM-30 | 1MX9 FAST PAGE DRAM MODULE, 70ns, SMA30, SIMM-30 | 1M X 9 FAST PAGE DRAM MODULE, 70 ns, SMA30, SIMM-30 | 1MX9 FAST PAGE DRAM MODULE, 70ns, SMA30, SIMM-30 | 1MX9 FAST PAGE DRAM MODULE, 80ns, SMA30, SIMM-30 | 1MX9 FAST PAGE DRAM MODULE, 70ns, SMA30, SIMM-30 |
包装说明 | SIMM-30 | SIMM, SIM30 | , SIP30,.2 | SIMM-30 | SIMM-30 | , SIP30(UNSPEC) | SIMM, SIM30 | SIMM, SIM30 | SIMM, SIM30 | , SIP30,.2 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknow | unknow | unknow |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
访问模式 | FAST PAGE | FAST PAGE | FAST PAGE | FAST PAGE | FAST PAGE | FAST PAGE | FAST PAGE | FAST PAGE | FAST PAGE | FAST PAGE |
最长访问时间 | 70 ns | 80 ns | 80 ns | 80 ns | 80 ns | 70 ns | 70 ns | 70 ns | 80 ns | 70 ns |
其他特性 | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH; SEPARATE CAS FOR NINTH BIT | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH; SEPARATE CAS FOR NINTH BIT | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH; SEPARATE CAS FOR NINTH BIT | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH; SEPARATE CAS FOR NINTH BIT | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH; SEPARATE CAS FOR NINTH BIT | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH; SEPARATE CAS FOR NINTH BIT | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH; SEPARATE CAS FOR NINTH BIT | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH; SEPARATE CAS FOR NINTH BIT | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH; SEPARATE CAS FOR NINTH BIT | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH; SEPARATE CAS FOR NINTH BIT |
JESD-30 代码 | R-XSMA-N30 | R-XSMA-N30 | R-XSMA-T30 | R-XSMA-N30 | R-XSMA-T30 | R-XSMA-T30 | R-XSMA-N30 | R-XSMA-N30 | R-XSMA-N30 | R-XSMA-T30 |
内存密度 | 9437184 bit | 9437184 bit | 9437184 bit | 9437184 bit | 9437184 bit | 9437184 bit | 9437184 bit | 9437184 bi | 9437184 bi | 9437184 bi |
内存集成电路类型 | FAST PAGE DRAM MODULE | FAST PAGE DRAM MODULE | FAST PAGE DRAM MODULE | FAST PAGE DRAM MODULE | FAST PAGE DRAM MODULE | FAST PAGE DRAM MODULE | FAST PAGE DRAM MODULE | FAST PAGE DRAM MODULE | FAST PAGE DRAM MODULE | FAST PAGE DRAM MODULE |
内存宽度 | 9 | 9 | 9 | 9 | 9 | 9 | 9 | 9 | 9 | 9 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端口数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 30 | 30 | 30 | 30 | 30 | 30 | 30 | 30 | 30 | 30 |
字数 | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words |
字数代码 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 |
工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
组织 | 1MX9 | 1MX9 | 1MX9 | 1MX9 | 1MX9 | 1MX9 | 1MX9 | 1MX9 | 1MX9 | 1MX9 |
输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
封装主体材料 | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
刷新周期 | 512 | 512 | 512 | 512 | 512 | 512 | 512 | 512 | 512 | 512 |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | NO | NO | NO | NO | NO | NO | NO | NO | NO | NO |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子形式 | NO LEAD | NO LEAD | THROUGH-HOLE | NO LEAD | THROUGH-HOLE | THROUGH-HOLE | NO LEAD | NO LEAD | NO LEAD | THROUGH-HOLE |
端子位置 | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE |
厂商名称 | Motorola ( NXP ) | - | Motorola ( NXP ) | Motorola ( NXP ) | Motorola ( NXP ) | Motorola ( NXP ) | Motorola ( NXP ) | Motorola ( NXP ) | Motorola ( NXP ) | Motorola ( NXP ) |
零件包装代码 | - | SIMM | SIMM | - | - | SIMM | SIMM | SIMM | SIMM | SIMM |
针数 | - | 30 | 30 | - | - | 30 | 30 | 30 | 30 | 30 |
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