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MCM91000SG70

产品描述Fast Page DRAM Module, 1MX9, 70ns, CMOS, SIMM-30
产品类别存储    存储   
文件大小384KB,共12页
制造商Motorola ( NXP )
官网地址https://www.nxp.com
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MCM91000SG70概述

Fast Page DRAM Module, 1MX9, 70ns, CMOS, SIMM-30

MCM91000SG70规格参数

参数名称属性值
厂商名称Motorola ( NXP )
包装说明SIMM-30
Reach Compliance Codeunknown
ECCN代码EAR99
访问模式FAST PAGE
最长访问时间70 ns
其他特性RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH; SEPARATE CAS FOR NINTH BIT
JESD-30 代码R-XSMA-N30
内存密度9437184 bit
内存集成电路类型FAST PAGE DRAM MODULE
内存宽度9
功能数量1
端口数量1
端子数量30
字数1048576 words
字数代码1000000
工作模式ASYNCHRONOUS
最高工作温度70 °C
最低工作温度
组织1MX9
输出特性3-STATE
封装主体材料UNSPECIFIED
封装形状RECTANGULAR
封装形式MICROELECTRONIC ASSEMBLY
认证状态Not Qualified
刷新周期512
最大供电电压 (Vsup)5.5 V
最小供电电压 (Vsup)4.5 V
标称供电电压 (Vsup)5 V
表面贴装NO
技术CMOS
温度等级COMMERCIAL
端子形式NO LEAD
端子位置SINGLE

MCM91000SG70相似产品对比

MCM91000SG70 MCM91000S80 MCM91000L80 MCM91000SG80 MCM91000LH80 MCM91000LH70 MCM91000S70 MCM91000AS70 MCM91000AS80 MCM91000L70
描述 Fast Page DRAM Module, 1MX9, 70ns, CMOS, SIMM-30 1MX9 FAST PAGE DRAM MODULE, 80ns, SMA30, SIMM-30 1MX9 FAST PAGE DRAM MODULE, 80ns, SMA30, SIMM-30 Fast Page DRAM Module, 1MX9, 80ns, CMOS, SIMM-30 Fast Page DRAM Module, 1MX9, 80ns, CMOS, SIMM-30 1MX9 FAST PAGE DRAM MODULE, 70ns, SMA30, SIMM-30 1M X 9 FAST PAGE DRAM MODULE, 70 ns, SMA30, SIMM-30 1MX9 FAST PAGE DRAM MODULE, 70ns, SMA30, SIMM-30 1MX9 FAST PAGE DRAM MODULE, 80ns, SMA30, SIMM-30 1MX9 FAST PAGE DRAM MODULE, 70ns, SMA30, SIMM-30
包装说明 SIMM-30 SIMM, SIM30 , SIP30,.2 SIMM-30 SIMM-30 , SIP30(UNSPEC) SIMM, SIM30 SIMM, SIM30 SIMM, SIM30 , SIP30,.2
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown unknow unknow unknow
ECCN代码 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
访问模式 FAST PAGE FAST PAGE FAST PAGE FAST PAGE FAST PAGE FAST PAGE FAST PAGE FAST PAGE FAST PAGE FAST PAGE
最长访问时间 70 ns 80 ns 80 ns 80 ns 80 ns 70 ns 70 ns 70 ns 80 ns 70 ns
其他特性 RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH; SEPARATE CAS FOR NINTH BIT RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH; SEPARATE CAS FOR NINTH BIT RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH; SEPARATE CAS FOR NINTH BIT RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH; SEPARATE CAS FOR NINTH BIT RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH; SEPARATE CAS FOR NINTH BIT RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH; SEPARATE CAS FOR NINTH BIT RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH; SEPARATE CAS FOR NINTH BIT RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH; SEPARATE CAS FOR NINTH BIT RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH; SEPARATE CAS FOR NINTH BIT RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH; SEPARATE CAS FOR NINTH BIT
JESD-30 代码 R-XSMA-N30 R-XSMA-N30 R-XSMA-T30 R-XSMA-N30 R-XSMA-T30 R-XSMA-T30 R-XSMA-N30 R-XSMA-N30 R-XSMA-N30 R-XSMA-T30
内存密度 9437184 bit 9437184 bit 9437184 bit 9437184 bit 9437184 bit 9437184 bit 9437184 bit 9437184 bi 9437184 bi 9437184 bi
内存集成电路类型 FAST PAGE DRAM MODULE FAST PAGE DRAM MODULE FAST PAGE DRAM MODULE FAST PAGE DRAM MODULE FAST PAGE DRAM MODULE FAST PAGE DRAM MODULE FAST PAGE DRAM MODULE FAST PAGE DRAM MODULE FAST PAGE DRAM MODULE FAST PAGE DRAM MODULE
内存宽度 9 9 9 9 9 9 9 9 9 9
功能数量 1 1 1 1 1 1 1 1 1 1
端口数量 1 1 1 1 1 1 1 1 1 1
端子数量 30 30 30 30 30 30 30 30 30 30
字数 1048576 words 1048576 words 1048576 words 1048576 words 1048576 words 1048576 words 1048576 words 1048576 words 1048576 words 1048576 words
字数代码 1000000 1000000 1000000 1000000 1000000 1000000 1000000 1000000 1000000 1000000
工作模式 ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
最高工作温度 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C
组织 1MX9 1MX9 1MX9 1MX9 1MX9 1MX9 1MX9 1MX9 1MX9 1MX9
输出特性 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
封装主体材料 UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
刷新周期 512 512 512 512 512 512 512 512 512 512
最大供电电压 (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
最小供电电压 (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
标称供电电压 (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
表面贴装 NO NO NO NO NO NO NO NO NO NO
技术 CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
端子形式 NO LEAD NO LEAD THROUGH-HOLE NO LEAD THROUGH-HOLE THROUGH-HOLE NO LEAD NO LEAD NO LEAD THROUGH-HOLE
端子位置 SINGLE SINGLE SINGLE SINGLE SINGLE SINGLE SINGLE SINGLE SINGLE SINGLE
厂商名称 Motorola ( NXP ) - Motorola ( NXP ) Motorola ( NXP ) Motorola ( NXP ) Motorola ( NXP ) Motorola ( NXP ) Motorola ( NXP ) Motorola ( NXP ) Motorola ( NXP )
零件包装代码 - SIMM SIMM - - SIMM SIMM SIMM SIMM SIMM
针数 - 30 30 - - 30 30 30 30 30

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