Datasheet> 器件分类 > 模拟混合信号IC> 驱动程序和接口> HIP6602BCRZA-T

HIP6602BCRZA-T: 产品描述Dual Channel Synchronous Rectified Buck MOSFET Driver; QFN16, SOIC14; Temp Range: 0° to 70°; 产品类别模拟混合信号IC 驱动程序和接口; 文件大小608KB，共12页; 制造商Renesas(瑞萨电子); 官网地址https://www.renesas.com/; 标准

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HIP6602BCRZA-T概述

Dual Channel Synchronous Rectified Buck MOSFET Driver; QFN16, SOIC14; Temp Range: 0° to 70°

HIP6602BCRZA-T规格参数

参数名称	属性值
Brand Name	Intersil
是否Rohs认证	符合
厂商名称	Renesas(瑞萨电子)
零件包装代码	QFN, SOIC
包装说明	HVQCCN, LCC16,.20SQ,32
针数	16, 14
Reach Compliance Code	compliant
ECCN代码	EAR99
高边驱动器	YES
接口集成电路类型	HALF BRIDGE BASED MOSFET DRIVER
JESD-30 代码	S-PQCC-N16
JESD-609代码	e3
长度	5 mm
湿度敏感等级	3
功能数量	2
端子数量	16
最高工作温度	85 °C
最低工作温度
标称输出峰值电流	0.73 A
封装主体材料	PLASTIC/EPOXY
封装代码	HVQCCN
封装等效代码	LCC16,.20SQ,32
封装形状	SQUARE
封装形式	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
峰值回流温度（摄氏度）	260
电源	5/12,12 V
认证状态	Not Qualified
座面最大高度	1 mm
最大供电电压	13.2 V
最小供电电压	10.8 V
标称供电电压	12 V
电源电压1-最大	12 V
电源电压1-分钟	5 V
表面贴装	YES
温度等级	OTHER
端子面层	Matte Tin (Sn) - annealed
端子形式	NO LEAD
端子节距	0.8 mm
端子位置	QUAD
处于峰值回流温度下的最长时间	40
宽度	5 mm

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HIP6602B

NOT RECOMMENDED FOR NEW DESIGNS

INTERSIL RECOMMENDS:

ISL6612, ISL6612A, ISL6613, ISL6613A,

ISL6614, ISL6614A, ISL6622, ISL6625A

DATASHEET

FN9076

Rev 6.00

December 3, 2015

Dual Channel Synchronous Rectified Buck MOSFET Driver

The HIP6602B is a high frequency, two power channel

MOSFET driver specifically designed to drive four power

N-Channel MOSFETs in a synchronous rectified buck

converter topology. This device is available in either a

14-lead SOIC or a 16-lead QFN package with a PAD to

thermally enhance the package. These drivers combined

with a HIP63xx or ISL65xx series of Multi-Phase Buck PWM

controllers and MOSFETs form a complete core voltage

regulator solution for advanced microprocessors.

The HIP6602B drives both upper and lower gates over a

range of 5V to 12V. This drive-voltage flexibility provides the

advantage of optimizing applications involving trade-offs

between switching losses and conduction losses.

The output drivers in the HIP6602B have the capacity to

efficiently switch power MOSFETs at high frequencies. Each

driver is capable of driving a 3000pF load with a 30ns

propagation delay and 50ns transition time. This device

implements bootstrapping on the upper gates with a single

external capacitor and resistor required for each power

channel. This reduces implementation complexity and allows

the use of higher performance, cost effective, N-Channel

MOSFETs. Adaptive shoot-through protection is integrated

to prevent both MOSFETs from conducting simultaneously.

