4-BIT, MROM, 0.08MHz, MICROCONTROLLER, UUC, DIE
参数名称 | 属性值 |
厂商名称 | Seiko Epson Corporation |
Objectid | 1503738751 |
零件包装代码 | DIE |
包装说明 | DIE, |
Reach Compliance Code | unknown |
compound_id | 11131851 |
具有ADC | NO |
其他特性 | OPERATES AT -3V SUPPLY |
地址总线宽度 | |
位大小 | 4 |
最大时钟频率 | 0.032 MHz |
DAC 通道 | NO |
DMA 通道 | NO |
外部数据总线宽度 | |
JESD-30 代码 | X-XUUC-N |
I/O 线路数量 | 12 |
最高工作温度 | 70 °C |
最低工作温度 | -20 °C |
PWM 通道 | NO |
封装主体材料 | UNSPECIFIED |
封装代码 | DIE |
封装形状 | UNSPECIFIED |
封装形式 | UNCASED CHIP |
认证状态 | Not Qualified |
ROM可编程性 | MROM |
速度 | 0.08 MHz |
最大供电电压 | 3.6 V |
最小供电电压 | 0.9 V |
标称供电电压 | 3 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | COMMERCIAL |
端子形式 | NO LEAD |
端子位置 | UPPER |
uPs/uCs/外围集成电路类型 | MICROCONTROLLER |
E0C6SB27D | E0C6S27F | E0C6S27D | E0C6SB27F | E0C6SA27F | E0C6SL27F | |
---|---|---|---|---|---|---|
描述 | 4-BIT, MROM, 0.08MHz, MICROCONTROLLER, UUC, DIE | 4-BIT, MROM, 0.08MHz, MICROCONTROLLER, PQFP60, PLASTIC, QFP6-60 | 4-BIT, MROM, 0.08MHz, MICROCONTROLLER, UUC, DIE | 4-BIT, MROM, 0.08MHz, MICROCONTROLLER, PQFP60, PLASTIC, QFP6-60 | 4-BIT, MROM, 0.26MHz, MICROCONTROLLER, PQFP60, PLASTIC, QFP6-60 | Microcontroller, 4-Bit, MROM, 0.032768MHz, CMOS, PQFP60, PLASTIC, QFP6-60 |
厂商名称 | Seiko Epson Corporation | Seiko Epson Corporation | Seiko Epson Corporation | Seiko Epson Corporation | Seiko Epson Corporation | Seiko Epson Corporation |
包装说明 | DIE, | QFP, | DIE, | QFP, | QFP, | QFP, |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
具有ADC | NO | NO | NO | NO | NO | NO |
其他特性 | OPERATES AT -3V SUPPLY | OPERATES AT -3V SUPPLY | OPERATES AT -3V SUPPLY | OPERATES AT -3V SUPPLY | OPERATES AT -3V SUPPLY | OPERATES AT -1.5V SUPPLY |
位大小 | 4 | 4 | 4 | 4 | 4 | 4 |
最大时钟频率 | 0.032 MHz | 0.032 MHz | 0.032 MHz | 0.032 MHz | 0.032 MHz | 0.032 MHz |
DAC 通道 | NO | NO | NO | NO | NO | NO |
DMA 通道 | NO | NO | NO | NO | NO | NO |
JESD-30 代码 | X-XUUC-N | S-PQFP-G60 | X-XUUC-N | S-PQFP-G60 | S-PQFP-G60 | S-PQFP-G60 |
I/O 线路数量 | 12 | 12 | 12 | 12 | 12 | 12 |
最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
最低工作温度 | -20 °C | -20 °C | -20 °C | -20 °C | -20 °C | -20 °C |
PWM 通道 | NO | NO | NO | NO | NO | NO |
封装主体材料 | UNSPECIFIED | PLASTIC/EPOXY | UNSPECIFIED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | DIE | QFP | DIE | QFP | QFP | QFP |
封装形状 | UNSPECIFIED | SQUARE | UNSPECIFIED | SQUARE | SQUARE | SQUARE |
封装形式 | UNCASED CHIP | FLATPACK | UNCASED CHIP | FLATPACK | FLATPACK | FLATPACK |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
ROM可编程性 | MROM | MROM | MROM | MROM | MROM | MROM |
速度 | 0.08 MHz | 0.08 MHz | 0.08 MHz | 0.08 MHz | 0.26 MHz | 0.032768 MHz |
最大供电电压 | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 1.8 V |
最小供电电压 | 0.9 V | 2.2 V | 2.2 V | 0.9 V | 2.2 V | 0.9 V |
标称供电电压 | 3 V | 3 V | 3 V | 3 V | 3 V | 1.5 V |
表面贴装 | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子形式 | NO LEAD | GULL WING | NO LEAD | GULL WING | GULL WING | GULL WING |
端子位置 | UPPER | QUAD | UPPER | QUAD | QUAD | QUAD |
uPs/uCs/外围集成电路类型 | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER |
零件包装代码 | DIE | QFP | DIE | QFP | QFP | - |
长度 | - | 14 mm | - | 14 mm | 14 mm | 14 mm |
端子数量 | - | 60 | - | 60 | 60 | 60 |
座面最大高度 | - | 3.1 mm | - | 3.1 mm | 3.1 mm | 3.1 mm |
端子节距 | - | 0.8 mm | - | 0.8 mm | 0.8 mm | 0.8 mm |
宽度 | - | 14 mm | - | 14 mm | 14 mm | 14 mm |
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