Active Delay Line, 1-Func, 5-Tap, True Output, CMOS, LOW PROFILE, DIP-8
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Data Delay Devices |
| 零件包装代码 | DIP |
| 包装说明 | LOW PROFILE, DIP-8 |
| 针数 | 8 |
| Reach Compliance Code | compliant |
| 其他特性 | MEETS MIL-D-23859; TEMP. COEFF. SPECIFIED OVER 0 TO 70 DEG. CEL. |
| 系列 | HC/UH |
| JESD-30 代码 | R-XDIP-T8 |
| 逻辑集成电路类型 | ACTIVE DELAY LINE |
| 功能数量 | 1 |
| 抽头/阶步数 | 5 |
| 端子数量 | 8 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 输出极性 | TRUE |
| 封装主体材料 | UNSPECIFIED |
| 封装代码 | DIP |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 可编程延迟线 | NO |
| 认证状态 | Not Qualified |
| 座面最大高度 | 7.874 mm |
| 最大供电电压 (Vsup) | 5.25 V |
| 最小供电电压 (Vsup) | 4.75 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 总延迟标称（td） | 50 ns |
| 宽度 | 7.62 mm |
| DDU-8C-5050ME3 | DDU-8C-5060ME3 | DDU-8C-5075ME3 | DDU-8C-5100ME3 | DDU-8C-5125ME3 | DDU-8C-5200ME3 | DDU-8C-5250ME3 | DDU-8C-5175ME3 | DDU-8C-5150ME3 | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | Active Delay Line, 1-Func, 5-Tap, True Output, CMOS, LOW PROFILE, DIP-8 | Active Delay Line, 1-Func, 5-Tap, True Output, CMOS, LOW PROFILE, DIP-8 | Active Delay Line, 1-Func, 5-Tap, True Output, CMOS, LOW PROFILE, DIP-8 | Active Delay Line, 1-Func, 5-Tap, True Output, CMOS, LOW PROFILE, DIP-8 | Active Delay Line, 1-Func, 5-Tap, True Output, CMOS, LOW PROFILE, DIP-8 | Active Delay Line, 1-Func, 5-Tap, True Output, CMOS, LOW PROFILE, DIP-8 | Active Delay Line, 1-Func, 5-Tap, True Output, CMOS, LOW PROFILE, DIP-8 | Active Delay Line, 1-Func, 5-Tap, True Output, CMOS, LOW PROFILE, DIP-8 | Active Delay Line, 1-Func, 5-Tap, True Output, CMOS, LOW PROFILE, DIP-8 |
| 是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 零件包装代码 | DIP | DIP | DIP | DIP | DIP | DIP | DIP | DIP | DIP |
| 包装说明 | LOW PROFILE, DIP-8 | DIP, | DIP, | DIP, | DIP, | DIP, | DIP, | DIP, | LOW PROFILE, DIP-8 |
| 针数 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
| 其他特性 | MEETS MIL-D-23859; TEMP. COEFF. SPECIFIED OVER 0 TO 70 DEG. CEL. | MEETS MIL-D-23859; TEMP. COEFF. SPECIFIED OVER 0 TO 70 DEG. CEL. | MEETS MIL-D-23859; TEMP. COEFF. SPECIFIED OVER 0 TO 70 DEG. CEL. | MEETS MIL-D-23859; TEMP. COEFF. SPECIFIED OVER 0 TO 70 DEG. CEL. | MEETS MIL-D-23859; TEMP. COEFF. SPECIFIED OVER 0 TO 70 DEG. CEL. | MEETS MIL-D-23859; TEMP. COEFF. SPECIFIED OVER 0 TO 70 DEG. CEL. | MEETS MIL-D-23859; TEMP. COEFF. SPECIFIED OVER 0 TO 70 DEG. CEL. | MEETS MIL-D-23859; TEMP. COEFF. SPECIFIED OVER 0 TO 70 DEG. CEL. | MEETS MIL-D-23859; TEMP. COEFF. SPECIFIED OVER 0 TO 70 DEG. CEL. |
| 系列 | HC/UH | HC/UH | HC/UH | HC/UH | HC/UH | HC/UH | HC/UH | HC/UH | HC/UH |
| JESD-30 代码 | R-XDIP-T8 | R-XDIP-T8 | R-XDIP-T8 | R-XDIP-T8 | R-XDIP-T8 | R-XDIP-T8 | R-XDIP-T8 | R-XDIP-T8 | R-XDIP-T8 |
| 逻辑集成电路类型 | ACTIVE DELAY LINE | ACTIVE DELAY LINE | ACTIVE DELAY LINE | ACTIVE DELAY LINE | ACTIVE DELAY LINE | ACTIVE DELAY LINE | ACTIVE DELAY LINE | ACTIVE DELAY LINE | ACTIVE DELAY LINE |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 抽头/阶步数 | 5 | 5 | 5 | 5 | 5 | 5 | 5 | 5 | 5 |
| 端子数量 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| 输出极性 | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE |
| 封装主体材料 | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
| 封装代码 | DIP | DIP | DIP | DIP | DIP | DIP | DIP | DIP | DIP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 可编程延迟线 | NO | NO | NO | NO | NO | NO | NO | NO | NO |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 7.874 mm | 7.874 mm | 7.874 mm | 7.874 mm | 7.874 mm | 7.874 mm | 7.874 mm | 7.874 mm | 7.874 mm |
| 最大供电电压 (Vsup) | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V |
| 最小供电电压 (Vsup) | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | NO | NO | NO | NO | NO | NO | NO | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 总延迟标称（td） | 50 ns | 60 ns | 75 ns | 100 ns | 125 ns | 200 ns | 250 ns | 175 ns | 150 ns |
| 宽度 | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm |
| 厂商名称 | Data Delay Devices | Data Delay Devices | Data Delay Devices | Data Delay Devices | Data Delay Devices | Data Delay Devices | Data Delay Devices | - | Data Delay Devices |
| Is Samacsys | - | N | N | N | N | N | N | - | - |
| Base Number Matches | - | 1 | 1 | 1 | 1 | 1 | 1 | 1 | - |
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