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MAX502AENG-T

产品描述D/A Converter, 1 Func, Parallel, Word Input Loading, PDIP24, PLASTIC, DIP-24
产品类别模拟混合信号IC    转换器   
文件大小22KB,共4页
制造商Maxim(美信半导体)
官网地址https://www.maximintegrated.com/en.html
下载文档 详细参数 选型对比 全文预览

MAX502AENG-T概述

D/A Converter, 1 Func, Parallel, Word Input Loading, PDIP24, PLASTIC, DIP-24

MAX502AENG-T规格参数

参数名称属性值
是否无铅含铅
是否Rohs认证不符合
厂商名称Maxim(美信半导体)
零件包装代码DIP
包装说明DIP,
针数24
Reach Compliance Codecompliant
ECCN代码3A001.A.5.B
转换器类型D/A CONVERTER
输入位码BINARY, OFFSET BINARY
输入格式PARALLEL, WORD
JESD-30 代码R-PDIP-T24
JESD-609代码e0
长度31.75 mm
最大线性误差 (EL)0.0732%
标称负供电电压-15 V
位数12
功能数量1
端子数量24
最高工作温度85 °C
最低工作温度-40 °C
封装主体材料PLASTIC/EPOXY
封装代码DIP
封装形状RECTANGULAR
封装形式IN-LINE
峰值回流温度(摄氏度)NOT SPECIFIED
认证状态Not Qualified
座面最大高度5.08 mm
最大稳定时间5 µs
标称供电电压15 V
表面贴装NO
温度等级INDUSTRIAL
端子面层TIN LEAD
端子形式THROUGH-HOLE
端子节距2.54 mm
端子位置DUAL
处于峰值回流温度下的最长时间NOT SPECIFIED
宽度15.24 mm

文档预览

下载PDF文档
SCOPE:
VOLTAGE-OUTPUT, 12-BIT MULTIPLYING DACs
Generic Number
MAX502A(x)/883B
MAX502B(x)/883B
Device Type
01
02
12-Bit, 4 Quadrant, Voltage-Output
Multiplying Digital to Analog Converter
Case Outline(s).
The case outlines shall be designated in Mil-Std-1835 and as follows:
Outline Letter
MAXIM SMD
RG
L
Mil-Std-1835
GDIP1-T24 or CDIP2-T24
Case Outline
24 LEAD CERDIP
Package Code
J24
Absolute Maximum Ratings
V
DD
to DGND ..........................................................................................…………... -0.3V, +17V
V
SS
to DGND.............................................................................................………….. +0.3V, -17V
V
DD
to AGND ............................................................................................…………. -0.3V, +17V
V
OUT
to AGND 1/ ..........................................................................………....V
DD
+0.3V, V
SS
-0.3V
AGND to DGND .....................................................................................………….. -0.3V to V
DD
Digital Input Voltage to DGND ................................................................……….... -0.3V to V
DD
V
REF
to AGND .....................................................................................................…………..
±25V
RFBF to AGND ....................................................................................................………….
±25V
RA to AGND .......................................................................................................…………..
±25V
RB to AGND ........................................................................................................………….
±25V
RC to AGND ........................................................................................................………….
±25V
Lead Temperature (soldering, 10 seconds) ........................................................................…. +300°C
Storage Temperature ..........................................................................................….. -65°C to +150°C
Continuous Power Dissipation ..........................................................................……….... T
A
=+70°C
24 pin CERDIP(derate 12.5mW/°C above +70°C) ................................................……….. 1000mW
Junction Temperature T
J
.....................................................................................…………. +150°C
Thermal Resistance, Junction to Case,
ΘJC
24 pin CERDIP................................................................................................…………. 40°C/W
Thermal Resistance, Junction to Ambient,
ΘJA:
24 pin CERDIP................................................................................................…………. 80°C/W
Recommended Operating Conditions
Ambient Operating Range (T
A
) ...........................................................…………. -55°C to
+125°C
Positive Supply Voltage, (V
DD
) .........................................................………..... +11.4V to +15.75V
Negative Supply Voltage (V
SS
)...........................................................………….. -11.4V to -15.75V
NOTE 1: V
OUT
may be shorted to AGND, V
DD
, or V
SS
if the power dissipation of this package is not exceeded.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device.
These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
----------------------------
Electrical Characteristics of MAX502/883B
for /883B and SMD 5962-88767
19-0278
Page 2 of
Rev. E
6

