SRAM Module, 128KX32, 15ns, CMOS, STACK, TSOP-64
| 参数名称 | 属性值 |
| 厂商名称 | B&B Electronics Manufacturing Company |
| 零件包装代码 | QMA |
| 包装说明 | , |
| 针数 | 64 |
| Reach Compliance Code | unknown |
| ECCN代码 | 3A991.B.2.A |
| 最长访问时间 | 15 ns |
| 其他特性 | CONFIGURABLE AS 512K X 8 |
| 备用内存宽度 | 16 |
| JESD-30 代码 | R-XQMA-N64 |
| 内存密度 | 4194304 bit |
| 内存集成电路类型 | SRAM MODULE |
| 内存宽度 | 32 |
| 功能数量 | 1 |
| 端子数量 | 64 |
| 字数 | 131072 words |
| 字数代码 | 128000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 组织 | 128KX32 |
| 封装主体材料 | UNSPECIFIED |
| 封装形状 | RECTANGULAR |
| 封装形式 | MICROELECTRONIC ASSEMBLY |
| 并行/串行 | PARALLEL |
| 认证状态 | Not Qualified |
| 最大供电电压 (Vsup) | 3.6 V |
| 最小供电电压 (Vsup) | 3 V |
| 标称供电电压 (Vsup) | 3.3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子形式 | NO LEAD |
| 端子位置 | QUAD |
| DP3S128X32Y5-15CI | DP3S128X32Y5-10C | DP3S128X32Y5-10CI | DP3S128X32Y5-12C | DP3S128X32Y5-12CI | DP3S128X32Y5-15C | |
|---|---|---|---|---|---|---|
| 描述 | SRAM Module, 128KX32, 15ns, CMOS, STACK, TSOP-64 | SRAM Module, 128KX32, 10ns, CMOS, STACK, TSOP-64 | SRAM Module, 128KX32, 10ns, CMOS, STACK, TSOP-64 | SRAM Module, 128KX32, 12ns, CMOS, STACK, TSOP-64 | SRAM Module, 128KX32, 12ns, CMOS, STACK, TSOP-64 | SRAM Module, 128KX32, 15ns, CMOS, STACK, TSOP-64 |
| 厂商名称 | B&B Electronics Manufacturing Company | B&B Electronics Manufacturing Company | B&B Electronics Manufacturing Company | B&B Electronics Manufacturing Company | B&B Electronics Manufacturing Company | B&B Electronics Manufacturing Company |
| 零件包装代码 | QMA | QMA | QMA | QMA | QMA | QMA |
| 针数 | 64 | 64 | 64 | 64 | 64 | 64 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
| ECCN代码 | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A |
| 最长访问时间 | 15 ns | 10 ns | 10 ns | 12 ns | 12 ns | 15 ns |
| 其他特性 | CONFIGURABLE AS 512K X 8 | CONFIGURABLE AS 512K X 8 | CONFIGURABLE AS 512K X 8 | CONFIGURABLE AS 512K X 8 | CONFIGURABLE AS 512K X 8 | CONFIGURABLE AS 512K X 8 |
| 备用内存宽度 | 16 | 16 | 16 | 16 | 16 | 16 |
| JESD-30 代码 | R-XQMA-N64 | R-XQMA-N64 | R-XQMA-N64 | R-XQMA-N64 | R-XQMA-N64 | R-XQMA-N64 |
| 内存密度 | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit |
| 内存集成电路类型 | SRAM MODULE | SRAM MODULE | SRAM MODULE | SRAM MODULE | SRAM MODULE | SRAM MODULE |
| 内存宽度 | 32 | 32 | 32 | 32 | 32 | 32 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 64 | 64 | 64 | 64 | 64 | 64 |
| 字数 | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words |
| 字数代码 | 128000 | 128000 | 128000 | 128000 | 128000 | 128000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 85 °C | 70 °C | 85 °C | 70 °C | 85 °C | 70 °C |
| 组织 | 128KX32 | 128KX32 | 128KX32 | 128KX32 | 128KX32 | 128KX32 |
| 封装主体材料 | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| 最小供电电压 (Vsup) | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
| 标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL |
| 端子形式 | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
| 端子位置 | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD |
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