Features

• Drives Four N-Channel MOSFETs

• Adaptive Shoot-Through Protection

• Internal Bootstrap Devices

• Supports High Switching Frequency

- Fast Output Rise Time

- Propagation Delay 30ns

• Small 14-Lead SOIC Package

• Smaller 16-Lead QFN Thermally Enhanced Package

• 5V to 12V Gate-Drive Voltages for Optimal Efficiency

• Three-State Input for Bridge Shutdown

• Supply Undervoltage Protection

• Pb-Free Plus Anneal Available (RoHS Compliant)

• QFN Package:

- Compliant to JEDEC PUB95 MO-220

QFN - Quad Flat No Leads - Package Outline

- Near Chip Scale Package footprint, which improves

PCB efficiency and has a thinner profile

Ordering Information

PART NUMBER

HIP6602BCB

HIP6602BCB-T

HIP6602BCBZ (Note 1)

HIP6602BCBZ-T (Note 1)

HIP6602BCR

HIP6602BCR-T

HIP6602BCRZ (Note 1)

HIP6602BCRZ-T (Note 1)

HIP6602BCRZA (Note 1)

TEMP.

RANGE (°C)

0 to 85

PACKAGE

14 Ld SOIC

PKG.

DWG. #

M14.15

Applications

• Core Voltage Supplies for Intel Pentium® III and AMD®

Athlon

Microprocessors.

• High-Frequency, Low-Profile DC/DC Converters

• High-Current, Low-Voltage DC/DC Converters

14 Ld SOIC Tape and Reel

0 to 85

14 Ld SOIC

(Pb-Free)

M14.15

14 Ld SOIC Tape and Reel (Pb-Free)

0 to 85

16 Ld 5x5 QFN

L16.5x5

16 Ld 5x5 QFN Tape and Reel

0 to 85

16 Ld 5x5 QFN

(Pb-Free)

L16.5x5

16 Ld 5x5 QFN Tape and Reel (Pb-Free)

0 to 85

16 Ld 5x5 QFN

(Pb-Free)

L16.5x5

HIP6602BCRZA-T (Note 1) 16 Ld 5x5 QFN Tape and Reel (Pb-Free)

NOTE:

1. Intersil Pb-free plus anneal products employ special Pb-free

material sets; molding compounds/die attach materials and 100%

matte tin plate termination finish, which are RoHS compliant and

compatible with both SnPb and Pb-free soldering operations.

Intersil Pb-free products are MSL classified at Pb-free peak reflow

temperatures that meet or exceed the Pb-free requirements of

IPC/JEDEC J STD-020.