MAX502AENG-T相似产品对比

MAX502AENG-T MAX502BMRG/883B MAX502ACNG-T MAX502BCNG-T MAX502BENG-T MAX502AMRG/883B
描述 D/A Converter, 1 Func, Parallel, Word Input Loading, PDIP24, PLASTIC, DIP-24 D/A Converter, 1 Func, Parallel, Word Input Loading, CDIP24, 0.300 INCH, CERDIP-24 D/A Converter, 1 Func, Parallel, Word Input Loading, PDIP24, PLASTIC, DIP-24 D/A Converter, 1 Func, Parallel, Word Input Loading, PDIP24, PLASTIC, DIP-24 D/A Converter, 1 Func, Parallel, Word Input Loading, PDIP24, PLASTIC, DIP-24 D/A Converter, 1 Func, Parallel, Word Input Loading, CDIP24, 0.300 INCH, CERDIP-24
是否无铅 含铅 含铅 含铅 含铅 含铅 含铅
是否Rohs认证 不符合 不符合 不符合 不符合 不符合 不符合
厂商名称 Maxim(美信半导体) Maxim(美信半导体) Maxim(美信半导体) Maxim(美信半导体) Maxim(美信半导体) Maxim(美信半导体)
零件包装代码 DIP DIP DIP DIP DIP DIP
包装说明 DIP, DIP, DIP, DIP, DIP, DIP,
针数 24 24 24 24 24 24
Reach Compliance Code compliant compliant compliant compliant compliant compliant
ECCN代码 3A001.A.5.B 3A001.A.2.C - 3A001.A.5.B 3A001.A.5.B 3A001.A.2.C
转换器类型 D/A CONVERTER D/A CONVERTER D/A CONVERTER D/A CONVERTER - D/A CONVERTER
输入位码 BINARY, OFFSET BINARY BINARY, OFFSET BINARY BINARY, OFFSET BINARY BINARY, OFFSET BINARY - BINARY, OFFSET BINARY
输入格式 PARALLEL, WORD PARALLEL, WORD PARALLEL, WORD PARALLEL, WORD - PARALLEL, WORD
JESD-30 代码 R-PDIP-T24 R-GDIP-T24 R-PDIP-T24 R-PDIP-T24 - R-GDIP-T24
JESD-609代码 e0 e0 e0 e0 - e0
长度 31.75 mm 31.75 mm 31.75 mm 31.75 mm - 31.75 mm
最大线性误差 (EL) 0.0732% 0.024% 0.0732% 0.0244% - 0.018%
标称负供电电压 -15 V -12 V -15 V -15 V - -12 V
位数 12 12 12 12 - 12
功能数量 1 1 1 1 - 1
端子数量 24 24 24 24 - 24
最高工作温度 85 °C 125 °C 70 °C 70 °C - 125 °C
封装主体材料 PLASTIC/EPOXY CERAMIC, GLASS-SEALED PLASTIC/EPOXY PLASTIC/EPOXY - CERAMIC, GLASS-SEALED
封装代码 DIP DIP DIP DIP - DIP
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR - RECTANGULAR
封装形式 IN-LINE IN-LINE IN-LINE IN-LINE - IN-LINE
峰值回流温度(摄氏度) NOT SPECIFIED 245 NOT SPECIFIED NOT SPECIFIED - 245
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified - Not Qualified
座面最大高度 5.08 mm 5.08 mm 5.08 mm 5.08 mm - 5.08 mm
标称供电电压 15 V 12 V 15 V 15 V - 12 V
表面贴装 NO NO NO NO - NO
温度等级 INDUSTRIAL MILITARY COMMERCIAL COMMERCIAL - MILITARY
端子面层 TIN LEAD TIN LEAD TIN LEAD TIN LEAD - TIN LEAD
端子形式 THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE - THROUGH-HOLE
端子节距 2.54 mm 2.54 mm 2.54 mm 2.54 mm - 2.54 mm
端子位置 DUAL DUAL DUAL DUAL - DUAL
处于峰值回流温度下的最长时间 NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED - NOT SPECIFIED
宽度 15.24 mm 7.62 mm 15.24 mm 15.24 mm - 7.62 mm

 
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