LS SERIES, 4-BIT MULTIPLIER, CDFP16
| 参数名称 | 属性值 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 包装说明 | DFP, |
| Reach Compliance Code | unknown |
| 其他特性 | 2\'S COMPLEMENT RECODE MULTIPLIER |
| 系列 | LS |
| JESD-30 代码 | R-GDFP-F16 |
| 长度 | 10.2 mm |
| 负载电容（CL） | 15 pF |
| 逻辑集成电路类型 | MULTIPLIER |
| 位数 | 4 |
| 功能数量 | 1 |
| 端子数量 | 16 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 封装主体材料 | CERAMIC, GLASS-SEALED |
| 封装代码 | DFP |
| 封装形状 | RECTANGULAR |
| 封装形式 | FLATPACK |
| 最大电源电流（ICC） | 38 mA |
| 传播延迟（tpd） | 37 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 2.03 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | TTL |
| 温度等级 | MILITARY |
| 端子形式 | FLAT |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 宽度 | 6.73 mm |
| SN54LS261W-10 | SN54LS261J-00 | SN54LS261W-00 | SNJ54LS261J-00 | SNJ54LS261W-10 | SNJ54LS261W-00 | |
|---|---|---|---|---|---|---|
| 描述 | LS SERIES, 4-BIT MULTIPLIER, CDFP16 | IC LS SERIES, 4-BIT MULTIPLIER, CDIP16, Arithmetic Circuit | LS SERIES, 4-BIT MULTIPLIER, CDFP16 | LS SERIES, 4-BIT MULTIPLIER, CDIP16 | LS SERIES, 4-BIT MULTIPLIER, CDFP16 | LS SERIES, 4-BIT MULTIPLIER, CDFP16 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
| 其他特性 | 2\'S COMPLEMENT RECODE MULTIPLIER | 2\'S COMPLEMENT RECODE MULTIPLIER | 2\'S COMPLEMENT RECODE MULTIPLIER | 2\'S COMPLEMENT RECODE MULTIPLIER | 2\'S COMPLEMENT RECODE MULTIPLIER | 2\'S COMPLEMENT RECODE MULTIPLIER |
| 系列 | LS | LS | LS | LS | LS | LS |
| JESD-30 代码 | R-GDFP-F16 | R-GDIP-T16 | R-GDFP-F16 | R-GDIP-T16 | R-GDFP-F16 | R-GDFP-F16 |
| 长度 | 10.2 mm | 19.56 mm | 10.2 mm | 19.56 mm | 10.2 mm | 10.2 mm |
| 负载电容（CL） | 15 pF | 15 pF | 15 pF | 15 pF | 15 pF | 15 pF |
| 逻辑集成电路类型 | MULTIPLIER | MULTIPLIER | MULTIPLIER | MULTIPLIER | MULTIPLIER | MULTIPLIER |
| 位数 | 4 | 4 | 4 | 4 | 4 | 4 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 16 | 16 | 16 | 16 | 16 | 16 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| 封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
| 封装代码 | DFP | DIP | DFP | DIP | DFP | DFP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | FLATPACK | IN-LINE | FLATPACK | IN-LINE | FLATPACK | FLATPACK |
| 最大电源电流（ICC） | 38 mA | 38 mA | 38 mA | 38 mA | 38 mA | 38 mA |
| 传播延迟（tpd） | 37 ns | 37 ns | 37 ns | 37 ns | 37 ns | 37 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 2.03 mm | 5.08 mm | 2.03 mm | 5.08 mm | 2.03 mm | 2.03 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | NO | YES | NO | YES | YES |
| 技术 | TTL | TTL | TTL | TTL | TTL | TTL |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子形式 | FLAT | THROUGH-HOLE | FLAT | THROUGH-HOLE | FLAT | FLAT |
| 端子节距 | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 宽度 | 6.73 mm | 7.62 mm | 6.73 mm | 7.62 mm | 6.73 mm | 6.73 mm |
| 厂商名称 | Texas Instruments(德州仪器) | - | Texas Instruments(德州仪器) | - | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
| 包装说明 | DFP, | DIP, | - | DIP, | DFP, | DFP, |
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