Multiplier Accumulator/Summer, Bipolar, CDIP64,
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | TRW Inc |
| 包装说明 | DIP, DIP64,.9 |
| Reach Compliance Code | unknown |
| JESD-30 代码 | R-XDIP-T64 |
| JESD-609代码 | e0 |
| 端子数量 | 64 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 封装主体材料 | CERAMIC |
| 封装代码 | DIP |
| 封装等效代码 | DIP64,.9 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 表面贴装 | NO |
| 技术 | BIPOLAR |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| uPs/uCs/外围集成电路类型 | DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER |
| TDC1009J1G | TDC1009J1C | TDC1009J1F | TDC1009C1F | TDC1009J | TDC1009J-M | TDC1009L1F | |
|---|---|---|---|---|---|---|---|
| 描述 | Multiplier Accumulator/Summer, Bipolar, CDIP64, | Multiplier Accumulator/Summer, Bipolar, CDIP64, | Multiplier Accumulator/Summer, Bipolar, CDIP64, | Multiplier Accumulator/Summer, Bipolar, CQCC68, | Multiplier Accumulator/Summer, Bipolar, CDIP64 | Multiplier Accumulator/Summer, Bipolar, CDIP64 | Multiplier Accumulator/Summer, Bipolar, CQFP68, |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | TRW Inc | TRW Inc | TRW Inc | TRW Inc | TRW Inc | TRW Inc | TRW Inc |
| 包装说明 | DIP, DIP64,.9 | DIP, DIP64,.9 | DIP, DIP64,.9 | QCCN, LCC68,.95SQ | DIP, DIP64,.9 | DIP, DIP64,.9 | QFF, QFL68,.95SQ |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknow | unknow | unknow |
| JESD-30 代码 | R-XDIP-T64 | R-XDIP-T64 | R-XDIP-T64 | S-XQCC-N68 | R-XDIP-T64 | R-XDIP-T64 | S-XQFP-F68 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 端子数量 | 64 | 64 | 64 | 68 | 64 | 64 | 68 |
| 最高工作温度 | 70 °C | 70 °C | 125 °C | 125 °C | 70 °C | 125 °C | 125 °C |
| 最低工作温度 | - | - | -55 °C | -55 °C | - | -55 °C | -55 °C |
| 封装主体材料 | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC |
| 封装代码 | DIP | DIP | DIP | QCCN | DIP | DIP | QFF |
| 封装等效代码 | DIP64,.9 | DIP64,.9 | DIP64,.9 | LCC68,.95SQ | DIP64,.9 | DIP64,.9 | QFL68,.95SQ |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | SQUARE |
| 封装形式 | IN-LINE | IN-LINE | IN-LINE | CHIP CARRIER | IN-LINE | IN-LINE | FLATPACK |
| 表面贴装 | NO | NO | NO | YES | NO | NO | YES |
| 技术 | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR |
| 温度等级 | COMMERCIAL | COMMERCIAL | MILITARY | MILITARY | COMMERCIAL | MILITARY | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | NO LEAD | THROUGH-HOLE | THROUGH-HOLE | FLAT |
| 端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | QUAD | DUAL | DUAL | QUAD |
| uPs/uCs/外围集成电路类型 | DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER | DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER | DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER | DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER | DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER | DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER | DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER |
| 认证状态 | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
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