FN9076 Rev 6.00

December 3, 2015

Page 1 of 12

HIP6602BCRZA-T相似产品对比

	HIP6602BCRZA-T	HIP6602BCBZ-T	HIP6602BCBZ	HIP6602BCB	HIP6602BCB-T	HIP6602BCR	HIP6602BCR-T
描述	Dual Channel Synchronous Rectified Buck MOSFET Driver; QFN16, SOIC14; Temp Range: 0° to 70°	Dual Channel Synchronous Rectified Buck MOSFET Driver; QFN16, SOIC14; Temp Range: 0° to 70°	Dual Channel Synchronous Rectified Buck MOSFET Driver; QFN16, SOIC14; Temp Range: 0° to 70°	0.73A 2 CHANNEL, HALF BRDG BASED MOSFET DRIVER, PDSO14, PLASTIC, MS-012AB, SOIC-14	0.73A 2 CHANNEL, HALF BRDG BASED MOSFET DRIVER, PDSO14, PLASTIC, MS-012AB, SOIC-14	0.73A 2 CHANNEL, HALF BRDG BASED MOSFET DRIVER, PQCC16, 5 X 5 MM, PLASTIC, MO-220VHHB, QFN-16	0.73A 2 CHANNEL, HALF BRDG BASED MOSFET DRIVER, PQCC16, 5 X 5 MM, PLASTIC, MO-220VHHB, QFN-16
是否Rohs认证	符合	符合	符合	不符合	不符合	不符合	不符合
厂商名称	Renesas(瑞萨电子)	Renesas(瑞萨电子)	Renesas(瑞萨电子)	Renesas(瑞萨电子)	Renesas(瑞萨电子)	Renesas(瑞萨电子)	Renesas(瑞萨电子)
零件包装代码	QFN, SOIC	QFN, SOIC	QFN, SOIC	SOIC	SOIC	QFN	QFN
包装说明	HVQCCN, LCC16,.20SQ,32	SOP, SOP14,.25	SOP, SOP14,.25	PLASTIC, MS-012AB, SOIC-14	PLASTIC, MS-012AB, SOIC-14	HVQCCN, LCC16,.2SQ,32	HVQCCN, LCC16,.2SQ,32
针数	16, 14	16, 14	16, 14	14	14	16	16
Reach Compliance Code	compliant	compliant	compliant	not_compliant	not_compliant	_compli	_compli
ECCN代码	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
高边驱动器	YES	YES	YES	YES	YES	YES	YES
接口集成电路类型	HALF BRIDGE BASED MOSFET DRIVER	HALF BRIDGE BASED MOSFET DRIVER	HALF BRIDGE BASED MOSFET DRIVER	HALF BRIDGE BASED MOSFET DRIVER	HALF BRIDGE BASED MOSFET DRIVER	HALF BRIDGE BASED MOSFET DRIVER	HALF BRIDGE BASED MOSFET DRIVER
JESD-30 代码	S-PQCC-N16	R-PDSO-G14	R-PDSO-G14	R-PDSO-G14	R-PDSO-G14	S-PQCC-N16	S-PQCC-N16
JESD-609代码	e3	e3	e3	e0	e0	e0	e0
长度	5 mm	8.65 mm	8.65 mm	8.65 mm	8.65 mm	5 mm	5 mm
湿度敏感等级	3	3	3	1	1	1	1
功能数量	2	2	2	2	2	2	2
端子数量	16	14	14	14	14	16	16
最高工作温度	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C
标称输出峰值电流	0.73 A	0.73 A	0.73 A	0.73 A	0.73 A	0.73 A	0.73 A
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	HVQCCN	SOP	SOP	SOP	SOP	HVQCCN	HVQCCN
封装等效代码	LCC16,.20SQ,32	SOP14,.25	SOP14,.25	SOP14,.25	SOP14,.25	LCC16,.2SQ,32	LCC16,.2SQ,32
封装形状	SQUARE	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	SQUARE	SQUARE
封装形式	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
峰值回流温度（摄氏度）	260	260	260	240	240	240	240
电源	5/12,12 V	5/12,12 V	5/12,12 V	5/12,12 V	5/12,12 V	5/12,12 V	5/12,12 V
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
座面最大高度	1 mm	1.75 mm	1.75 mm	1.75 mm	1.75 mm	1 mm	1 mm
最大供电电压	13.2 V	13.2 V	13.2 V	13.2 V	13.2 V	13.2 V	13.2 V
最小供电电压	10.8 V	10.8 V	10.8 V	10.8 V	10.8 V	10.8 V	10.8 V
标称供电电压	12 V	12 V	12 V	12 V	12 V	12 V	12 V
电源电压1-最大	12 V	12 V	12 V	12 V	12 V	12 V	12 V
电源电压1-分钟	5 V	5 V	5 V	5 V	5 V	5 V	5 V
表面贴装	YES	YES	YES	YES	YES	YES	YES
温度等级	OTHER	OTHER	OTHER	OTHER	OTHER	OTHER	OTHER
端子面层	Matte Tin (Sn) - annealed	Matte Tin (Sn) - annealed	Matte Tin (Sn) - annealed	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
端子形式	NO LEAD	GULL WING	GULL WING	GULL WING	GULL WING	NO LEAD	NO LEAD
端子节距	0.8 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	0.8 mm	0.8 mm
端子位置	QUAD	DUAL	DUAL	DUAL	DUAL	QUAD	QUAD
处于峰值回流温度下的最长时间	40	40	30	30	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
宽度	5 mm	3.9 mm	3.9 mm	3.9 mm	3.9 mm	5 mm	5 mm

HIP6602BCRZA-T

HIP6602BCRZA-T在线购买

HIP6602BCRZA-T概述

HIP6602BCRZA-T规格参数

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HIP6602BCRZA-T相似产品对比

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